JP2005236103A - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置 Download PDF

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Publication number
JP2005236103A
JP2005236103A JP2004044575A JP2004044575A JP2005236103A JP 2005236103 A JP2005236103 A JP 2005236103A JP 2004044575 A JP2004044575 A JP 2004044575A JP 2004044575 A JP2004044575 A JP 2004044575A JP 2005236103 A JP2005236103 A JP 2005236103A
Authority
JP
Japan
Prior art keywords
piezoelectric element
capillary
bonding arm
bonding
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004044575A
Other languages
English (en)
Japanese (ja)
Inventor
Yutaka Kondo
豊 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004044575A priority Critical patent/JP2005236103A/ja
Priority to TW093139082A priority patent/TW200529340A/zh
Priority to KR1020050004244A priority patent/KR100666337B1/ko
Priority to US11/061,270 priority patent/US7140529B2/en
Publication of JP2005236103A publication Critical patent/JP2005236103A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2004044575A 2004-02-20 2004-02-20 ワイヤボンディング装置 Pending JP2005236103A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004044575A JP2005236103A (ja) 2004-02-20 2004-02-20 ワイヤボンディング装置
TW093139082A TW200529340A (en) 2004-02-20 2004-12-16 Wire bonding apparatus
KR1020050004244A KR100666337B1 (ko) 2004-02-20 2005-01-17 와이어 본딩장치
US11/061,270 US7140529B2 (en) 2004-02-20 2005-02-17 Wire bonding method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004044575A JP2005236103A (ja) 2004-02-20 2004-02-20 ワイヤボンディング装置

Publications (1)

Publication Number Publication Date
JP2005236103A true JP2005236103A (ja) 2005-09-02

Family

ID=34858064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004044575A Pending JP2005236103A (ja) 2004-02-20 2004-02-20 ワイヤボンディング装置

Country Status (4)

Country Link
US (1) US7140529B2 (https=)
JP (1) JP2005236103A (https=)
KR (1) KR100666337B1 (https=)
TW (1) TW200529340A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250980A (ja) * 2006-03-17 2007-09-27 Shinkawa Ltd ディスペンサへッド
US9935078B2 (en) * 2014-03-14 2018-04-03 Kaijo Corporation Bonding device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US7896218B2 (en) 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245445B2 (ja) 1992-03-26 2002-01-15 株式会社新川 ワイヤボンデイング装置
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JP2527399B2 (ja) * 1992-09-29 1996-08-21 完テクノソニックス株式会社 ワイヤ―・ボンダ―・システム
US5360155A (en) * 1993-07-09 1994-11-01 Kabushiki Kaisha Shinkawa Wire bonding apparatus
EP1402607A1 (de) * 2001-06-15 2004-03-31 Schleuniger Holding AG Bearbeitungsvorrichtung für kabel oder drähte
US6644533B2 (en) * 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
JP2004047944A (ja) * 2002-05-22 2004-02-12 Nec Corp 接合装置および接合の良否判別方法を有する接合方法
JP3727616B2 (ja) * 2002-07-11 2005-12-14 株式会社新川 ワイヤボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250980A (ja) * 2006-03-17 2007-09-27 Shinkawa Ltd ディスペンサへッド
US9935078B2 (en) * 2014-03-14 2018-04-03 Kaijo Corporation Bonding device

Also Published As

Publication number Publication date
KR20050083023A (ko) 2005-08-24
US20050184131A1 (en) 2005-08-25
KR100666337B1 (ko) 2007-01-09
TWI320957B (https=) 2010-02-21
US7140529B2 (en) 2006-11-28
TW200529340A (en) 2005-09-01

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