KR100666337B1 - 와이어 본딩장치 - Google Patents

와이어 본딩장치 Download PDF

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Publication number
KR100666337B1
KR100666337B1 KR1020050004244A KR20050004244A KR100666337B1 KR 100666337 B1 KR100666337 B1 KR 100666337B1 KR 1020050004244 A KR1020050004244 A KR 1020050004244A KR 20050004244 A KR20050004244 A KR 20050004244A KR 100666337 B1 KR100666337 B1 KR 100666337B1
Authority
KR
South Korea
Prior art keywords
piezoelectric element
bonding
bonding arm
detector
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050004244A
Other languages
English (en)
Korean (ko)
Other versions
KR20050083023A (ko
Inventor
곤도유타카
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20050083023A publication Critical patent/KR20050083023A/ko
Application granted granted Critical
Publication of KR100666337B1 publication Critical patent/KR100666337B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
KR1020050004244A 2004-02-20 2005-01-17 와이어 본딩장치 Expired - Fee Related KR100666337B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004044575A JP2005236103A (ja) 2004-02-20 2004-02-20 ワイヤボンディング装置
JPJP-P-2004-00044575 2004-02-20

Publications (2)

Publication Number Publication Date
KR20050083023A KR20050083023A (ko) 2005-08-24
KR100666337B1 true KR100666337B1 (ko) 2007-01-09

Family

ID=34858064

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050004244A Expired - Fee Related KR100666337B1 (ko) 2004-02-20 2005-01-17 와이어 본딩장치

Country Status (4)

Country Link
US (1) US7140529B2 (https=)
JP (1) JP2005236103A (https=)
KR (1) KR100666337B1 (https=)
TW (1) TW200529340A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
JP4558669B2 (ja) * 2006-03-17 2010-10-06 株式会社新川 ディスペンサへッド及びディスペンサヘッドの着地検出方法
US7896218B2 (en) 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5930419B2 (ja) * 2014-03-14 2016-06-08 株式会社カイジョー ボンディング装置
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245445B2 (ja) 1992-03-26 2002-01-15 株式会社新川 ワイヤボンデイング装置
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JP2527399B2 (ja) * 1992-09-29 1996-08-21 完テクノソニックス株式会社 ワイヤ―・ボンダ―・システム
US5360155A (en) * 1993-07-09 1994-11-01 Kabushiki Kaisha Shinkawa Wire bonding apparatus
EP1402607A1 (de) * 2001-06-15 2004-03-31 Schleuniger Holding AG Bearbeitungsvorrichtung für kabel oder drähte
US6644533B2 (en) * 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
JP2004047944A (ja) * 2002-05-22 2004-02-12 Nec Corp 接合装置および接合の良否判別方法を有する接合方法
JP3727616B2 (ja) * 2002-07-11 2005-12-14 株式会社新川 ワイヤボンディング装置

Also Published As

Publication number Publication date
KR20050083023A (ko) 2005-08-24
US20050184131A1 (en) 2005-08-25
JP2005236103A (ja) 2005-09-02
TWI320957B (https=) 2010-02-21
US7140529B2 (en) 2006-11-28
TW200529340A (en) 2005-09-01

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