TWI311820B - Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device - Google Patents

Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device Download PDF

Info

Publication number
TWI311820B
TWI311820B TW95119995A TW95119995A TWI311820B TW I311820 B TWI311820 B TW I311820B TW 95119995 A TW95119995 A TW 95119995A TW 95119995 A TW95119995 A TW 95119995A TW I311820 B TWI311820 B TW I311820B
Authority
TW
Taiwan
Prior art keywords
emitting element
light
iluumination
substrate
traffic signal
Prior art date
Application number
TW95119995A
Other languages
English (en)
Other versions
TW200705718A (en
Inventor
Kyosuke Takemoto
Ryuji Suzuki
Masakazu Ohashi
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005167492A external-priority patent/JP2006344690A/ja
Priority claimed from JP2005167494A external-priority patent/JP4064412B2/ja
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200705718A publication Critical patent/TW200705718A/zh
Application granted granted Critical
Publication of TWI311820B publication Critical patent/TWI311820B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
TW95119995A 2005-06-07 2006-06-06 Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device TWI311820B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005167492A JP2006344690A (ja) 2005-06-07 2005-06-07 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
JP2005167494A JP4064412B2 (ja) 2005-06-07 2005-06-07 発光素子実装用基板および発光素子モジュール

Publications (2)

Publication Number Publication Date
TW200705718A TW200705718A (en) 2007-02-01
TWI311820B true TWI311820B (en) 2009-07-01

Family

ID=37498423

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95119995A TWI311820B (en) 2005-06-07 2006-06-06 Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device

Country Status (5)

Country Link
US (1) US7699500B2 (zh)
EP (1) EP1890343A4 (zh)
KR (1) KR101017917B1 (zh)
TW (1) TWI311820B (zh)
WO (1) WO2006132222A1 (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101002430B1 (ko) * 2005-06-07 2010-12-21 가부시키가이샤후지쿠라 발광소자 실장용 법랑 기판, 발광소자 모듈, 조명 장치,표시 장치 및 교통 신호기
KR101017921B1 (ko) * 2005-06-13 2011-03-08 가부시키가이샤후지쿠라 발광 소자 실장용 기판, 발광 모듈 및 조명 장치
TW200802957A (en) * 2006-06-16 2008-01-01 Gigno Technology Co Ltd Light emitting diode module
TW200802956A (en) * 2006-06-16 2008-01-01 Gigno Technology Co Ltd Light emitting diode module
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
US7690812B2 (en) * 2007-03-16 2010-04-06 Cree, Inc. Apparatus and methods for conformable diffuse reflectors for solid state lighting devices
JP2009094282A (ja) * 2007-10-09 2009-04-30 Cosmo Electronics Corp ハイパワー発光ダイオード構造
TWI419357B (zh) * 2008-03-12 2013-12-11 Bright Led Electronics Corp Manufacturing method of light emitting module
KR20090100967A (ko) * 2008-03-21 2009-09-24 주식회사 루멘스 발광다이오드 패키지
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US8159131B2 (en) * 2008-06-30 2012-04-17 Bridgelux, Inc. Light emitting device having a transparent thermally conductive layer
EP2317569B1 (en) * 2008-08-21 2017-05-03 Panasonic Intellectual Property Management Co., Ltd. Light source for lighting
KR101515426B1 (ko) * 2008-11-11 2015-04-27 삼성디스플레이 주식회사 백라이트 어셈블리, 백라이트 어셈블리를 포함하는 액정 표시 장치, 및 이들의 제조 방법
TWI423421B (zh) * 2009-01-17 2014-01-11 Bright Led Electronics Corp A light emitting device and a manufacturing method thereof
TWM364281U (en) * 2009-04-28 2009-09-01 Kwo Ger Metal Technology Inc LED light-emitting module
US8348460B2 (en) * 2009-05-01 2013-01-08 Abl Ip Holding Llc Lighting apparatus with several light units arranged in a heatsink
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
KR101097811B1 (ko) * 2009-10-08 2011-12-23 엘지이노텍 주식회사 브라켓 일체형 방열 인쇄회로기판과 이를 구비한 샤시구조물
WO2011087168A1 (ko) * 2010-01-15 2011-07-21 삼성엘이디 주식회사 인쇄회로기판
US8469533B2 (en) * 2010-02-05 2013-06-25 Beijing AVC Technology Research Center Co., Ltd. Water-cooling heat dissipation system for LED signboard
KR101051065B1 (ko) * 2010-03-10 2011-07-21 일진반도체 주식회사 발광다이오드 패키지
GB2484713A (en) * 2010-10-21 2012-04-25 Optovate Ltd Illumination apparatus
US9739430B2 (en) * 2010-11-16 2017-08-22 Photon Holding Llc Systems, methods and/or devices for providing LED lighting
KR101883839B1 (ko) * 2010-12-07 2018-08-30 엘지이노텍 주식회사 발광소자 모듈 및 이를 포함하는 백라이트 유닛
CN102738316A (zh) * 2011-04-01 2012-10-17 惟昌企业股份有限公司 Led封装成形改良方法及由此制得的封装结构
US8608328B2 (en) * 2011-05-06 2013-12-17 Teledyne Technologies Incorporated Light source with secondary emitter conversion element
DE112012003235T5 (de) * 2011-08-05 2014-04-30 Osram Sylvania Inc. Kompaktes, thermisch verstärktes Substrat für Beleuchtungsanwendungen
JP5774432B2 (ja) * 2011-09-29 2015-09-09 北明電気工業株式会社 光源ユニット
KR101283068B1 (ko) * 2011-10-27 2013-07-05 엘지이노텍 주식회사 블랑켓 일체형 방열회로기판, 이을 포함하는 백라이트 유닛
KR101308090B1 (ko) * 2011-12-12 2013-09-12 (주)포인트엔지니어링 광 디바이스용 기판 제조 방법 및 이에 의해 제조된 광 디바이스용 기판
KR101368426B1 (ko) * 2012-07-27 2014-03-03 엔티이엔지 주식회사 Ｌｅｄ 모듈, ｌｅｄ 모듈 제조방법 및 이를 이용한 슬림 조명장치
JP6186877B2 (ja) * 2013-05-17 2017-08-30 セイコーエプソン株式会社 光源装置およびプロジェクター
ES2564141T3 (es) * 2013-06-14 2016-03-18 Saint-Gobain Glass France Substrato de OLED difusor transparente y método para producir tal substrato
US20150098222A1 (en) * 2013-10-03 2015-04-09 On-Q LLC Heat Sink
KR102203683B1 (ko) * 2014-04-10 2021-01-15 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광장치
CN104157637A (zh) * 2014-08-25 2014-11-19 北京大学东莞光电研究院 Mcob led封装结构
EP3032595A1 (en) * 2014-12-08 2016-06-15 Millennium Substrates Sdn Bhd A method of manufacturing chip-on-board and surface mount device LED substrate
CN107636390A (zh) 2015-03-20 2018-01-26 沙特基础工业全球技术公司 用于照明设备的塑料散热件
JP2015146325A (ja) * 2015-03-27 2015-08-13 北明電気工業株式会社 光源ユニット、トンネル用照明装置、街灯用照明装置
GB201705364D0 (en) 2017-04-03 2017-05-17 Optovate Ltd Illumination apparatus
GB201705365D0 (en) 2017-04-03 2017-05-17 Optovate Ltd Illumination apparatus
DE102017129311A1 (de) * 2017-12-08 2019-06-13 HELLA GmbH & Co. KGaA Verfahren zur Herstellung eines Leiterplatten-Kühlkörper-Aufbaus und Aufbau aus Leiterplatte und Kühlkörper hierzu
GB201800574D0 (en) 2018-01-14 2018-02-28 Optovate Ltd Illumination apparatus
GB201803767D0 (en) 2018-03-09 2018-04-25 Optovate Ltd Illumination apparatus
GB201807747D0 (en) 2018-05-13 2018-06-27 Optovate Ltd Colour micro-LED display apparatus
TW202102883A (zh) 2019-07-02 2021-01-16 美商瑞爾Ｄ斯帕克有限責任公司 定向顯示設備
CN114616498A (zh) 2019-08-23 2022-06-10 瑞尔D斯帕克有限责任公司 定向照明设备和防窥显示器
EP4028805A4 (en) 2019-09-11 2023-10-18 RealD Spark, LLC SWITCHABLE LIGHTING DEVICE AND VISION DISPLAY
WO2021050967A1 (en) 2019-09-11 2021-03-18 Reald Spark, Llc Directional illumination apparatus and privacy display
US11162661B2 (en) 2019-10-03 2021-11-02 Reald Spark, Llc Illumination apparatus comprising passive optical nanostructures
JP2022550938A (ja) 2019-10-03 2022-12-06 リアルディー スパーク エルエルシー 受動光学ナノ構造を含む照射装置
US11287562B2 (en) 2020-02-20 2022-03-29 Reald Spark, Llc Illumination apparatus including mask with plurality of apertures and display apparatus comprising same

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61190159U (zh) * 1985-05-21 1986-11-27
DE3525972A1 (de) 1985-07-20 1987-01-29 Standard Elektrik Lorenz Ag Emaillierungen mit heterogenem gefuege
JPS6299166A (ja) 1985-10-26 1987-05-08 Ricoh Co Ltd 光書込みヘツド
JPS6284942U (zh) * 1985-11-19 1987-05-30
JPS63107483U (zh) 1986-12-29 1988-07-11
JPS6486573A (en) 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
JPS6428886A (en) 1987-07-23 1989-01-31 Matsushita Electric Ind Co Ltd Hybrid integrated circuit board
JPS6428886U (zh) 1987-08-17 1989-02-21
JP2503778B2 (ja) 1988-10-07 1996-06-05 三菱マテリアル株式会社 半導体装置用基板
JPH04124891A (ja) * 1990-09-14 1992-04-24 Toshiba Corp 光素子モジュール半導体装置
JPH04129287A (ja) 1990-09-20 1992-04-30 Fujikura Ltd ネジ止め部を有するホウロウ基板
JPH0497367U (zh) * 1990-10-12 1992-08-24
JPH0621081U (ja) * 1992-02-25 1994-03-18 スタンレー電気株式会社 Ｌｅｄ表示器
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JPH1098215A (ja) * 1996-09-24 1998-04-14 Toyoda Gosei Co Ltd 発光ダイオード装置
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6006827A (en) 1998-12-28 1999-12-28 Hon Hai Precision Ind. Co., Ltd. Cooling device for computer component
JP3631031B2 (ja) 1999-01-26 2005-03-23 三洋電機株式会社 表示器及びその製造方法
JP2001044574A (ja) 1999-07-30 2001-02-16 Hamamatsu Photonics Kk 半導体レーザ装置
JP2001044517A (ja) * 1999-07-30 2001-02-16 Mitsubishi Electric Lighting Corp 発光装置
JP2001111158A (ja) 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
JP2001332769A (ja) 2000-05-22 2001-11-30 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JP2001332768A (ja) 2000-05-22 2001-11-30 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JP2002084029A (ja) 2000-09-11 2002-03-22 Canon Inc ヒートパイプを備えた半導体光素子
JP4737575B2 (ja) * 2001-01-30 2011-08-03 ハリソン東芝ライティング株式会社 発光ダイオードアレイ及び光源装置
CN100423296C (zh) 2001-09-03 2008-10-01 松下电器产业株式会社 半导体发光元件、发光装置及半导体发光元件的制造方法
JPWO2003030274A1 (ja) 2001-09-27 2005-01-20 日亜化学工業株式会社 発光装置およびその製造方法
US20030193055A1 (en) * 2002-04-10 2003-10-16 Martter Robert H. Lighting device and method
US20030219919A1 (en) 2002-05-23 2003-11-27 Wang Der-Nan Package method for enhancing the brightness of LED
JP4222011B2 (ja) * 2002-11-28 2009-02-12 東芝ライテック株式会社 Ｌｅｄ照明器具
DE10261908B4 (de) * 2002-12-27 2010-12-30 Osa Opto Light Gmbh Verfahren zur Herstellung eines konversionslichtemittierenden Elementes auf der Basis von Halbleiterlichtquellen
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
JP2005079065A (ja) 2003-09-03 2005-03-24 Seiko Epson Corp 光源装置、光源装置の製造方法、投射型表示装置
US6982518B2 (en) * 2003-10-01 2006-01-03 Enertron, Inc. Methods and apparatus for an LED light
US20050077616A1 (en) 2003-10-09 2005-04-14 Ng Kee Yean High power light emitting diode device
US7196459B2 (en) 2003-12-05 2007-03-27 International Resistive Co. Of Texas, L.P. Light emitting assembly with heat dissipating support
US7488096B2 (en) * 2004-01-30 2009-02-10 Hewlett-Packard Development Company, L.P. Integral reflector and heat sink
JP4198102B2 (ja) 2004-09-17 2008-12-17 株式会社リコー 半導体装置、並びに、画像読取ユニット、及び、画像形成装置
JP4037404B2 (ja) * 2004-11-19 2008-01-23 株式会社フジクラ 発光素子実装用基板とその製造方法
TWM302675U (en) * 2006-07-13 2006-12-11 Ind Tech Res Inst Light source devices
CN100572908C (zh) * 2006-11-17 2009-12-23 富准精密工业(深圳)有限公司 发光二极管灯具
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp

Also Published As

Publication number Publication date
EP1890343A1 (en) 2008-02-20
KR20080006641A (ko) 2008-01-16
KR101017917B1 (ko) 2011-03-04
TW200705718A (en) 2007-02-01
US7699500B2 (en) 2010-04-20
EP1890343A4 (en) 2014-04-23
WO2006132222A1 (ja) 2006-12-14
US20080130289A1 (en) 2008-06-05

Similar Documents

Publication Publication Date Title
TWI311820B (en) Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device
TWI333285B (en) Enamel substrate for mounting light emitting element, light emitting element module, illumination apparatus, display apparatus, and traffic signal device
EP1890340A4 (en) PORCELAIN ENHANCED SUBSTRATE FOR MOUNTING LIGHT EMITTING DEVICES, METHOD FOR PRODUCING SAME, LIGHT EMITTING DEVICE MODULE, LIGHTING DEVICE, TRAFFIC DISPLAY AND SIGNALING DEVICE
EP1890342A4 (en) SUBSTRATE FOR MOUNTING LIGHT EMITTING DEVICES AND LIGHT EMITTING DEVICE MODULE
EP1945073A4 (en) MOUNTING DEVICE
TWI351013B (en) Light-emitting device, circuit for driving the same, and electronic apparatus
TW577549U (en) Back light module for flat display device
TWI350406B (en) Liquid crystal device, light-emitting device, and electronic apparatus
EP1935723A4 (en) VEHICLE APPROVED DISPLAY DEVICE
HK1127432A1 (en) Display module and electronic device using the same
EP2023407A4 (en) ILLUMINATING ELEMENT BRACKET AND METHOD FOR THE PRODUCTION THEREOF, ILLUMINATING ELEMENT MODULE AND MANUFACTURING METHOD THEREFOR, DISPLAY, LIGHTING DEVICE AND TRAFFIC LIGHTING SYSTEM
IL166064A0 (en) Exhibiting device for advertisements
EP1970259A4 (en) MOUNTING STRUCTURE OF ELECTRONIC DEVICE
TWI318697B (en) Large substrate test system
EP1708153A4 (en) SIGNALING DEVICE
EP2023406A4 (en) ELECTROLUMINESCENT ELEMENT MOUNTING SUBSTRATE, LIGHT SOURCE, LIGHTING DEVICE, DISPLAY DEVICE, CIRCULATION LIGHT, AND METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT MOUNTING SUBSTRATE
GB2433446B (en) Device for mounting balloons
GB2440096B (en) Substrate and display device
AP2008004541A0 (en) Poster mounting
GB0504048D0 (en) Warning device for telecommunication devices
TWI351014B (en) Self-luminescent type display device
TWM292847U (en) Device for detecting signal module
GB0513664D0 (en) The ad-vid device (advertizing display device)
FR2885599B1 (fr) Dispositif de reperage de bouteilles
GB0422064D0 (en) Mounting device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees