JP2005236103A - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
- Publication number
- JP2005236103A JP2005236103A JP2004044575A JP2004044575A JP2005236103A JP 2005236103 A JP2005236103 A JP 2005236103A JP 2004044575 A JP2004044575 A JP 2004044575A JP 2004044575 A JP2004044575 A JP 2004044575A JP 2005236103 A JP2005236103 A JP 2005236103A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- piezoelectric element
- bonding arm
- bonding
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78347—Piezoelectric transducers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】キャピラリ3をボンディングアーム1の軸線方向に振動させるように、ボンディングアーム1のキャピラリ取付部近傍に圧電素子4を組み込み、圧電素子4を圧電素子駆動電源11で駆動させるワイヤボンディング装置において、キャピラリ3が下降して接地した時に圧電素子4より発生する電圧を検出する検出器15と、検出器15で検出された電圧又は電流変化によってボンディングアーム1の下降を制御するボンディングアーム制御回路16とを備えている。
【選択図】 図1
Description
2 ワイヤ
3 キャピラリ
4 圧電素子
5 取付台座
6 予圧用ボルト
7 試料
10 圧電素子制御回路
11 圧電素子駆動電源
15 検出器
16 ボンディングアーム制御回路
Claims (3)
- キャピラリをボンディングアームの軸線方向に振動させるように、ボンディングアームのキャピラリ取付部近傍に圧電素子を組み込み、前記圧電素子を圧電素子駆動電源で駆動させるワイヤボンディング装置において、前記キャピラリが下降して接地した時に前記圧電素子より発生する電圧又は電流を検出する検出器と、この検出器で検出された電圧又は電流変化によって前記ボンディングアームの下降を制御するボンディングアーム制御回路とを備えたことを特徴とするワイヤボンディング装置。
- 前記検出器で電圧又は電流変化を検出した後に前記圧電素子を前記圧電素子駆動電源に接続させるスイッチ手段を有することを特徴とする請求項1記載のワイヤボンディング装置。
- キャピラリをボンディングアームの軸線方向に振動させるように、ボンディングアームのキャピラリ取付部近傍に圧電素子を組み込み、前記圧電素子を圧電素子駆動電源で駆動させるワイヤボンディング方法において、前記キャピラリが下降して接地した時に前記圧電素子より発生する電圧又は電流を検出し、この検出後に前記ボンディングアームの下降を緩やかに制御し、その後に前記圧電素子に電圧を印加して前記キャピラリを振動させながらボンディングを行うことを特徴とするワイヤボンディング方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044575A JP2005236103A (ja) | 2004-02-20 | 2004-02-20 | ワイヤボンディング装置 |
TW093139082A TW200529340A (en) | 2004-02-20 | 2004-12-16 | Wire bonding apparatus |
KR1020050004244A KR100666337B1 (ko) | 2004-02-20 | 2005-01-17 | 와이어 본딩장치 |
US11/061,270 US7140529B2 (en) | 2004-02-20 | 2005-02-17 | Wire bonding method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044575A JP2005236103A (ja) | 2004-02-20 | 2004-02-20 | ワイヤボンディング装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005236103A true JP2005236103A (ja) | 2005-09-02 |
Family
ID=34858064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004044575A Pending JP2005236103A (ja) | 2004-02-20 | 2004-02-20 | ワイヤボンディング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7140529B2 (ja) |
JP (1) | JP2005236103A (ja) |
KR (1) | KR100666337B1 (ja) |
TW (1) | TW200529340A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007250980A (ja) * | 2006-03-17 | 2007-09-27 | Shinkawa Ltd | ディスペンサへッド |
US20170005064A1 (en) * | 2014-03-14 | 2017-01-05 | Kaijo Corporation | Bonding device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4547330B2 (ja) * | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
US7896218B2 (en) * | 2007-06-28 | 2011-03-01 | Western Digital Technologies, Inc. | Apparatus and method for conductive metal ball bonding with electrostatic discharge detection |
US11798911B1 (en) * | 2022-04-25 | 2023-10-24 | Asmpt Singapore Pte. Ltd. | Force sensor in an ultrasonic wire bonding device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3245445B2 (ja) | 1992-03-26 | 2002-01-15 | 株式会社新川 | ワイヤボンデイング装置 |
US5230458A (en) * | 1992-06-23 | 1993-07-27 | National Semiconductor Corp. | Interconnect formation utilizing real-time feedback |
JP2527399B2 (ja) * | 1992-09-29 | 1996-08-21 | 完テクノソニックス株式会社 | ワイヤ―・ボンダ―・システム |
US5360155A (en) * | 1993-07-09 | 1994-11-01 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
US20040134965A1 (en) * | 2001-06-15 | 2004-07-15 | Jiri Stepan | Processing device for cables or wires |
US6644533B2 (en) * | 2001-07-03 | 2003-11-11 | Asm Technology Singapore Pte. Ltd. | Force sensing apparatus |
JP2004047944A (ja) * | 2002-05-22 | 2004-02-12 | Nec Corp | 接合装置および接合の良否判別方法を有する接合方法 |
JP3727616B2 (ja) * | 2002-07-11 | 2005-12-14 | 株式会社新川 | ワイヤボンディング装置 |
-
2004
- 2004-02-20 JP JP2004044575A patent/JP2005236103A/ja active Pending
- 2004-12-16 TW TW093139082A patent/TW200529340A/zh unknown
-
2005
- 2005-01-17 KR KR1020050004244A patent/KR100666337B1/ko not_active IP Right Cessation
- 2005-02-17 US US11/061,270 patent/US7140529B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007250980A (ja) * | 2006-03-17 | 2007-09-27 | Shinkawa Ltd | ディスペンサへッド |
JP4558669B2 (ja) * | 2006-03-17 | 2010-10-06 | 株式会社新川 | ディスペンサへッド及びディスペンサヘッドの着地検出方法 |
US20170005064A1 (en) * | 2014-03-14 | 2017-01-05 | Kaijo Corporation | Bonding device |
US9935078B2 (en) * | 2014-03-14 | 2018-04-03 | Kaijo Corporation | Bonding device |
Also Published As
Publication number | Publication date |
---|---|
TW200529340A (en) | 2005-09-01 |
US7140529B2 (en) | 2006-11-28 |
KR100666337B1 (ko) | 2007-01-09 |
KR20050083023A (ko) | 2005-08-24 |
TWI320957B (ja) | 2010-02-21 |
US20050184131A1 (en) | 2005-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6118960B2 (ja) | ワイヤボンディング装置及び半導体装置の製造方法 | |
JP6715402B2 (ja) | ワイヤボンディング方法及びワイヤボンディング装置 | |
JPWO2008139668A1 (ja) | 電子部品装着装置および電子部品装着方法 | |
JP2010010510A (ja) | ボンディング装置 | |
JP2004174710A (ja) | 振動絶縁手段を具える電動工具 | |
US7140529B2 (en) | Wire bonding method and apparatus | |
KR960009983B1 (ko) | 와이어 본딩장치 | |
JP2005286009A (ja) | パワー半導体モジュール寿命検知機能を有するモータ駆動装置 | |
EP1696455A3 (en) | Structure for stabilizing drive pulses and plasma display device using the same | |
JP2009147185A (ja) | ワイヤボンディング方法およびワイヤボンディング装置 | |
JP3818932B2 (ja) | ワイヤボンディング装置 | |
US5411195A (en) | Bonding apparatus | |
JP4830488B2 (ja) | 角速度センサ | |
US20090072664A1 (en) | Driving apparatus | |
JP4535235B2 (ja) | ワイヤボンディング装置 | |
JP2007053181A (ja) | ボンディングツールおよびボンディング装置 | |
JPH1154540A (ja) | ボンディング装置 | |
JP4337042B2 (ja) | 接合方法 | |
JP2981951B2 (ja) | ワイヤボンデイング装置 | |
CN117693400A (zh) | 包括力传感器的超声波焊接装置 | |
JP4508151B2 (ja) | ボンディング装置およびボンディング方法 | |
JP2767302B2 (ja) | ワイヤボンディング方法 | |
JPH07297222A (ja) | 半導体製造装置及び半導体製造方法 | |
JP4884142B2 (ja) | 電子部品装着ヘッド及び電子部品装着方法 | |
JP2006156813A (ja) | 超音波実装ツール及び電子部品の実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060414 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060414 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080130 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080325 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080507 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20081002 |