TWI345178B - Method for efficiently producing removable peripheral cards - Google Patents

Method for efficiently producing removable peripheral cards Download PDF

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Publication number
TWI345178B
TWI345178B TW093117976A TW93117976A TWI345178B TW I345178 B TWI345178 B TW I345178B TW 093117976 A TW093117976 A TW 093117976A TW 93117976 A TW93117976 A TW 93117976A TW I345178 B TWI345178 B TW I345178B
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TW
Taiwan
Prior art keywords
entities
integrated circuit
die
memory
singulation
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Application number
TW093117976A
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English (en)
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TW200508980A (en
Inventor
Hem P Takiar
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Sandisk Corp
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Publication of TW200508980A publication Critical patent/TW200508980A/zh
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Publication of TWI345178B publication Critical patent/TWI345178B/zh

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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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Description

1345178 九、發明說明： 【發明所屬之技術領域】 本發明係關於積體電路產品，且更特定言之，係關於包 含一或多個積體電路的可移除式周邊卡。 【先前技術】
由於記憶體積體電路（ic)封裝趨於較小化且其記憶體密 度趨於繼續增大’因此需要在封裝積體電路技術中取得進 步。最近取得之進步包括，在單1C封裝内堆疊多重IC晶 粒。此内部封裝堆疊包括在較大晶粒上堆疊較小晶粒。每 一晶粒皆為黏結至基板上之導線。舉例而言，此類型之堆 疊已用於相同功能之晶粒（例如，兩快閃記憶體晶粒）或不 同功能之晶粒（例如，一快閃記憶體晶粒與一 SRAM晶 粒）。另外，對於堆疊式晶片級封裝（stacked Chip Scale Package^堆疊式CSP)及堆疊式薄型小尺寸封裝（stacked Thin SmaU OutHne Package)(TS〇p)，已實現 了兩或三個晶 粒的堆疊。
記憶體卡通常用作供不同產品（例如，電子產品）使用 儲存數位資料。逐漸指派此等記憶體卡以儲存越來越多 資料。記憶體卡通常提供非揮發性資料儲存，且由於其 使在關閉電源後亦可保持資料，因此此記憶體 且有用。記憶體卡之實例為使用快閃型或電子可擦可程 唯讀記憶體（EEPROM)型記憶體單元㈣存資㈣ 憶修ash card)。快閃記憶卡具有相對小的外形尺寸： 於諸如相機、電腦(掌上型、筆記型及臺式電腦)、視訊 94091 1345178 接器 '掌上型或其它小型音訊播放器/記錄器（例如，刪 裝置）及醫療監視器。快閃記憶卡之主要供應商為加拿大
Sunnyvale的 SanDisk C〇rporation。 不幸地是，具有相對小之外形尺寸之高密度記憶體卡的 製造非常複雜。一複雜性在於記憶體卡之最終外形尺寸並 不規則’意即，其並非矩形。不規則之外形尺寸可用於各 種目的，例如’限制其在特^方向上與連接器或淳的連 接’提供位置參考或鎖定位置等。然而，積體電路組合通 常具有規則的（即矩形的）形狀，且亦必須受到保護以不受 使用者的影響。因此記憶體卡通常具有藉由在積體電路組 合之規則形狀周圍之蓋子、框架或外部封裝而界定之規則 的外形尺寸。蓋子、框架或外部封裝通常由塑膠製成。不 規則外I尺寸的另一問題在於在積體電路組合周圍組裝蓋 子、框架或外部封裝並非使用半導體製造方法且因此必須 在獨立生產線中在可能不同之製造用設施中完成。 因此’需要改良具有小外形尺寸之記憶體卡的製造方 法0 【發明内容】 一般而言，本發明係關於生產積體電路產品的改良技 術°该等改良技術使生產更小且成本更低之積體電路產品 成為可此。本發明之一態樣在於一次生產整批積體電路產 ’且將整批產品單一化成個別積體電路產品之操作使用 非線性（例如’非矩形或曲線）鋸切或切割動作使得所得之 個別積體電路封裝再不必完全為矩形。本發明之另一態樣 加工而生產，使得可視 在於積體電路產品可以半導體組裂 情況而選擇提供外部封裝或殼。 積體電路產品係關 可移除式周邊卡或其 卡被稱作記憶體卡。 基於積體電路之產品 埠或連接器令或被在 電子裝置包括電腦 (PDA) 〇 於藉由使用半導體組裝技術而形成之 匕可移除式媒體。一類可移除式周邊 記憶體卡通常為提供資料儲存之小且 。此等記憶體卡插入在電子裝置上之 電子裝置上之埠或連接器接收，該等 、相機、行動電話及個人數位助理 本發明能夠以多種方式實施’包括作為系統、儀器、裝 置或方法。將在下文論述本發明的若干實施例。 作為同時生產複數個積體電路產品之方法，本發明之一 具體實施例包括至少下列動作：提供多實體引線框或具有 複數個實體之基板；將一或多個晶粒附著至在多實體引線 框或基板之至少一側上之每—實體；將一或多個晶粒各電 連接至引線框或基板之各自實體；以模製化合物（m〇lding compound)將在多實體引線框或基板之至少一側上的複數 個實體密封在一起；及藉由使用至少非線性成形而將每一 複數個貫體單一化’進而形成積體電路產品。 作為藉由操作而在批量生產中生產之積體電路，其中該 等操作根據一實施例包括下列動作：提供具有複數個實體 之多貫體引線框或基板；將一或多個晶粒附著至在多實體 引線框或基板之至少一側上之每一實體；將一或多個晶粒 各電連接至引線框或基板之各自實體；以模製化合物將在 1345178 多實體引線框或基板之至少一側上的複數個實體密封在一 起及藉由使用至少非線性成形而將每一複數個實體單一 化’藉此由操作所生產之複數個實體之一為積體電路產 (¾ 〇 作為同時形成複數個記憶體卡之方法，每一記憶體卡包 括至少s己憶體晶粒及控制器晶粒’本發明之一實施例包括 至少下列動作：提供具有複數個實體之多實體引線框；將 多實體引線框附著於可移除帶上；將晶粒附著材料置放於 多實體引線框之每一實體之一部分上；經由對應於每一實 體之晶粒附著材料將記憶體晶粒附著至每一實體；對於每 實體固定控制器晶粒；將每一記憶體晶粒及控制器晶粒 電連接至多貫體引線框之各自實體；此後，以模製化合物 將實體密封在一起；及隨後藉由使用至少非線性成形區分 每一實體。 作為同時形成複數個記憶體卡之方法，每一記憶體卡包 括至少記憶體晶粒及控制器晶粒，本發明之一實施例包括 至少下列動作：提供具有複數個實體之多實體之印刷電路 板；對於每一實體，附著記憶體晶粒；對於每一實體，固 =控制器晶粒；將每一記憶體晶粒及控制器晶粒電連接至 多實體印刷電路板之各自實體；此後，以模製化合物將實 體密封在一起；及隨後藉由使用至少非矩形成形而將每一 實體單一化。 ;在下文、、合隨附圖示洋細彳田述本發明之其它態樣及優 點’其將藉由實例來說明本發明之原理。 1345178 【實施方式】 本發明係關於生產積體電路產品的改良技術。該等改戸 技術使生產更小且成本更低之積體電路產品成 β J月b。本 發明之一態樣在於一次生產整批積體電路產品，且將整批 產品單一化成個別積體電路產品之操作使用非線性㈠列 如，非矩形或曲線）鋸切或切割動作，使得所得之個別積 體電路封裝不必完全為矩形。本發明之另一態樣在於積體 電路產品可以由半導體組裝加工而生產，使得對提供外部 封裝或包裝物的需要變得可有可無。 積體電路產品能夠藉由使用半導體組裝技術而形成。積 體電路產品亦可具有減小的外形尺寸。減小的外形尺寸能 夠與晶片級封裝類似。另外，能夠以半導體製造之半導2 組裝水準而界定外形尺寸。 積體電路產品可關於可移除式周邊卡。可移除式周邊卡 能夠用於許多應用且執行許多不同的功能。一類可移除式 周邊卡被稱作記憶體卡。記憶體卡通常為提供資料儲存之 小且基於積體電路的產品。此等記憶體卡插入在電子裝置 上之埠或連接器中或被在電子裝置上之埠或連接器接收， 該等電子裝置包括電腦、相機、行動電話及PDA。記憶體 卡可為非揮發性記憶體卡。記憶體卡可包含堆疊在基板或 引線框之一或兩側的多積體電路晶片。 將在下文參看圖1A-5B來論述本發明之此態樣之實施 例。然彼等熟f此項技術者將容易瞭解，當本發明2 展出此等有限實施例之範圍時，此處參看此等圖示給出之 94091 1345178 詳細描述將用於達成說明之目的。 圖1A為所製造之半導體產品的平面圖。所製造之半導體 產品的基底為多實體基板100。多實體基板100具有用於密 封提供於積體電路產品之每一複數個實體i 04處之電路（即 半導體晶粒）的模製化合物102。積體電路產品之實體1 〇4 標示為 104-1 ' 104-2、104-3、104-4......l〇4-n。每一實體 104表示積體電路產品。換言之，所製造之半導體產品具 有積體電路產品陣列。因此，當對多實體基板1〇〇加以加 工以在其上形成實體104時，積體電路產品能夠以整批模 式來製造。 圖1B為自在圖1A中說明之參考線a-A'截取之所製造之 半導體產品的棱截面圖。在圖中，每一實體104-1、 104-2及104-3分別包括第一半導體晶粒1〇6_ι、ι〇6·2及 106-3。積體電路晶粒1〇6安裝於多實體基板上。在一 貫施例中’多貫體基板1 〇〇表示或對應於印刷電路板 (Printed Circuit Board)(PCB)。另外，每一實體⑺斗“、 104-2及104_3可分別包括第二半導體晶粒1〇8_ι、ι〇8_2及 108-3。如圖1B所示，第二半導體晶粒1〇8可堆疊於第一半 導體晶粒106上。第一半導體晶粒1〇6可分別直接安袭於多 實體基板100之實體104上或經由晶粒附著或黏合材料附著 至多實體基板100之實體104上。第二半導體晶粒1〇8可分 別直接女農（即堆豐）於第一半導體晶粒1 〇 6上或經由晶粒附 著材料或黏合材料附著至第一半導體晶粒1 〇6上。另外， 在一實施例中，半導體晶粒1〇6及1〇8可藉由導線接合件 94091 •10· 1345178 Π0分別電連接至多實體基板loo之實體i〇4。舉例而言， 半導體晶粒106-1及108-1可藉由導線接合件110-1電連接至 多實體基板100之實體104。 因此’在製造期間，藉由多實體基板100之使用及其上 複數個積體電路產品之實體的構成，積體電路產品能夠以 整批模式生產，即並行生產。然而，當模製化合物1〇2置 放於各種實體104上方以將其密封時，模製化合物1〇2形成 了覆蓋關於多實體基板1〇〇之所有實體1〇4之整體結構。此 後’積體電路產品之各種實體104必須自整體結構個別化 或單一化。對於此’將所製造之半導體產品鋸切或切割成 其多實體。根據本發明之一態樣，積體電路產品之形狀不 完全為矩形，且因此所製造之積體電路產品單一化成個別 實體執行了非線性（例如非矩形或曲線）鑛切。此鑛切能夠 以非常薄之鋸切寬度而有效地執行且具有高精度及細節部 分’使得鋸切動作非常精密。 圖2Α及2Β說明了可根據本發明而生產之積體電路產品 的代表性形狀。在圖2Α中，描述了積體電路產品2〇〇，其 外4形狀之一部分具有曲線區域202。因此，當多實體自 有夕實體基板及整體模製化合物之所製造的半導體產品 單一化時，鋸切動作需要能夠有效地鋸切所製造的半導體 產品，以生產積體電路產品200。在此實例中，鋸切動作 使用了線性切割及非線性切割的組合。線性（矩形）切割容 易達成，但是對於曲線區域2〇2的非線性（曲線）切割需要將 在下文更詳細論述之複雜的鋸切動作。 94091 1345178 圖2B為具有非線性區域222之積體電路產品220的俯視 圖。積體電路產品220通常類似於在圖2A中說明的積體電 路產品200 °然而，積體電路產品220的曲線區域222具有 由斜面分隔的兩個小圓形區域，但是，在圖2A中線性區域 202為沒有斜面部分（例如s形曲線）的兩個圓形區域。甚至 於在圖2 B中所示之兩個小圓形區域藉由交叉線性切割而為 銳角的情況下，線性區域2〇2能被分類為非矩形區域。
圖2C為根據本發明之另一實施例之積體電路產品之”的 俯視圖。積體電路產品25〇包括一曲線區域252，其類似於 在圖2Β_說明之積體電路產品22〇的曲線區域222。另外， 積體電路產品250包括-凹口 254。凹σ 254為相對小的細 節部分，其由鋸切動作而獲得。凹口 254能夠作為用於積 體電路產品250之參考點或鎖扣（例如閉鎖鎖扣）區域，該凹 口 254可在當積體電路產品25〇插入連接器或插入用於接收
其之接收器時使用。凹口 254的小尺寸要求精確的鑛切動 作，以能夠生產滿足如此小之特徵的產品。 因此，鋸切動作能夠生產在其外部本體或外形尺寸中具 有彎曲部分或小特徵的積體電路產品。通常，由於至少一 部分為-曲的，或多面為非矩形，因此所得之積體電：產 品為非矩形的。生產此積體電路產品的操作將在下文進一 步描述。 圖3為根據本發明之一實施例之整批積體 包崎座σσ加工 300之k程圖。整批積體電路產品工 ± ^ 用M生產複數個 積體電路產品。舉例而言，待生產 產之積體電路產品可為在 94091 •12· 1345178 圖2A-2C中說明的積體電路產品。 整批積體電路產品加工300首先提供302多實體引線框或 基板。引線框或基板用以為能夠同時形成於引線框或基板 上之每一複數個多實體來支撐積體電路產品之裝置或組 件。對於引線框，引線框通常為導電金屬，例如銅。對於 基板’基板通常為印刷電路板（PCB)。舉例而言，對於基 板，多實體基板可為在圖1Α中說明之多實體基板1〇〇。 接著，若需要，則可將一或多個被動組件附著3〇4至多 實體引線框或基板之每一實體。在此，若待生產之積體電 路產品將包括一或多個被動組件，則此被動組件可附著 304至每一實體。被動組件之實例包括電容器及電阻器。 另外將或多個晶粒（積體電路晶粒）或積體電路晶片附 著306至多實體引線框或基板之每一實體。對於每一實 體，一或多個晶粒將附著至對應於該實體之引線框或基板 上的區域内。一或多個晶粒可直接附著至引線框或基板或 可藉由晶粒附著材料或其它中間物附著至引線框或基板。 另外，在-實施例中，#詩實體之多晶粒待附著至對應 “亥實體之引線框或基板之區域内，則然後可將晶粒以堆 方式（阳粒堆疊於另一晶粒上）附著。堆疊於較低晶粒 上之晶粒能夠直接附著至較低晶粒或能夠藉由晶粒附著材 料或其它中間物附著至較低的晶粒。 在一或多個晶粒附著3〇6至每一實體後，每一實體之一 或多個晶粒可各電連接3〇8至引線框或基板之對應部分。 在—實施财，此等電連接可提供於導線接合塾、晶粒之 94091 1345178 引線或終端與該引線框或基板之間。藉由導線接合，對於 每一電連接而言小且薄的導線自晶粒延伸至引線框或基板 且藉由焊接而固定於合適的位置。 此後，能夠以模製化合物將多實體密封在一起31〇。模 製化合物形成為包圍在引線框或基板之每一實體周圍之整 體密封。所得之密封亦可被稱作模製面板。模製化合物可 - 以各種方式應用，包括傳遞模製（transfer m〇lding)或泛模 製（flood molding)技術。 另外，若需要，則可將標記塗覆312至模製化合物。舉鲁 例而5，標記可具有印刷在對於每一實體之模製化合物之 表面上的標識或其它資訊。標記能夠（例如）表示製造商、 商標及/或裝置類型。 最後，每一實體此後皆可使用至少非矩形成形而單一化 314。在此，雖然單一化314可包括矩形成形，但是對於每 —實體之至少一部分，每一實體的成形使用了非矩形成 形。此複雜成形可藉由使用鋸切裝置而達成。鋸切裝置應 籲 具有小的切割寬度且能夠成形小的細節部分。 鋸切裝置之實例包括（例如）水喷射切割（water jet cutting)、雷射切割、水導引雷射切割、乾媒體切割 media cutting)及菱形塗覆導線。已知其具有較小的切割寬 度（例如50微米）、其能夠成形小的特徵且其具有快速的切 · 割速率，所以水噴射切割可為較佳的切割裝置。水亦能夠 . 與雷射切割共同使用以幫助補充或聚集其效果。在單一化 3 14後’整批積體電路產品加工3〇〇完成且結束。 94091 14 1345178 雖然在圖3中未展示，但是整批積體電路產品加工3〇〇可 另外包括例如可在特定實施例中所要的其它操作。舉例而 言，在密封310後但在單一化314之前，可執行額外的操作 以.⑴當其仍在其陣列組態中時，測試積體電路產品；及 /或（η)為保護及/或耐磨損而塗覆測試引腳及/或導電性引 線或跡、線通 <，右提供，則測試引腳將形成於引線框或 基f之每一實體處。在一實施例中，在使用測試引腳以測 -式每積體電路產品後，能夠塗覆或以保護膜或層覆蓋測 試引腳（例如使測試引腳對電絕緣）。另外，在單一化Η* 後’每-實體可進-步成形以移除或消除銳利的邊緣。另 外，聚合物塗層可塗覆至每一實體以作為保護性表面。然 而另外，對於每一實體’可進一步使用加蓋操作以在積體 電路產品周圍添加外部封裝或蓋子（成對蓋子）。此封裝或 蓋子將對積體電路產品提供外部覆蓋物且建立其外部產品 特徵。舉例而言’當所得之積體電路產品比所需要的產品 外形尺寸更小時’然後將積體電路產品封入能夠將積體電 路產品調整至所需要之外形尺寸的外部封裝或蓋子内。 積體電路產品可關於可移除式周邊卡或其它使用半導體 組裝技術形成之可移除式媒體。一類可移除式周邊卡被稱 作記憶體卡。記億體卡通常為提供資料健存之小且基於積 體電路的產品。此等記憶體卡插入在電子裝置上之璋或連 接器中或被在電子裝w+、± > 置上之埠或連接器接收，該等電子裝 置包括電腦、相機、行動電話及pDA。圈4W將在 下文對,己憶體卡加以論述’但是其它積體電路產品亦可藉 1345178 由此加工而形成β 圖4為根據本發明之一實施例之整批記憶體卡加工4〇〇的 流程圖》整批記憶體卡加工400使用積體電路組裝加工以 同時整批形成複數個記憶體卡。整批記憶體卡加工400首 先獲得402多實體印刷電路板（PCB)。多實體pcB為包括用 以電連接附著至PCB之不同裝置或組件之導電性跡線的層 狀結構。記憶體晶粒安裝4〇4於在每一實體處之上。 然後，控制器晶粒安裝406於對於每一實體之記憶體晶粒 上。在此，對於每一實體存在以關於記憶體晶粒之晶粒為 下部晶粒且以關於控制器晶粒之晶粒為上部晶粒的晶粒堆 疊。然後，記憶體晶粒及控制器晶粒導線接合4〇8至在其 各自實體處的PCB。導線接合件用於將記憶體晶粒及控制 器晶粒電連接至PCB。 此後，將模製化合物塗覆410至1>(：^及形成於其上的缸 件。在此，模製化合物用於保護組件及其與pcB的電連 接，亦為記憶體卡提供外部本體。在設定（或加工）模製化 合物後’多W之每—實體可藉由使用至少非線性成 形而單一化412。意即，在每一記憶體卡的單一化412中， 四個側各被鋸切，且在此情況下，至少一側包括需要非線 性成形以鋸切此側的曲線部分。因此，整批生產之記憶體 卡之個別實體之外殼或外部結構之至少—部分具有非線性 形狀。換言之，記憶體卡之外部結構或外殼並非為矩形， 而是包括具有非線性（或非矩形）形狀之至少_區域。舉例 而言，在圖2A中，積體電路產品鹰包括將符合非線二或 1345178 非矩形）成形區域之曲線區域2〇2。 愔垆丰* ^ )的疋可在與整批記 L體卡加工400之其它操作相同 4 17 s 1 展每场所中執行單一化 412。另外，提供非線性成 ^卡错由此早一化412以其最終形態成形。因此，記㈣ =外部特徵並非為矩形（意即包括至少—曲線區域 此其可藉由單一化412之鋸切/切@而# 而確疋。在單一化412 後，1批記億體卡加工4〇〇完成且結束。
因此，無需進-步之外部封裝或本體（例如塑膠蓋子）， 且因此不再需要形成此封裝或本體及然後將實體插入此封 裝或本體之額外步驟。此外，生產記憶體卡的加工變得更 有效且成本更低。雖然外部封裝或主要部分不再必需，但 是若需要，則實體仍可具有外部封裝或本體。此封裝或本 體將為積體電路產品提料部覆蓋物^建立其外部產品特 被。舉例而言’當所得之記憶體卡比所需要之記憶體卡外 形尺寸更小時’可將記憶體卡封人外部封裝或蓋子中以將 記憶體卡調整至所需要的外形尺寸。 圖5A及5B為根據本發明之另一實施例之整批記憶體卡 加工500的流程圖。整批記憶體卡加工5〇〇為與生產積體電 路產品一一即記憶體卡一_相關的加工，該記憶體卡在引 線框周圍製成。 整批記憶體卡加工5〇〇首先獲得5〇2多實體引線框。多實 體引線框為導電金屬，例如銅。對引線框加以組態以包括 個別實體之陣列’在其周圍積體電路產品結合在一起以用 於整批加工。為提供臨時基底且為保護且支撐多實體引線 今4 091 1345178 框之-表面’將可移除式聚合物帶安裝5Q4至多實體弓I線 框之：侧二然後’將晶粒附著材料置放506於多實體引線 框之母-霄體之—區域處。晶粒附著材料通常為非 黏著劑。 —接著，將記憶體晶粒安裝5〇8於在多實體引線框之每一 貫體之-區域處的晶粒附著材料上。將控制器晶粒安裝 510於對於每—實體之記憶體晶粒上。在此，在每—實體 處，將控制器晶粒堆疊於記憶體晶粒上。雖然沒有必要， 但是晶粒附著材料可置放於控制器晶粒及記憶體晶粒之間 以將控制器晶粒固定於適當位置及/或使其自記憶體晶粒 與電絕緣。另外，雖然將記憶體晶粒描述為堆疊於對於每 一實體之記憶體晶粒上，但是應瞭解，控制器晶粒亦可置 放於在每一實體處之記憶體晶粒的侧面以提供非堆疊組 態。然而，堆疊方法之優點在於記憶體卡之整個外形尺寸 可更小。 接著’將記憶體晶粒及控制器晶粒導線接合512至多實 體引線框的各自實體。在此，記憶體晶粒及控制器晶粒的 塾或引線藉由使用藉由導線接合而置放之導線而電連接至 多實體引線框之其各自實體。然後將模製化合物塗覆5 14 至多實體引線框及其上之組件。模製化合物用於保護組件 (例如晶粒）及其與多實體引線框的電連接，亦用於對記憶 體卡提供外部本體。模製化合物的應用514可以各種方式 執行，其中之一被稱作傳遞模製且另一個被稱作泛模製。 此後，聚合物帶可自多實體引線框之一側移除516。然 1345178 後藉由聚合物帶所保護之多實體引線框之一側可使其曝露 之引線以導電材料（例如金）來電鍍5 18。另外，額外的蚀刻 步驟可為引線框提供輕微的蝕刻以消除引線框的角或邊 緣。此小規模之蝕刻可被稱作半蝕刻（〇ne_half etch)。 最後，對多實體引線框之每一實體加以單一化52〇以形 成個別記憶體卡。實體之單一化52〇界定了記憶體卡之形 狀。在對實體單一化520後，整批記憶體卡加工5〇〇完成且 以生產了一整批記憶體卡結束。 在一實施例中，單一化52〇能夠使用非線性成形。意 即，在每一記憶體卡之單一化52〇中，四個側各被鋸切， 且在此情況下，至少一側包括需要非線性成形以鋸切此側 的曲線部分。因此，整批生產之記憶體卡之個別實體之至 少其外殼或外部結構具有非線性形狀。換言之，在此實施 例十，記憶體卡之外部結構或外殼並非為矩形，而是包括 具有非線性(或非矩形)形狀的至少一區域。舉例而言，在 圖2A中，積體電路產品2〇〇包括將符合非線性（或非矩形） 成形區域的曲線區域202。有利的是，可在與整批記憶體 卡加工5GG之其它操作同樣的製造場所中執行單—化別。 另外，提供非線性成形/切割的能力有益於允許記憶體卡 藉由此單一化520以其最終形態中成形。因此，在此實施 例中，該記憶體卡的外部特徵並非為矩形（意即，包括至 ^ 一曲線區域），因此其可藉由單一化52〇之鑛切/切割而確 疋。在单-化520後，整批記憶體卡加工·完成且結束。 與在圓4中說明之實施例相類似，無需進—步之外部封 94091 •19- 1345178 裝或本體（如塑勝蓋子），且因此不再需要形成此封裝或本 體及然後將實體插入此封裝或本體之額外步驟。因此，生 產。己憶體卡的加工變得更右六含日+ 士 交仟旯有效且成本更低。雖然無需使用 :主卜部封裝或本體，但是如上文提及之外部封裝或本體可視 十月況選用以歧外部產品特徵。舉例而言，當所得之積體 a路產品比所需要之產品外形尺寸更小時，㈣將積體電 參 …口封入外部封裝或蓋子中可調整積體電路產品以設定 外部產品特徵，包括設定所需要之外形尺寸。 根據本發明之積體電路產品可用於記憶體系統中。本發 明可進-步關於包括如上所論述之記憶體系統的電子系 ^記憶體系統通常用作供各種電子產品使用以儲存數位 。通常，記憶體系統可自電子系統中移除，使得可攜 :所錯存之數位資料。此等記憶㈣統可被稱作記憶體 :根據本發明之記憶體系統可具有相對小的外形尺寸且 用以為電子產品(例如相機、掌上型或筆記型電腦、網路 二:、視訊轉接器、掌上型或其它小型音訊播放 ^己錄益（例如’ MP3裝置）及醫療監視器）儲存數位資 枓。記憶體卡之實例包括pc卡（以前的PCMCIA裝置 問記憶卡、快閃碟片、多媒體卡及ATA卡。舉例而言，記 It體卡可使用快閃型或EEpR〇M型記憶體單 料。尹、S A AA ^啼仔負 吊、，δ己憶體系統可不僅適於記憶體卡 記憶棒或一些其它半導體記憶體產品。 較 I明的優點很多。不同實施例或實施可具有—咬多個 下歹!優點。本發明之一優點在於積體電路產品（例如圮憶 -20- 1345178 體卡）可製作的更+。與，工& 舉例而$ ’記憶體卡可製作成晶片 級封裝水準的尺寸。本發明之另一優點在於積體電路產品 之組裝可完全藉由使用半導體組裝生產線而執行。本發明 之另優點在於用以形成積體電路產品之模製化合物及基 板或引線框可作為外側或外部表面。肖由外側或外部表面 的複雜成形’可形成具有非線性區域及/或小的特徵之積 體電路產品。小的特徵可用於達成功能或裝飾之目的。然 而士發明之另-優點在於積體電路產品可以快速且成本效 率冋之方式生產。本發明之另一優點在於積體電路產品的 外形尺寸（例如可移除式周邊卡）可以半導體組裝水準而設 定。本發明之另一優點在於可視情況選用圍繞在周圍之塑 膠殼、本體或框架，當不使用時，其能減少製造時間及成 本，且當使用時，其允許靈活地設定外部產品特徵（例如 外形尺寸）。 自書面描述吾人可瞭解本發明之許多特徵及優點，且因 此吾人希望在附加申請專利範圍中涵蓋本發明之所有此等 特徵及優點《另外，彼等熟習此項技術者將瞭解，由於將 易於對本發明進行大量修改及變化，因此本發明並不限制 於所說明及描述之精確構造及操作。因此，本發明涵蓋所 有適當的修正案及其均等物，涵蓋程度正如其在本發明範 疇内。 【圖式簡單說明】 圖1A為所製造之半導體產品的平面圖。 圖1B為自在圖1A中說明之參考線A-A，載取之所製造之 94091 -21 - 1345178 半導體產品的橫截面圖。 圖2A及2B說明了可根據本發明生產之積體電路產品之 一表示形狀。 圖2C為一根據本發明之另一實施例之積體電路產品的俯 視圖。 圖3為根據本發明之一實施例的整批積體電路產品加工 的流程圖。 圖4為根據本發明之一實施例之整批記憶體卡加工的流
程圖。 圖5 A及5B為根據本發明之另一實施例之整批記憶體卡 加工的流程圖。 【主要元件符號說明】 100 102 104-1, 104-2, 104-3, 106-1, 106-2, 106-3 108-1， 108-2, 108-3 110-1, 110-2, 110-3 200 202 220 222 250 252 多實體基板 模製化合物 104-n實體 第一半導體晶粒 第二半導體晶粒 導線接合件 積體電路產品 曲線區域 積體電路產品 非線性區域 積體電路產品 曲線區域
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Claims (1)

1345178 第093117976號專利申請案 fM 3. 1- 中文申請專利範圍替換本(1〇〇年3月） 年月曰修正本 十、申請專利範圍： 一種用於同時形成複數個積體電路產品之方法，該方法 包括： 提供一具有複數個實體之多實體引線框或基板； 附著一或多個晶粒至在該多實體引線框或基板之至少 一側上之每一該等實體； 電連接每一該一或多個晶粒至該引線框或基板上之該 各別實體； 此後以一模製化合物在該多實體引線框或基板之該至 少一側上將該等複數個實體密封在一起；及 隨後使用每一該等複數個實體之至少一區域之至少非 線技成形而單—化每—該等複數個實體，藉此形成該等 積體電路產品。 2. 3. 4. 5. 如明求項1之方法’其中該電連接包括至少導線接合每 -該-或多個晶粒至該引線框或基板之該各別實體。 如：求項1之方法，其中該密封形成-模製面板。 二长項1之方法’其中該單一化藉由由一雷射器提供 之一雷射光束而執行。 如清求項1 $古、、+ 丑— ，/'中該單一化藉由一高壓水喷射而 其中該水噴射至少包括水及一研磨 6_如請求項5之方法 材料。
8. 如請求項1之方法， 如請求項1之方法， 其中該基板為一印刷電路板。 其中該方法進一步包括· 9409M000301.doc 體 在該密封之前附著-或多個被動組件至每 該等實 9.如請求項8之方沐 ^ , 其中該等被動組件包括一電Μι§ β —電容器中之至少一者。 電阻态及 如請求項1至9中钰 _ 任一項之方法，其中該一或 半導體晶粒。 飞夕個晶粒為 11. 如請求項1至9中 _ 中任一項之方法，其中該等積 為記憶體卡。 體電路產品 12. 如請求項1之方 万去，其中該等積體電路產品 矩形周邊卡。 為了移除非 13·如請求項1之方法，其中該方法進一步包括： 為每一該等複數個實 η·如請求項13之方法，η “至该模製化合物。 其中δ亥“ §己為一印刷標記。 15.如請求項1之方法， 其中該密封形成一模製面板，及 其中每g等實體之該單一化切割該模製面板成複數 個核製封裝’該等模製封裝為該等積體電路產品。 16_如請求項15之方法’其中該等模製封裝為記憶體卡。 17·如請求項16之方法，其中該方法進一步包括： 在該早-化後’塗覆—塗料至每一該等記憶體卡。 18.如請求項16之方法，其中該方法進一步包括： 在該單化後’固定一外部包裝至每一該等記憶體 卡。 19_如明求項1之方法，其中藉由該單一化的每一該等實體 94091-1000301.doc 之該非線^形係在該單—化期間藉由曲線或非矩形切 割而達成。 二月求項1之方法，其中在該密封之後且在該單一化之 刖執行對該等實體的電測試。 21. 如請求項1之方法，其中該方法進一步包括： 在該單-化後，塗覆一塗料至每一該等記憶體卡。 22. -種積體電路產品，其以整批方式生產，生產操作至少 包括： 提供一具有複數個實體之多實體引線框或基板； 附著該一或多個晶粒至在該多實體引線框或基板之至 少一側上之每一該等實體； 電連接每一該一或多個晶粒至該引線框或基板之該各 自實體； 此後以一模製化合物在該多實體引線框或基板之該至 少一側上將該等複數個實體密封在一起；及 隨後使用每一該等複數個實體之至少一區域之至少非 線性成形而單一化每一該等複數個實體， 藉此藉由該操作而生產之該等複數個實體之一為該積 體電路產品。 23. 如請求項22之積體電路產品，其中藉由該單一化的每一 該等實體之該非線性成形係在該單一化期間藉由曲線或 非矩形切割而達成。 24. 如請求項22之積體電路產品，# $用於生產該積體電路 產中之額外操作包括在該單一化後，固定一外部封 94091-1000301.doc 1345178 裝於每一該等實體周圍。 —25.如請求項22至24中任—項之積體電路產品，其中該積體 電路產品為一記憶體卡。 26. 如請求項22至24中任一項之穑艚雷攸方σ ^ 項（槓體電路產品，其中該積體 電路產品為一可移除式非矩形周邊卡。 27. -種用於同時形成複數個記憶體卡之方法，♦—該等纪 憶體卡包括至少一記憶體晶粒及一控制器晶粒，該方: 包括： 提供一具有複數個實體之多實體引線框； 附著該多實體引線框於一可移除式帶上， · 置放晶粒附著材料於該多實體引線框之每一該等實體 之一部分上； 絰由對應於每一該等實體之該晶粒附著 憶體晶粒至每一該等實體； 寸耆⑸ 對於每一該等實體，固定該控制器晶粒； • 電連接每一該記憶體晶粒及該控制器晶粒至該多實體 引線框之該等各自實體； 此後以一模製化合物將該等實體密封在一起；及 隨後，使用每一該等複數個實體之至少一區域之至少 非線性成形而單一化每一該等實體。 28. 如請求項27之方法，其中該可移除式帶為一聚合物帶。 29. 如請求項27之方法’其中該固定對於每一該等實體操作 以安裝該控制器晶粒於該記憶體晶粒上，藉此該控制器 晶粒堆疊於該記憶體晶粒上。 9409M000301.doc • 4 · 30. 31. 32. 33. 如請求項27之方法，其中該方法進一步包括： 在該密封之後且在該單一化之前移除該可移除式帶。 如請求項30之方法，其中每一該等實體包括作為該各自 實體之該引線框之部分的曝露電接點。 如請求項之方法，其中該方法進一步包括： 在移除該可移除式帶之後且在該單-化之前，電鍍每 一該等實體之該等電接點。 如請求項27之m中該電連接包括至少導線接合每 二該記憶體晶粒及該控制器晶粒至該多實體引線框之該 34. 如請求項27之方法， 之一雷射光束而執行 35. 如請求項27之方法， 執行。 其中該單一化藉由由一雷射器提供 〇 其中該單一化藉由一高壓水喷射而 其中該水喷射至少包括水及一研磨 36.如請求項35之方法 材料。 ^长項27之方法’其中該等記憶體卡為模製卡，每一 該等模製卡具有由該模製化合物提供之一外殼而沒有任 何額外的外部包裝。 月长項27之方法’其中該等記憶體卡為提供資料儲存 的可移除式非矩形周邊卡。 月求項27之方法’其中該密封操作以密封具有附著至 框之ο ^ It體aa粒及該控制器晶粒之該等實體的該引線 之至；一側，藉此密封該記憶體晶粒及該控制器晶 94091-l〇〇〇3〇i.doc 1345178 粒0 40. 如請求項27之方法，其中藉由該單—化的每—該等實體 之該非線性成形係'在該單__化期間藉由曲線或非矩形切 割而達成。 41. 如請求項40之方法，其中該方法進—步包括： 在該單一化後，固定―冰 U疋外°卩封裝於每一該等實體周 圍。 翁42. -種用於同時形成複數個記憶體卡之方法，每一該等記 隐體卡包括至）-s己憶體晶粒及_控制器晶粒，該方法 包括： 提供一具有複數個實體之多實體印刷電路板； 對於每一該等實體附著該記憶體晶粒； 對於每一該等實體固定該控制器晶粒； 電連接每一該s己憶體晶粒及該控制器晶粒至該多實體 印刷電路板之該等各自實體； # 此後以—模製化合物將該等實體密封在一起；及 隨後使用至少非矩形成形而單一化每一該等實體。 43. 如請求項42之方法，其中該固定對於每一該等實體操作 以安裝該控制器晶粒於該記憶體晶粒上，藉此該控制器 晶粒堆疊於該記憶體晶粒上。 44. 如請求項43之方法，其中對於每一該等實體該記憶體 晶粒安裝於該印刷電路板上。 45. 如請求項42之方法，其中每一該等實體包括在該印刷電 路板上之曝露電接點。 94091-1000301.doc 1345178 46.如明求項42之方法，其中該電連接包括至少導線接合每 一 °亥5己憶體晶粒及該控制器晶粒至該多實體印刷電路板 之該等各自實體。 47·如明求項42之方法，其中該單一化藉由由一雷射器提供 之一雷射光束而執行。 48. 如請求項42之方法，其中該單_化藉由使用一雷射光束 及水而達成》 49. 如請求項42之方法，其中該單一化藉由一高壓水喷射而 執行。 5 0.如明求項49之方法’其中該水噴射包括至少水及一研磨 材料。 51. 如請求項42至50中住一话々士、丄 項之方法’其中該等記憶體卡為 模製卡，每一該等槿制士 1女P , 卡具有藉由該模製化合物提供之 一外殼而沒有任何額外的外部包裝。 52. 如請求項42至50中任一瑁之t、+ 4丄 項之方法，其中該等記憶體卡為 提供資料儲存之可移除式周邊卡。 53. 如請求項42至50中任—項 項之方法，其中該密封用以密封 具有附著至其之該記情體θ * 愿體日日粒及該控制器晶粒之該等實 體的該印刷電路板之至少一 側’藉此密封該記憶體晶粒 及該控制器晶粒》 54. 如請求項42至5〇中任一項 嗖您方法，其中該方法進一步包 括： 在該單一化後，固定一外 圍 封裝於每一該等實H 〇 9409M000301.doc
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US8354749B2 (en) 2013-01-15
JP2012033178A (ja) 2012-02-16
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JP2007526624A (ja) 2007-09-13
CN1809921A (zh) 2006-07-26
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