TWI322649B - - Google Patents

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Publication number
TWI322649B
TWI322649B TW097143988A TW97143988A TWI322649B TW I322649 B TWI322649 B TW I322649B TW 097143988 A TW097143988 A TW 097143988A TW 97143988 A TW97143988 A TW 97143988A TW I322649 B TWI322649 B TW I322649B
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive tape
tape
substrate
disk
Prior art date
Application number
TW097143988A
Other languages
English (en)
Chinese (zh)
Other versions
TW200913828A (en
Inventor
Naoki Fukushima
Takashi Tatsuzawa
Takahiro Fukutomi
Kouji Kobayashi
Toshiyuki Yanagawa
Masami Yusa
Motohiro Arifuku
Yasushi Gotoh
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/ja
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/ja
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/ja
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/ja
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/ja
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/ja
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/ja
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/ja
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/ja
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/ja
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/ja
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/ja
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/ja
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/ja
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/ja
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/ja
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200913828A publication Critical patent/TW200913828A/zh
Publication of TWI322649B publication Critical patent/TWI322649B/zh
Application granted granted Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
TW097143988A 2002-07-30 2003-07-30 Adhesive material reel TW200913828A (en)

Applications Claiming Priority (17)

Application Number Priority Date Filing Date Title
JP2002221225A JP2004059776A (ja) 2002-07-30 2002-07-30 異方導電材テープ
JP2002370624A JP4477823B2 (ja) 2002-12-20 2002-12-20 接着剤テープの接続方法及び接着剤テープ接続体
JP2002370622A JP2004196540A (ja) 2002-12-20 2002-12-20 接着材テープの接続方法
JP2002370623A JP4032961B2 (ja) 2002-12-20 2002-12-20 接着材テープの接続方法
JP2002371889A JP4608839B2 (ja) 2002-12-24 2002-12-24 接着材テープリール及び接着装置
JP2002371887A JP2004203944A (ja) 2002-12-24 2002-12-24 接着材テープの接続方法及び接着装置
JP2002371888A JP4239585B2 (ja) 2002-12-24 2002-12-24 接着剤テープの接続方法及び接着剤テープ接続体
JP2003002095A JP2004210524A (ja) 2003-01-08 2003-01-08 接着具
JP2003002092A JP2004211017A (ja) 2003-01-08 2003-01-08 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
JP2003002094A JP2004210523A (ja) 2003-01-08 2003-01-08 接着剤テープカセット及び接着剤テープカセットを用いた接着剤の圧着方法
JP2003002093A JP4333140B2 (ja) 2003-01-08 2003-01-08 接着剤テープの製造方法
JP2003118286A JP2004323621A (ja) 2003-04-23 2003-04-23 接着材テープ
JP2003118287A JP4654566B2 (ja) 2003-04-23 2003-04-23 接着剤テープの接続方法及び接着剤テープ接続体
JP2003130196A JP2004331833A (ja) 2003-05-08 2003-05-08 接着材テープリール
JP2003130197A JP4238626B2 (ja) 2003-05-08 2003-05-08 接着剤テープリール、接着装置、接続方法及び接着剤テープ接続体
JP2003176321A JP2005330296A (ja) 2003-06-20 2003-06-20 接着材テープの接続方法
JP2003176322A JP2005330297A (ja) 2003-06-20 2003-06-20 接着材テープの接着材形成方法

Publications (2)

Publication Number Publication Date
TW200913828A TW200913828A (en) 2009-03-16
TWI322649B true TWI322649B (ja) 2010-03-21

Family

ID=31192628

Family Applications (5)

Application Number Title Priority Date Filing Date
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel

Country Status (4)

Country Link
KR (9) KR20080075565A (ja)
CN (1) CN104152075B (ja)
TW (5) TW200913827A (ja)
WO (1) WO2004011356A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006126761A1 (en) * 2005-05-25 2006-11-30 Ls Cable Ltd. Adhesive film for semiconductor
US7815766B2 (en) * 2006-09-28 2010-10-19 Panasonic Corporation Apparatus and method for applying adhesive sheet
KR101019755B1 (ko) * 2009-07-15 2011-03-08 제일모직주식회사 다이접착필름, 다이접착필름 릴 장치 및 이를 포함하는 마운팅 장치
DE102010030815A1 (de) * 2010-07-01 2012-01-05 Voith Patent Gmbh Verfahren und Vorrichtung zum Verbinden von zwei Faserstoffbahnen
JP5318840B2 (ja) * 2010-11-08 2013-10-16 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体
JP5805411B2 (ja) 2011-03-23 2015-11-04 ファスフォードテクノロジ株式会社 ダイボンダのピックアップ方法およびダイボンダ
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
US9102851B2 (en) * 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
DE102012103586A1 (de) * 2012-04-24 2013-10-24 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zum Verbinden einer ersten Folienbahn und einer zweiten Folienbahn
JP5681911B2 (ja) * 2013-02-28 2015-03-11 株式会社ナベル 粘着テープ、テープの接続方法及び卵パック
JP6313575B2 (ja) * 2013-11-20 2018-04-18 デクセリアルズ株式会社 接着テープ構造体及び接着テープ収容体
KR101868033B1 (ko) * 2016-05-24 2018-06-15 조경국 코로나방전을 이용한 박리 시 소음방지형 접착테이프의 제조방법
US10457512B2 (en) 2016-09-19 2019-10-29 New Era Converting Machinery, Inc. Automatic lapless butt material splice
TWI624913B (zh) * 2017-04-11 2018-05-21 矽品精密工業股份有限公司 模封設備
JP7065555B2 (ja) * 2018-03-27 2022-05-12 日東電工株式会社 粘着テープ接合装置
CN108639816A (zh) * 2018-06-15 2018-10-12 鲁班嫡系机器人（深圳）有限公司 胶带转接件、送胶装置、送胶系统、控制装置及相关的方法
CN109334024A (zh) * 2018-11-25 2019-02-15 四川美立方门业有限公司 防火胶带和双面胶快速合成防火条装置
DE102019117180A1 (de) * 2019-06-26 2020-12-31 Hauni Maschinenbau Gmbh Vorrichtung und Verfahren zum Verbinden von zwei jeweils von einer Bobine ablaufenden Materialbahnen
CN110920083B (zh) * 2019-11-27 2021-08-10 湖南春意纺织有限责任公司 一种用于生产化纤织物织带的粘接装置
CN112757770A (zh) * 2021-01-09 2021-05-07 南京闻煜智能科技有限公司 一种丝网印刷机
CN113061398A (zh) * 2021-03-15 2021-07-02 零零壹(苏州)检测技术有限公司 导电胶带及其制备工艺、及使用该导电胶带的电路构建装置
CN117858368B (zh) * 2023-12-05 2024-06-07 湖南宏仁电子电路制造有限公司 一种软性线路板用覆盖膜压合设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4071388A (en) * 1973-11-26 1978-01-31 Sumitomo Electric Industries, Ltd. Impulse heat joining of wrapping tapes for wire cables
JPS6198784A (ja) * 1984-10-20 1986-05-17 Kimurashin Kk ロール状又は積層状の両面接着テープ
JPS62123607A (ja) * 1985-11-25 1987-06-04 シャープ株式会社 異方導電性テ−プの製造方法
JPS62169880A (ja) * 1986-01-22 1987-07-27 Kanzaki Paper Mfg Co Ltd 粘着シ−トの製造法
JP2745338B2 (ja) * 1990-10-03 1998-04-28 コニカ株式会社 ウエブの接合方法
JPH06164115A (ja) * 1992-11-27 1994-06-10 Casio Comput Co Ltd 異方導電性接着剤の転写方法
JPH07270742A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd テープ圧着装置
JPH08301533A (ja) * 1995-04-28 1996-11-19 Asahi Kogei Kk テープ巻回体
JPH09111196A (ja) * 1995-10-16 1997-04-28 Nitto Denko Corp 両面粘着材
JPH09301533A (ja) * 1996-05-14 1997-11-25 Toyo Kanetsu Kk 仕分装置
JP4111574B2 (ja) * 1997-10-22 2008-07-02 大日本印刷株式会社 巻取ユニットの装着装置
JP3707231B2 (ja) * 1998-02-26 2005-10-19 ソニーケミカル株式会社 異方性導電膜及びその製造方法
US6541089B1 (en) * 1999-08-24 2003-04-01 3M Innovative Properties Company Stretch releasing adhesive tape with integral pull tab
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
JP4246370B2 (ja) * 2000-11-08 2009-04-02 株式会社トンボ鉛筆 塗膜転写具
JP2002221905A (ja) * 2001-01-26 2002-08-09 Oji Tac Hanbai Kk 表示用透明粘着ラベルシート

Also Published As

Publication number Publication date
WO2004011356A1 (ja) 2004-02-05
KR20070063606A (ko) 2007-06-19
KR100953011B1 (ko) 2010-04-14
CN104152075B (zh) 2017-04-12
TW200913829A (en) 2009-03-16
TWI321973B (ja) 2010-03-11
KR20090099017A (ko) 2009-09-18
KR100981478B1 (ko) 2010-09-10
TW200409405A (en) 2004-06-01
KR20100013350A (ko) 2010-02-09
TWI321972B (ja) 2010-03-11
KR100700438B1 (ko) 2007-03-28
CN104152075A (zh) 2014-11-19
KR20080064886A (ko) 2008-07-09
KR20080075565A (ko) 2008-08-18
TWI322129B (ja) 2010-03-21
KR100970800B1 (ko) 2010-07-16
KR20060084453A (ko) 2006-07-24
KR20060084862A (ko) 2006-07-25
TW200913827A (en) 2009-03-16
KR20100041890A (ko) 2010-04-22
TW200823137A (en) 2008-06-01
TW200913828A (en) 2009-03-16
TWI321868B (ja) 2010-03-11
KR20080034028A (ko) 2008-04-17
KR100690379B1 (ko) 2007-03-12

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