TWI320957B - - Google Patents

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Publication number
TWI320957B
TWI320957B TW093139082A TW93139082A TWI320957B TW I320957 B TWI320957 B TW I320957B TW 093139082 A TW093139082 A TW 093139082A TW 93139082 A TW93139082 A TW 93139082A TW I320957 B TWI320957 B TW I320957B
Authority
TW
Taiwan
Prior art keywords
piezoelectric element
capillary
voltage
arm
current
Prior art date
Application number
TW093139082A
Other languages
English (en)
Chinese (zh)
Other versions
TW200529340A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200529340A publication Critical patent/TW200529340A/zh
Application granted granted Critical
Publication of TWI320957B publication Critical patent/TWI320957B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW093139082A 2004-02-20 2004-12-16 Wire bonding apparatus TW200529340A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004044575A JP2005236103A (ja) 2004-02-20 2004-02-20 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
TW200529340A TW200529340A (en) 2005-09-01
TWI320957B true TWI320957B (https=) 2010-02-21

Family

ID=34858064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139082A TW200529340A (en) 2004-02-20 2004-12-16 Wire bonding apparatus

Country Status (4)

Country Link
US (1) US7140529B2 (https=)
JP (1) JP2005236103A (https=)
KR (1) KR100666337B1 (https=)
TW (1) TW200529340A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
JP4558669B2 (ja) * 2006-03-17 2010-10-06 株式会社新川 ディスペンサへッド及びディスペンサヘッドの着地検出方法
US7896218B2 (en) 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5930419B2 (ja) * 2014-03-14 2016-06-08 株式会社カイジョー ボンディング装置
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245445B2 (ja) 1992-03-26 2002-01-15 株式会社新川 ワイヤボンデイング装置
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JP2527399B2 (ja) * 1992-09-29 1996-08-21 完テクノソニックス株式会社 ワイヤ―・ボンダ―・システム
US5360155A (en) * 1993-07-09 1994-11-01 Kabushiki Kaisha Shinkawa Wire bonding apparatus
EP1402607A1 (de) * 2001-06-15 2004-03-31 Schleuniger Holding AG Bearbeitungsvorrichtung für kabel oder drähte
US6644533B2 (en) * 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
JP2004047944A (ja) * 2002-05-22 2004-02-12 Nec Corp 接合装置および接合の良否判別方法を有する接合方法
JP3727616B2 (ja) * 2002-07-11 2005-12-14 株式会社新川 ワイヤボンディング装置

Also Published As

Publication number Publication date
KR20050083023A (ko) 2005-08-24
US20050184131A1 (en) 2005-08-25
JP2005236103A (ja) 2005-09-02
KR100666337B1 (ko) 2007-01-09
US7140529B2 (en) 2006-11-28
TW200529340A (en) 2005-09-01

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