TWI309446B - Electrical inspection method and apparatus of film carrier tape for mounting electronic parts - Google Patents

Electrical inspection method and apparatus of film carrier tape for mounting electronic parts Download PDF

Info

Publication number
TWI309446B
TWI309446B TW93132185A TW93132185A TWI309446B TW I309446 B TWI309446 B TW I309446B TW 93132185 A TW93132185 A TW 93132185A TW 93132185 A TW93132185 A TW 93132185A TW I309446 B TWI309446 B TW I309446B
Authority
TW
Taiwan
Prior art keywords
film
tape
electronic component
inspection
tensile force
Prior art date
Application number
TW93132185A
Other languages
English (en)
Chinese (zh)
Other versions
TW200520124A (en
Inventor
Masahiko Yamamoto
Yoshihiro Kouzan
Hisashi Fujino
Katsunori Deie
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200520124A publication Critical patent/TW200520124A/zh
Application granted granted Critical
Publication of TWI309446B publication Critical patent/TWI309446B/zh

Links

Landscapes

  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW93132185A 2003-10-24 2004-10-22 Electrical inspection method and apparatus of film carrier tape for mounting electronic parts TWI309446B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003364855A JP3947513B2 (ja) 2003-10-24 2003-10-24 電子部品実装用フィルムキャリアテープの電気検査装置および電子部品実装用フィルムキャリアテープの電気検査方法

Publications (2)

Publication Number Publication Date
TW200520124A TW200520124A (en) 2005-06-16
TWI309446B true TWI309446B (en) 2009-05-01

Family

ID=34643713

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93132185A TWI309446B (en) 2003-10-24 2004-10-22 Electrical inspection method and apparatus of film carrier tape for mounting electronic parts

Country Status (4)

Country Link
JP (1) JP3947513B2 (ja)
KR (1) KR20050039619A (ja)
CN (1) CN1609623A (ja)
TW (1) TWI309446B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105690995B (zh) * 2016-01-27 2017-05-31 深圳市宝尔威精密机械有限公司 Smt料带自动计数喷码机
TWI765607B (zh) * 2021-03-17 2022-05-21 英業達股份有限公司 基於網格聚類的錫膏印刷異常區域定位系統及其方法
CN115107360A (zh) * 2021-03-17 2022-09-27 英业达科技有限公司 基于网格聚类的锡膏印刷异常区域定位系统及其方法

Also Published As

Publication number Publication date
TW200520124A (en) 2005-06-16
JP3947513B2 (ja) 2007-07-25
JP2005127911A (ja) 2005-05-19
KR20050039619A (ko) 2005-04-29
CN1609623A (zh) 2005-04-27

Similar Documents

Publication Publication Date Title
TWI267934B (en) Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
TWI244459B (en) Film carrier tape for mounting electronic devices thereon
TWI483361B (zh) 半導體封裝基板以及半導體封裝結構
JP2006128641A (ja) Ｃｏｆ用フレキシブルプリント配線板及びその製造方法
KR20060046257A (ko) 도체 패턴의 전기검사용 전처리 방법, 도체 패턴의전기검사 방법, 도체 패턴의 전기검사용 전처리 장치, 도체패턴의 전기검사 장치, 검사완료 프린트 배선판, 및검사완료 반도체 장치
TW201022680A (en) Inspection probe
TWI309446B (en) Electrical inspection method and apparatus of film carrier tape for mounting electronic parts
JP2006202921A (ja) 半導体装置及びそれを用いた表示用モジュール
TWI253885B (en) Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
TW200422627A (en) Method of testing FPC bonding yield and FPC having testing pads thereon
JP2003262884A (ja) 液晶表示装置
JP2005231671A (ja) 電子部品実装用フィルムキャリアテープおよび半導体装置の検査装置および検査方法
JP3604355B2 (ja) 電子部品実装用フィルムキャリアテープの検査方法及び検査装置
JP4178869B2 (ja) 回路基板用部材および回路基板の製造方法
JP2005064265A (ja) Ｔａｂ用キャリアテープ
JP3663420B2 (ja) 蛇行テープの変形矯正方法および蛇行テープの変形矯正装置
JP4004998B2 (ja) フレキシブルプリント配線板の製造方法
JP2005005586A (ja) 電子部品実装用フィルムキャリアテープの検査装置および検査方法
JPH04331921A (ja) フレキシブル基板とその実装方法
TWI729362B (zh) 基板結構及其製作方法
JP2002039967A (ja) 電子部品実装用フィルムキャリアテープの検査方法及び検査装置
TWI262159B (en) Film carrier tape for mounting electronic devices thereon
KR100942479B1 (ko) 오토 핸들러
TW512234B (en) COF autohandler
JPH06249878A (ja) プローブユニット及びその製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees