TWI331686B - - Google Patents
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- Publication number
- TWI331686B TWI331686B TW94113925A TW94113925A TWI331686B TW I331686 B TWI331686 B TW I331686B TW 94113925 A TW94113925 A TW 94113925A TW 94113925 A TW94113925 A TW 94113925A TW I331686 B TWI331686 B TW I331686B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- transport
- hand
- processing
- unit
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 204
- 230000032258 transport Effects 0.000 claims description 132
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000011010 flushing procedure Methods 0.000 description 19
- 229920002120 photoresistant polymer Polymers 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 5
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004219848A JP4503384B2 (ja) | 2004-07-28 | 2004-07-28 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200604643A TW200604643A (en) | 2006-02-01 |
| TWI331686B true TWI331686B (enrdf_load_stackoverflow) | 2010-10-11 |
Family
ID=35905904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094113925A TW200604643A (en) | 2004-07-28 | 2005-04-29 | Substrate processor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4503384B2 (enrdf_load_stackoverflow) |
| CN (1) | CN100405570C (enrdf_load_stackoverflow) |
| TW (1) | TW200604643A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5173699B2 (ja) * | 2008-09-25 | 2013-04-03 | 株式会社日立ハイテクノロジーズ | 有機ｅｌデバイス製造装置 |
| JP5501193B2 (ja) * | 2010-10-26 | 2014-05-21 | 東京エレクトロン株式会社 | 基板処理装置 |
| KR102605917B1 (ko) * | 2016-04-07 | 2023-11-27 | 주식회사 탑 엔지니어링 | 스크라이빙 장치 |
| JP7405884B2 (ja) * | 2022-02-18 | 2023-12-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| CN116364603B (zh) * | 2023-03-03 | 2023-12-22 | 珠海恒格微电子装备有限公司 | 一种半自动等离子去胶机 |
| CN116313958B (zh) * | 2023-03-03 | 2023-12-05 | 珠海恒格微电子装备有限公司 | 一种用于晶圆真空去胶的半自动送料机构 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148415A (ja) * | 1995-11-28 | 1997-06-06 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
| JPH09275127A (ja) * | 1996-04-01 | 1997-10-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4045008B2 (ja) * | 1998-03-26 | 2008-02-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3484067B2 (ja) * | 1998-02-20 | 2004-01-06 | 平田機工株式会社 | ロボット装置 |
| JP3495292B2 (ja) * | 1999-06-09 | 2004-02-09 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP2002313874A (ja) * | 2001-04-17 | 2002-10-25 | Dainippon Screen Mfg Co Ltd | 基板支持部材、ならびにそれを用いた基板保持機構、基板搬送装置、基板搬送方法、基板処理装置および基板処理方法 |
| JP3963732B2 (ja) * | 2001-04-19 | 2007-08-22 | 大日本スクリーン製造株式会社 | 塗布処理装置およびこれを用いた基板処理装置 |
| US6703316B2 (en) * | 2001-04-27 | 2004-03-09 | Kabushiki Kaisha Kobe Seiko Sho | Method and system for processing substrate |
-
2004
- 2004-07-28 JP JP2004219848A patent/JP4503384B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-29 TW TW094113925A patent/TW200604643A/zh not_active IP Right Cessation
- 2005-05-20 CN CNB2005100713993A patent/CN100405570C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006041235A (ja) | 2006-02-09 |
| CN1728356A (zh) | 2006-02-01 |
| CN100405570C (zh) | 2008-07-23 |
| JP4503384B2 (ja) | 2010-07-14 |
| TW200604643A (en) | 2006-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |