TWI320596B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TWI320596B TWI320596B TW095106344A TW95106344A TWI320596B TW I320596 B TWI320596 B TW I320596B TW 095106344 A TW095106344 A TW 095106344A TW 95106344 A TW95106344 A TW 95106344A TW I320596 B TWI320596 B TW I320596B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H10W40/70—
-
- H10W40/22—
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- H10W72/877—
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- H10W90/724—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005367211A JP4764159B2 (ja) | 2005-12-20 | 2005-12-20 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200725870A TW200725870A (en) | 2007-07-01 |
| TWI320596B true TWI320596B (en) | 2010-02-11 |
Family
ID=38173182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095106344A TWI320596B (en) | 2005-12-20 | 2006-02-24 | Semiconductor device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7813133B2 (zh) |
| JP (1) | JP4764159B2 (zh) |
| KR (1) | KR100824518B1 (zh) |
| CN (1) | CN100470794C (zh) |
| TW (1) | TWI320596B (zh) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7915081B2 (en) * | 2006-03-31 | 2011-03-29 | Intel Corporation | Flexible interconnect pattern on semiconductor package |
| TW200830488A (en) * | 2007-01-10 | 2008-07-16 | Siliconware Precision Industries Co Ltd | Heat-dissipating semiconductor package |
| US8362607B2 (en) * | 2009-06-03 | 2013-01-29 | Honeywell International Inc. | Integrated circuit package including a thermally and electrically conductive package lid |
| JP5447175B2 (ja) | 2010-05-17 | 2014-03-19 | 富士通セミコンダクター株式会社 | 半導体装置 |
| US8617926B2 (en) * | 2010-09-09 | 2013-12-31 | Advanced Micro Devices, Inc. | Semiconductor chip device with polymeric filler trench |
| JP5573645B2 (ja) * | 2010-12-15 | 2014-08-20 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
| DE102011004171A1 (de) * | 2011-02-15 | 2012-08-16 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement |
| JP2013115083A (ja) * | 2011-11-25 | 2013-06-10 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
| JP6036083B2 (ja) * | 2012-09-21 | 2016-11-30 | 株式会社ソシオネクスト | 半導体装置及びその製造方法並びに電子装置及びその製造方法 |
| US9245804B2 (en) * | 2012-10-23 | 2016-01-26 | Nxp B.V. | Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) |
| JP5708613B2 (ja) * | 2012-11-01 | 2015-04-30 | 株式会社豊田自動織機 | モジュール |
| KR20140115668A (ko) | 2013-03-21 | 2014-10-01 | 삼성전자주식회사 | 방열판과 수동 소자를 갖는 반도체 패키지 |
| US9799626B2 (en) * | 2014-09-15 | 2017-10-24 | Invensas Corporation | Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers |
| US9560737B2 (en) * | 2015-03-04 | 2017-01-31 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
| US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
| US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
| US10022896B2 (en) * | 2015-11-23 | 2018-07-17 | The Boeing Company | Controlling the heating of a composite part |
| US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
| US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
| US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
| DE102016222631A1 (de) * | 2016-11-17 | 2018-05-17 | Zf Friedrichshafen Ag | Leiterplattenanordnung mit einem elektrischen Bauteil und einem Kühlkörper |
| US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
| US11791237B2 (en) | 2018-06-27 | 2023-10-17 | Intel Corporation | Microelectronic assemblies including a thermal interface material |
| DE102019202903A1 (de) * | 2019-03-04 | 2020-09-10 | Abb Schweiz Ag | Elektronischer Konverter ausgebildet basierend auf Schweißtechnologien |
| US12166004B2 (en) | 2019-05-08 | 2024-12-10 | Intel Corporation | Solder thermal interface material (STIM) with dopant |
| US12272614B2 (en) | 2019-05-28 | 2025-04-08 | Intel Corporation | Integrated circuit packages with solder thermal interface materials with embedded particles |
| US11682605B2 (en) * | 2019-05-28 | 2023-06-20 | Intel Corporation | Integrated circuit packages with asymmetric adhesion material regions |
| KR20220018645A (ko) * | 2020-08-07 | 2022-02-15 | 삼성전기주식회사 | 전자 소자 모듈 |
| US12476166B2 (en) * | 2022-05-31 | 2025-11-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Inverted trapezoidal heat dissipating solder structure and method of making the same |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1252704B (it) * | 1991-12-20 | 1995-06-26 | Sgs Thomson Microelectronics | Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica avente superfici di contatto a rugosita' controllata e procedimento per la sua fabbricazione |
| US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
| KR970010673B1 (ko) * | 1994-03-24 | 1997-06-30 | 아남산업 주식회사 | 반도체용 방열판 표면구조 |
| EP0678917B1 (en) * | 1994-04-22 | 2003-06-25 | Nec Corporation | Supporting member for cooling means and electronic package using the same |
| US5686172A (en) * | 1994-11-30 | 1997-11-11 | Mitsubishi Gas Chemical Company, Inc. | Metal-foil-clad composite ceramic board and process for the production thereof |
| KR0142591B1 (ko) * | 1995-08-01 | 1998-07-01 | 정병천 | 합성수지재 볼을 이용한 수면상에서의 열에너지 보존율 및 폐수정화처리효과 극대화 방법 |
| JPH09306954A (ja) * | 1996-05-20 | 1997-11-28 | Hitachi Ltd | 半導体装置及びその実装方法並びに実装構造体 |
| JPH1060617A (ja) * | 1996-08-22 | 1998-03-03 | Suruzaa Meteko Japan Kk | 高速フレーム溶射方法 |
| US6225569B1 (en) * | 1996-11-15 | 2001-05-01 | Ngk Spark Plug Co., Ltd. | Wiring substrate and method of manufacturing the same |
| US5825087A (en) * | 1996-12-03 | 1998-10-20 | International Business Machines Corporation | Integral mesh flat plate cooling module |
| US6507116B1 (en) * | 1997-04-24 | 2003-01-14 | International Business Machines Corporation | Electronic package and method of forming |
| US5907474A (en) * | 1997-04-25 | 1999-05-25 | Advanced Micro Devices, Inc. | Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package |
| US5881945A (en) * | 1997-04-30 | 1999-03-16 | International Business Machines Corporation | Multi-layer solder seal band for semiconductor substrates and process |
| JP3241639B2 (ja) * | 1997-06-30 | 2001-12-25 | 日本電気株式会社 | マルチチップモジュールの冷却構造およびその製造方法 |
| JP3039488B2 (ja) | 1997-11-21 | 2000-05-08 | 日本電気株式会社 | 半導体装置 |
| US6204454B1 (en) * | 1997-12-27 | 2001-03-20 | Tdk Corporation | Wiring board and process for the production thereof |
| CN1236982A (zh) * | 1998-01-22 | 1999-12-01 | 株式会社日立制作所 | 压力接触型半导体器件及其转换器 |
| US6281573B1 (en) * | 1998-03-31 | 2001-08-28 | International Business Machines Corporation | Thermal enhancement approach using solder compositions in the liquid state |
| JPH11307356A (ja) * | 1998-04-23 | 1999-11-05 | Tokin Corp | フープ端子及び変成器 |
| US6111314A (en) * | 1998-08-26 | 2000-08-29 | International Business Machines Corporation | Thermal cap with embedded particles |
| JP2000114413A (ja) * | 1998-09-29 | 2000-04-21 | Sony Corp | 半導体装置、その製造方法および部品の実装方法 |
| US6876075B2 (en) * | 2000-03-15 | 2005-04-05 | Sumitomo Electric Industries, Ltd. | Aluminum-silicon carbide semiconductor substrate and method for producing the same |
| US6292369B1 (en) * | 2000-08-07 | 2001-09-18 | International Business Machines Corporation | Methods for customizing lid for improved thermal performance of modules using flip chips |
| US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
| JP2002217365A (ja) * | 2001-01-23 | 2002-08-02 | Mitsubishi Electric Corp | 半導体装置の製造方法および半導体装置 |
| JP3818102B2 (ja) * | 2001-08-31 | 2006-09-06 | 住友電気工業株式会社 | 放熱基板とその製造方法及び半導体装置 |
| US6617683B2 (en) * | 2001-09-28 | 2003-09-09 | Intel Corporation | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material |
| KR100447867B1 (ko) * | 2001-10-05 | 2004-09-08 | 삼성전자주식회사 | 반도체 패키지 |
| JP3836010B2 (ja) | 2001-10-19 | 2006-10-18 | 三菱電機株式会社 | 半導体装置 |
| KR100446290B1 (ko) * | 2001-11-03 | 2004-09-01 | 삼성전자주식회사 | 댐을 포함하는 반도체 패키지 및 그 제조방법 |
| US6665187B1 (en) * | 2002-07-16 | 2003-12-16 | International Business Machines Corporation | Thermally enhanced lid for multichip modules |
| US6936919B2 (en) * | 2002-08-21 | 2005-08-30 | Texas Instruments Incorporated | Heatsink-substrate-spacer structure for an integrated-circuit package |
| JP3934565B2 (ja) * | 2003-02-21 | 2007-06-20 | 富士通株式会社 | 半導体装置 |
| US7031162B2 (en) * | 2003-09-26 | 2006-04-18 | International Business Machines Corporation | Method and structure for cooling a dual chip module with one high power chip |
| US7180745B2 (en) * | 2003-10-10 | 2007-02-20 | Delphi Technologies, Inc. | Flip chip heat sink package and method |
| JP4086774B2 (ja) * | 2003-12-25 | 2008-05-14 | 三菱電機株式会社 | 半導体装置 |
| WO2006076604A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
| US7310233B2 (en) * | 2005-01-28 | 2007-12-18 | Tyco Electronics Power Systems | Apparatus and method for transferring heat from an electrical module |
-
2005
- 2005-12-20 JP JP2005367211A patent/JP4764159B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-23 US US11/359,996 patent/US7813133B2/en not_active Expired - Fee Related
- 2006-02-24 TW TW095106344A patent/TWI320596B/zh not_active IP Right Cessation
- 2006-03-13 KR KR1020060023270A patent/KR100824518B1/ko not_active Expired - Fee Related
- 2006-03-16 CN CNB2006100718031A patent/CN100470794C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200725870A (en) | 2007-07-01 |
| KR100824518B1 (ko) | 2008-04-22 |
| CN1988149A (zh) | 2007-06-27 |
| KR20070065763A (ko) | 2007-06-25 |
| US7813133B2 (en) | 2010-10-12 |
| CN100470794C (zh) | 2009-03-18 |
| JP4764159B2 (ja) | 2011-08-31 |
| JP2007173416A (ja) | 2007-07-05 |
| US20070139892A1 (en) | 2007-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |