476164 五、發明說明（1) 本發明係屬一種二極體製造方法，尤指一種由晶粒與 基板結合再銜接導線（片）之二極體製造方法所廣者。、 如本發明之二極體產製品具有數項如下 特色， 含： 基板面積夠大，可自動化一次同時大量生產，以降低 成本； 粒 曰曰 晶粒之採摘可藉自動化機具直接從晶圓片中取出其 後黏著在基板上，可確保其正確極性 佳 基板背面焊墊區面積頗大，故其與電路板之焊錫性 近 5:封合膠兩者之質性與電路板之熱膨脹係數相 故其基板接點不會脫落； 經單顆後之二極體i因呈一方形體之幾何塊狀， 有助盈於進行表面黏著時之 若欲各別加強其單顆二極體‘=吴作==# 封合膠頂面黏附-散熱片者。體之放熱效果，'亦方<更於其 如本發明係屬一種二極 與基板結合再銜接導線（片體ί'方&，尤指-種由晶粒 侬太恭ΗΗ々： 片之二極體製造方法所屬者； 以金屬導線端；作基板，_晶粒於基板上， 黑占，灌注封合膠，蓋粒上方與基板接 背面焊墊區沾附錫鉛基合金己產品識別，，於基板 測試，卷帶包裝等步驟，·迚^，切割成早顆，電性 以產製符合經濟效二賴=發明之最新提供， 負^賴度回的二極體電子元件 476164 五、發明說明（2) 者。 為使 貴審查委員能更加明瞭本發明之製程與方法及 其效益，茲配合阖式詳細說明如下列： 圖式簡單說明： 第一圖係本發明之流程圖； 第二圖係製作基板示意圖； 第二圖係黏附晶粒於基板上不意圖， 第四圖係銜接金屬導線示意圖； 第五圖係銜接金屬導片示意圖；476164 V. Description of the invention (1) The present invention belongs to a method for manufacturing a diode, especially a method for manufacturing a diode by combining a crystal grain with a substrate and then connecting wires (pieces). For example, the diode product of the present invention has several features, including: The substrate area is large enough to be automated and mass-produced at the same time to reduce costs; the harvesting of grains can be directly from the wafer by automated equipment. After taking it out, it is adhered to the substrate, which can ensure its correct polarity. The area of the pad on the back of the substrate is quite large, so its solderability with the circuit board is close to 5: The quality of the sealant and the thermal expansion coefficient of the circuit board Therefore, the substrate contacts will not fall off; the diode i after a single piece has a square geometric block shape, which helps to strengthen the individual diodes individually when performing surface adhesion '= Wu For == # The top surface of the sealant is attached to the heat sink. The exothermic effect of the body, "Yifang" is more like the present invention, which is a type of two-pole combined with a substrate and then connected to the wire (chip body "square", in particular-a kind of crystal by the lens Nong too respectfully: Owner of the manufacturing method of the diode; using metal wire ends; as the substrate, _ grains on the substrate, black occupying, potting sealant, tin-lead-based alloy attached to the pad area above the cover grain and the back of the substrate Identification, in the substrate test, tape packaging and other steps, · 迚 ^, cut into early particles, electrical production to meet the economic efficiency of the two == the latest invention of the invention, negative ^ Lai back diode electronic components 476164 V. Description of the invention (2) In order to make your review committee better understand the process and method of the present invention and its benefits, the following detailed description is given in conjunction with the following formula: Brief description of the drawings: The first diagram is the flowchart of the present invention The second diagram is a schematic diagram of making a substrate; the second diagram is a schematic diagram of attaching crystal grains to the substrate, the fourth diagram is a diagram of connecting metal wires; the fifth diagram is a diagram of connecting metal guides;
第六圖係灌注封合膠示意圖； 第七圖係盖印註記其極性及產品識別碼不意圖， 第八圖係基板背面焊墊區沾錫鉛基合金或錫鉛球示意 圖； 第九圖係單顆二極體切面結構示意圖。 圖號說明： 2 0 —製作基板 21 —黏附晶粒於基板上 2 2--以金屬導線（片）之兩端分別銜接於晶粒上方與基板 接點The sixth diagram is a schematic diagram of a perfusion sealant; the seventh diagram is a stamped note of its polarity and product identification code is not intended, the eighth diagram is a schematic diagram of a tin-lead-based alloy or a tin-lead ball attached to the pad area on the back of the substrate; the ninth diagram is a single Schematic diagram of the structure of a diode. Description of drawing number: 2 0—Make substrate 21—Adhesive die on substrate 2 2--The two ends of metal wire (sheet) are connected above the die and the contact point of the substrate
23—灌注封合膠 24--蓋印註記其極性及產品識別碼 2 5 --於基板背面焊墊區沾附錫斜基合金或錫錯球 2 6 —切割成單顆 27 —電性測試 28 —卷帶包裝 10 --基板 Π--切溝 12--導通孔 13 —接點 14- -格狀體 15- -焊墊 30--晶粒 31--銀膠 40 —金屬導線 41 —第一焊點 42 —第二焊點23—Injection sealant 24—Stamping note of its polarity and product identification code 2 5 —Attach tin slant base alloy or tin spheres to the pad area on the back of the substrate 2 6 —Cut into single pieces 27 —Electrical test 28-Tape and Reel Packaging 10-Substrate Π-Cut groove 12-Via 13-Contact 14--Lattice 15--Pad 30-Grain 31-Silver glue 40-Metal wire 41- First solder joint 42 —Second solder joint
第5頁 幷/0丄04 五、發明說明（3) 60—封合膠 50--金屬導片 8〇--錫鉛基合金 7 0 —蓋印註記 圖式詳細說明： 序為Ϊ ^閱第一圖係本發明之流程圖，其中該主要製程依 (片）作基板2〇，黏附晶粒於基板上21，以金屬導線 人_⑼之兩端分別銜接於晶粒上方與基板接點2 2，灌注封 ρ ά $其極性及產品識別碼2 4，於基板背面焊 p區沾附錫斜基合金或錫鉛球2 5，切割成單顆2 6，電性測 口式27 ’卷帶包裝28等步驟，而完成一品質信賴度高的二極 體電子元件者。 明參閱第二圖係製作基板示意圖，其中以一大面積之 基板1 0 ’先行於其正面切溝丨丨、穿設導通孔丨2，設接點 1 3 ’隔成數十個棋盤之數百個格狀體丨4，另背面則焊墊J 5 於各導通孔1 2外端者（此些細部加工本圖未示出）。 請參閱第三圖係黏附晶粒於基板上系意圖，其中以晶 粒3 0底端沾附銀膠3 1 (或導電膠帶、或錫鉛合金、或熱磨 接）黏附於基板1 〇之各個格狀體丨4上者。 請參閱第四圖係銜接金屬導線示意圖，其中該等金屬 導線4 0以其兩端分別銜接於晶粒3 〇頂部第一焊點41與基板 1 0接點1 3之第二焊點4 2上者。 請參閱第五圖係銜接金屬導片示意圖，其中該金屬導 片50如同前述金屬導線4〇之方式，以其雨端分別銜接於晶 粒30頂部第一焊點41與基板10接點13之第二焊點42上者。 請參閱第六圖係灌注封合膠示意圖，其中該封合膠6 0Page 5 幷 / 0 丄 04 V. Description of the invention (3) 60—sealing glue 50—metal guide 80—tin-lead-based alloy 7 0—stamping annotations The first diagram is a flowchart of the present invention, in which the main process is based on (piece) as the substrate 20, and the die is adhered to the substrate 21, and the two ends of the metal conductor __ are respectively connected above the die and the substrate contacts. 2 2. Perfusion seal ρ $ Its polarity and product identification code 2 4. Adhesive tin oblique alloy or tin-lead ball 2 5 on the p area of the back of the substrate, cut into single pieces 2 6, electrical gauge 27 'volume With steps such as packing 28 and completing a diode electronic component with high quality reliability. Refer to the second figure for a schematic diagram of the production of the substrate. A large area of the substrate 1 0 'is cut in front of the groove 丨 丨 through a through hole 丨 2, and the contacts 1 3' are separated into dozens of checkerboards. There are one hundred lattices, and the other side is the pad J 5 on the outer end of each via 12 (these details are not shown in this figure). Please refer to the third figure for the purpose of attaching the die to the substrate. The bottom of the die 30 is attached with silver glue 31 (or a conductive tape, or a tin-lead alloy, or thermal grinding) to the substrate 1 0. Each of the four lattices. Please refer to the fourth diagram for a schematic diagram of connecting metal wires, wherein the metal wires 40 are respectively connected to the die 3 at both ends, and the first solder joint 41 on the top and the second solder joint 4 on the substrate 10 are connected to the second solder joint 4 2 The former. Please refer to the fifth diagram, which is a schematic diagram of connecting metal guides. The metal guides 50 are connected to the first solder joints 41 on the top of the die 30 and the contacts 13 on the substrate 10 with the rain ends in the same manner as the aforementioned metal wires 40. The second solder joint 42 is the former. Please refer to the sixth diagram of the schematic diagram of the perfusion sealant, wherein the sealant 6 0
476164 五、發明說明（4) 乃灌注淹沒已固接於基板10面上之諸等晶粒30與金屬導線 40或金屬導片50上者。 清參^第七圖係蓋印註記其極性及產品識別碼示意 =，其中蓋印註記7〇於各對應晶粒3〇上方之封合膠Μ上 # - ΐ ΐ閱t圖係基板背面焊墊區沾錫錯基合金或錫船 ，不=，、中於基板10背面焊墊15底部沾附錫鉛基入金 Γί;=)Γ在此，若不靡基合金8。或ί: 接在製造基板10時於焊塾15上塗佈錫錯或錢㈣ 請參閱第九圖係單顆二極體切 被切成單顆之二極體9〇，是由 ° y、忍圖，其中該 金屬導線40與晶粒3。、銀膠二封装將基板正面之 基板π背面則屬已沾附錫錯基合被覆’而於 點13與焊墊15間之基板1〇銜接有導通孔a者。5，又介於接 第 頁 Φ476164 V. Description of the invention (4) It is a method of pouring and submerging the crystal grains 30 and the metal wires 40 or the metal guides 50 which have been fixed on the substrate 10 surface. Clear reference ^ The seventh picture is the stamped note with its polarity and product identification code =, where the stamped note 70 is on the sealant M above each corresponding die 30 #-ΐ ΐ See the picture on the back of the substrate The pad area is immersed in tin-based alloy or tin boat, not =, tin-lead-based gold is attached to the bottom of the pad 15 on the back surface of the substrate 10; =) Γ Here, if the base alloy 8 is not used. Or ί: When tin foil or money is coated on the soldering pad 15 when the substrate 10 is manufactured, please refer to the ninth picture, a single diode is cut into a single diode 90, which is formed by ° y, Endurance map, wherein the metal wire 40 and the die 3. 2. The silver glue two package has the substrate π on the front side of the substrate and the back side of the substrate π is covered with tin tin base coating. The substrate 10 between the point 13 and the pad 15 is connected with a via a. 5, which in turn is connected to page Φ