JP2006202921A - 半導体装置及びそれを用いた表示用モジュール - Google Patents
半導体装置及びそれを用いた表示用モジュール Download PDFInfo
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- JP2006202921A JP2006202921A JP2005012069A JP2005012069A JP2006202921A JP 2006202921 A JP2006202921 A JP 2006202921A JP 2005012069 A JP2005012069 A JP 2005012069A JP 2005012069 A JP2005012069 A JP 2005012069A JP 2006202921 A JP2006202921 A JP 2006202921A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
【解決手段】 半導体装置は、フレキシブルフィルム上に形成された配線パターンと、少なくとも1つ実装された半導体素子に形成された、外部回路との接続のための電極とを接続してなるテープキャリアパッケージタイプからなる。フレキシブルフィルムは、フレキシブルフィルム材料のヤング率Eと厚さdの三乗との積が4.03×10-4(Pa・m)よりも小さく、かつフレキシブルフィルム材料のヤング率Eと厚さdとの積の逆数が4.42×10-6(Pa-1・m-1)よりも小さい値を有している。
【選択図】 図1
Description
d2y/d2x=M/E×I (式1)
で与えられる。ここで、Eは、フレキシブルフィルムのヤング率であり、Iは断面二次モーメントである。(式1)から、
M=(E×I)×(d2y/d2x)
∝E×I (式2)
したがって、(式2)により、曲げモーメントMはE×Iに比例することがわかる。このE×Iは、曲げ剛性と呼ばれるものである。すなわち、曲げ反力は、曲げ剛性E×Iに比例する。
曲げ剛性E×I=E×(a×d3)/12
∝E×d3 (式3)
となる。したがって、フレキシブルフィルムの単位幅にて比較した場合、(式3)に示す通り、材料の曲げ剛性はヤング率Eと厚さdの三乗との積に比例することが分かる。
E×d3≦k1 (式4)
となる定数k1を設定できることが分かる。
せん断応力=F/S=F/(a×d) (式5)
せん断応力=G×tan α≒G×α (式6)
ここで、
G=E/2(1+ν) (式7)
の関係があるので、この(式7)により、ポアソン比νが一定なら、せん断弾性係数Gはヤング率Eに比例する。したがって、(式6)は、
せん断応力≒G×α∝E×α (式8)
となる。この結果、(式5)=(式8)であるので、
ずれ角α∝F/((a×d)×E)
∝1/(E×d) (式9)
したがって、単位当りの幅でせん断力を一定として比較した場合、(式9)に示す通り、材料のずれ角αはヤング率Eと厚さdの積の逆数に比例することが分かる。
(E×d)-1≦k2 (式10)
となる定数k2を設定できることが分かる。
〔曲げ反力〕
COFは、主に表示用ガラスパネルと半導体素子及び回路基板との接続に用いられる。モジュール形態では、回路基板は表示用パネルの裏面側に折り曲げられることが多い。このため、モジュール形態におけるフレキシブル性や作業性の向上のため、COFには折り曲げ易さが求められる。
次に、搬送性(スプロケットホール強度)について、検討を行った。
フレキシブルフィルムは、どこででも折り曲げることができる特長を有し、実際に折り曲げて実装されることが殆どである。また、表示用モジュールの点灯検査で不良が発生した場合、不良の内容により、ガラスパネルからCOFを剥がして再びガラスパネルに接続することも行う。COFを剥がす際には、引き剥がし点において曲げ応力が働き、断線に至ってしまうこともある。したがって、フレキシブルフィルムには十分な折り曲げ性が求められる。
2 配線パターン
3 配線パターン
4 半導体素子
5 バンプ電極(電極)
8 スプロケットホール
10 半導体装置
11 異方性導電接着剤
20 液晶モジュール(表示用モジュール、液晶表示用モジュール)
21 液晶表示パネル(表示用パネル、外部回路)
21a TFT基板
21b カラーフィルタ基板
30 PW基板(回路基板)
d 厚さ(フィルム厚)
E ヤング率
Claims (7)
- フレキシブルフィルム上に形成された配線パターンと、少なくとも1つ実装された半導体素子に形成された、外部回路との接続のための電極とを接続してなるテープキャリアパッケージタイプの半導体装置において、
上記フレキシブルフィルムは、フレキシブルフィルム材料のヤング率とフィルム厚の三乗との積が4.03×10-4(Pa・m)よりも小さく、かつフレキシブルフィルム材料のヤング率とフィルム厚との積の逆数が4.42×10-6(Pa-1・m-1)よりも小さい値を有していることを特徴とする半導体装置。 - 前記フレキシブルフィルムは、高分子材料からなることを特徴とする請求項1記載の半導体装置。
- 前記フレキシブルフィルムの高分子材料は、ポリイミド、アクリル系、又はアラミド系樹脂であることを特徴とする請求項2記載の半導体装置。
- 前記フレキシブルフィルムのフィルム厚は、30μm以上35μm以下であることを特徴とする請求項1、2又は3記載の半導体装置。
- 請求項1〜4のいずれか1項に記載の半導体装置を用いた表示用モジュールであって、 表示用パネルと、
上記半導体装置に実装された半導体素子としての、表示用パネルに電気信号を供給する駆動用半導体素子とを備えていること特徴とする表示用モジュール。 - 前記半導体装置には、上記半導体装置に実装された前記半導体素子に電源を供給する回路基板が接続されていることを特徴とする請求項5記載の表示用モジュール。
- 前記表示パネルは、液晶表示パネルであることを特徴とする請求項5又は6記載の表示用モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005012069A JP2006202921A (ja) | 2005-01-19 | 2005-01-19 | 半導体装置及びそれを用いた表示用モジュール |
US11/333,231 US20060158861A1 (en) | 2005-01-19 | 2006-01-18 | Semiconductor device and display module using same |
KR1020060005354A KR100692324B1 (ko) | 2005-01-19 | 2006-01-18 | 반도체 장치 및 그것을 이용한 표시용 모듈 |
TW095102050A TW200722460A (en) | 2005-01-19 | 2006-01-19 | Semiconductor device and display module using same |
CNA2006100061284A CN1808229A (zh) | 2005-01-19 | 2006-01-19 | 半导体器件及使用了该器件的显示用模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005012069A JP2006202921A (ja) | 2005-01-19 | 2005-01-19 | 半導体装置及びそれを用いた表示用モジュール |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007293771A Division JP2008053762A (ja) | 2007-11-12 | 2007-11-12 | 半導体装置及びそれを用いた表示用モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006202921A true JP2006202921A (ja) | 2006-08-03 |
Family
ID=36683660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005012069A Pending JP2006202921A (ja) | 2005-01-19 | 2005-01-19 | 半導体装置及びそれを用いた表示用モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060158861A1 (ja) |
JP (1) | JP2006202921A (ja) |
KR (1) | KR100692324B1 (ja) |
CN (1) | CN1808229A (ja) |
TW (1) | TW200722460A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101415567B1 (ko) * | 2007-12-11 | 2014-07-04 | 삼성디스플레이 주식회사 | 가요성 인쇄 회로막 및 이를 포함하는 표시 장치 |
JP4906747B2 (ja) * | 2008-01-29 | 2012-03-28 | ルネサスエレクトロニクス株式会社 | 信頼性試験に用いられるテストボード及び信頼性試験方法 |
TWI438375B (zh) * | 2011-11-25 | 2014-05-21 | Lextar Electronics Corp | 光源模組及其光源組件 |
DE102011088216A1 (de) * | 2011-12-12 | 2013-06-13 | Continental Automotive Gmbh | Motorsteuergerät mit Opferstruktur |
KR102048467B1 (ko) * | 2013-04-03 | 2019-11-26 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
KR102132235B1 (ko) | 2013-11-28 | 2020-07-10 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 |
JP6439636B2 (ja) | 2015-09-10 | 2018-12-19 | 株式会社デンソー | プリント基板の製造方法 |
CN105278185A (zh) * | 2015-11-19 | 2016-01-27 | 深圳市华星光电技术有限公司 | 一种液晶屏-栅极cof结构组件及液晶显示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6433414B2 (en) * | 2000-01-26 | 2002-08-13 | Casio Computer Co., Ltd. | Method of manufacturing flexible wiring board |
CA2327801A1 (en) * | 2000-03-21 | 2001-09-21 | Rocky L. Hilburn | Copper on polymer component having improved adhesion |
TWI286629B (en) * | 2000-07-20 | 2007-09-11 | Samsung Electronics Co Ltd | Liquid crystal display device and flexible circuit board |
JP3994696B2 (ja) * | 2000-10-02 | 2007-10-24 | 宇部興産株式会社 | 線膨張係数を制御したポリイミドフィルム及び積層体 |
TW200626364A (en) * | 2004-09-29 | 2006-08-01 | Ube Industries | Polyimide film and polyimide composite sheet |
-
2005
- 2005-01-19 JP JP2005012069A patent/JP2006202921A/ja active Pending
-
2006
- 2006-01-18 US US11/333,231 patent/US20060158861A1/en not_active Abandoned
- 2006-01-18 KR KR1020060005354A patent/KR100692324B1/ko active IP Right Review Request
- 2006-01-19 TW TW095102050A patent/TW200722460A/zh unknown
- 2006-01-19 CN CNA2006100061284A patent/CN1808229A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1808229A (zh) | 2006-07-26 |
US20060158861A1 (en) | 2006-07-20 |
KR20060084384A (ko) | 2006-07-24 |
TW200722460A (en) | 2007-06-16 |
KR100692324B1 (ko) | 2007-03-12 |
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Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080208 |
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A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20080307 |