TWI338260B - Rfid tag - Google Patents

Rfid tag Download PDF

Info

Publication number
TWI338260B
TWI338260B TW095149848A TW95149848A TWI338260B TW I338260 B TWI338260 B TW I338260B TW 095149848 A TW095149848 A TW 095149848A TW 95149848 A TW95149848 A TW 95149848A TW I338260 B TWI338260 B TW I338260B
Authority
TW
Taiwan
Prior art keywords
antenna
substrate
reinforcing member
rfid tag
wafer
Prior art date
Application number
TW095149848A
Other languages
English (en)
Chinese (zh)
Other versions
TW200809641A (en
Inventor
Shunji Baba
Shigeru Hashimoto
Yoshiyasu Sugimura
Tsuyoshi Niwata
Original Assignee
Fujitsu Ltd
Fujitsu Frontech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fujitsu Frontech Ltd filed Critical Fujitsu Ltd
Publication of TW200809641A publication Critical patent/TW200809641A/zh
Application granted granted Critical
Publication of TWI338260B publication Critical patent/TWI338260B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
TW095149848A 2006-08-09 2006-12-29 Rfid tag TWI338260B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006216827A JP4382783B2 (ja) 2006-08-09 2006-08-09 Ｒｆｉｄタグ

Publications (2)

Publication Number Publication Date
TW200809641A TW200809641A (en) 2008-02-16
TWI338260B true TWI338260B (en) 2011-03-01

Family

ID=38474609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149848A TWI338260B (en) 2006-08-09 2006-12-29 Rfid tag

Country Status (6)

Country Link
US (1) US7746234B2 (enExample)
EP (1) EP1887496B1 (enExample)
JP (1) JP4382783B2 (enExample)
KR (1) KR20080013676A (enExample)
CN (1) CN100583134C (enExample)
TW (1) TWI338260B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2019425A1 (en) 2007-07-27 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5146265B2 (ja) 2008-11-04 2013-02-20 富士通株式会社 タグ用アンテナ及びそれを備えた無線タグ
JP5139239B2 (ja) * 2008-11-17 2013-02-06 富士通株式会社 Ｒｆｉｄタグ
US8671772B2 (en) * 2011-09-22 2014-03-18 Hana Micron America, Inc. Quality assurance and reliability testing apparatus for RFID tags
JP5895681B2 (ja) 2012-04-18 2016-03-30 Nok株式会社 Ｉｃタグ
CN104050497A (zh) * 2014-06-10 2014-09-17 杨雪 电子标签嵌体、电子标签嵌体的加工方法和电子标签
EP3001356B1 (en) * 2014-09-10 2021-05-12 Fujitsu Limited Rfid tag
JP6463979B2 (ja) * 2014-09-10 2019-02-06 富士通株式会社 Ｒｆｉｄタグ
US9743513B2 (en) * 2014-12-26 2017-08-22 Industrial Technology Research Institute Flexible electronic device
DE102016121225A1 (de) * 2016-11-07 2018-05-09 Schreiner Group Gmbh & Co. Kg RFID-Etikett zum Kennzeichnen eines Wäschestücks
JP2019192137A (ja) 2018-04-27 2019-10-31 富士通株式会社 Ｒｆｉｄタグ
TWI785619B (zh) * 2021-05-21 2022-12-01 德商Ｓｅｓ Ｒｆｉｄ解決方案有限公司 晶片封裝結構、用以製造一晶片封裝結構的方法及無線識別標籤

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215401B1 (en) * 1996-03-25 2001-04-10 Intermec Ip Corp. Non-laminated coating for radio frequency transponder (RF tag)
JPH1058873A (ja) * 1996-08-26 1998-03-03 Hitachi Maxell Ltd Ｉｃモジュール
JPH11296642A (ja) 1998-04-10 1999-10-29 Hitachi Ltd Ｉｃカード
US6031459A (en) 1998-07-22 2000-02-29 Micron Technology, Inc. Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices
JP2000311226A (ja) 1998-07-28 2000-11-07 Toshiba Corp 無線ｉｃカード及びその製造方法並びに無線ｉｃカード読取り書込みシステム
JP3502557B2 (ja) 1999-01-07 2004-03-02 松下電器産業株式会社 非接触ｉｃカードの製造方法
JP4620836B2 (ja) 2000-06-08 2011-01-26 大日本印刷株式会社 ウエハーの製造方法
JP4873776B2 (ja) * 2000-11-30 2012-02-08 ソニー株式会社 非接触ｉｃカード
US6549176B2 (en) * 2001-08-15 2003-04-15 Moore North America, Inc. RFID tag having integral electrical bridge and method of assembling the same
JP2003233793A (ja) 2002-02-12 2003-08-22 Konica Corp Ｉｃカード
JP4367013B2 (ja) * 2002-10-28 2009-11-18 セイコーエプソン株式会社 非接触通信媒体
JP4278039B2 (ja) 2003-06-11 2009-06-10 共同印刷株式会社 非接触ｉｃカード、インレットシート及び非接触ｉｃカードの製造方法
JP2005031721A (ja) * 2003-07-07 2005-02-03 Konica Minolta Photo Imaging Inc Ｉｃカード及びｉｃカードの製造方法
JP2008511893A (ja) * 2004-09-02 2008-04-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 非接触ｒｆｉｄチップを有する身分証明書
JP4768379B2 (ja) * 2005-09-28 2011-09-07 富士通株式会社 Ｒｆｉｄタグ

Also Published As

Publication number Publication date
CN100583134C (zh) 2010-01-20
US7746234B2 (en) 2010-06-29
CN101122968A (zh) 2008-02-13
US20080042852A1 (en) 2008-02-21
JP4382783B2 (ja) 2009-12-16
TW200809641A (en) 2008-02-16
JP2008040950A (ja) 2008-02-21
KR20080013676A (ko) 2008-02-13
EP1887496B1 (en) 2011-08-10
EP1887496A1 (en) 2008-02-13

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