TWI346995B - Semiconductor device and method for producing the same - Google Patents
Semiconductor device and method for producing the sameInfo
- Publication number
- TWI346995B TWI346995B TW094102258A TW94102258A TWI346995B TW I346995 B TWI346995 B TW I346995B TW 094102258 A TW094102258 A TW 094102258A TW 94102258 A TW94102258 A TW 94102258A TW I346995 B TWI346995 B TW I346995B
- Authority
- TW
- Taiwan
- Prior art keywords
- producing
- same
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
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JP2004040408A JP4307284B2 (ja) | 2004-02-17 | 2004-02-17 | 半導体装置の製造方法 |
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TWI346995B true TWI346995B (en) | 2011-08-11 |
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US (1) | US8278213B2 (zh) |
EP (1) | EP1564807B1 (zh) |
JP (1) | JP4307284B2 (zh) |
KR (1) | KR100671921B1 (zh) |
CN (1) | CN100385621C (zh) |
TW (1) | TWI346995B (zh) |
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CN104465581A (zh) * | 2014-11-23 | 2015-03-25 | 北京工业大学 | 一种低成本高可靠性芯片尺寸cis封装 |
KR101637186B1 (ko) * | 2014-11-24 | 2016-07-07 | 주식회사 에스에프에이반도체 | 관통 실리콘 비아 웨이퍼의 집적회로 분단 방법 |
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JP4401330B2 (ja) | 2002-04-23 | 2010-01-20 | 三洋電機株式会社 | 半導体装置及びその製造方法 |
TWI229435B (en) | 2002-06-18 | 2005-03-11 | Sanyo Electric Co | Manufacture of semiconductor device |
TWI227050B (en) * | 2002-10-11 | 2005-01-21 | Sanyo Electric Co | Semiconductor device and method for manufacturing the same |
JP4130158B2 (ja) * | 2003-06-09 | 2008-08-06 | 三洋電機株式会社 | 半導体装置の製造方法、半導体装置 |
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CN100385621C (zh) | 2008-04-30 |
US20050194670A1 (en) | 2005-09-08 |
JP4307284B2 (ja) | 2009-08-05 |
TW200531228A (en) | 2005-09-16 |
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