JP2006128641A - Cof用フレキシブルプリント配線板及びその製造方法 - Google Patents
Cof用フレキシブルプリント配線板及びその製造方法 Download PDFInfo
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Abstract
【解決手段】 絶縁層12と、この絶縁層12の少なくとも一方面に積層された導体層11をパターニングして形成されると共に半導体チップが実装される配線パターン21を具備するCOF用フレキシブルプリント配線板であって、前記絶縁層12の前記半導体チップが実装される側とは反対側の面上に、Si元素含有化合物を含有する離型剤により形成された離型層13が、波長分散型蛍光X線分析装置で検出されるSi強度が0.15〜2.5kcpsとなる膜厚で設けられている。
【選択図】 図1
Description
市販のポリイミド製のベースフィルムであるカプトンEN(商品名;東レ・デュポン社製)にNi−Cr合金をスパッタしてシード層を設け、その上にめっき法により銅層を形成した二層テープを用いて、エッチングにより配線パターン21を形成した後、離型剤として、シリカゾルを含有するコルコートP(商品名:コルコート株式会社製)を、図5に示すように、ロール状のコーター61を用いて、フィルムキャリアテープの半導体チップが実装される側とは反対側の面上に、フィルムキャリアテープの搬送速度分速1mで塗布し、スプロケットホールが形成されている両端部以外に離型層を形成した。乾燥後、ソルダーレジストを塗布し、離型層と絶縁保護層とを同時に加熱処理し、フィルムキャリアテープとした。このように形成された離型層は、波長分散型蛍光X線分析装置で検出されるSi強度が、0.5±0.1kcpsの均一な膜だった。このときのフィルムキャリアテープのツール付着温度は390℃であった。
コーター61へのフィルムの当接力を調整して、実施例1と同様にして、波長分散型蛍光X線分析装置で検出されるSi強度が、0.3±0.1kcpsの離型層を形成した。このときのツール付着温度は360℃であった。
コーター61へのフィルムの当接力を調整して、実施例1と同様にして、波長分散型蛍光X線分析装置で検出されるSi強度が、2.3±0.1kcpsの離型層を形成した。このときのツール付着温度は490℃であった。
コーター61での塗布をフィルムキャリアテープの半導体チップが実装される側とは反対側の面上に、フィルムキャリアテープの搬送速度分速1mとして、コーター61へのフィルムの当接力を調整して、実施例1と同様にして、波長分散型蛍光X線分析装置で検出されるSi強度が、0.05±0.05kcpsの離型層を形成した。このときのツール付着温度は320℃であった。
コーター61への当接力を調整して、実施例1と同様にして、波長分散型蛍光X線分析装置で検出されるSi強度が、2.7±0.1kcpsの離型層を形成した。このときのフィルムキャリアテープのツール付着温度は500℃であった。
実施例1及び比較例1について、600nmでの光透過率を測定したところ、透過率は、実施例1のフィルムでは69%であったのに対し、比較例1では65%であった。なお、銅をエッチングで除去して離型層を形成しないフィルムだけの透過率は65%であった。
実施例1〜3及び比較例2のフィルムにICチップを実装後、スペーサテープを介さずに直巻きし、7日間放置後、巻き出して切断し、パネル実装を行い、その後、ACF接着力を測定した。ACF接着力の測定方法は以下のとおりであり、結果は表1に示す。
11 導体層
12 絶縁層
13,13A 離型層
20 COFフィルムキャリアテープ(電子部品実装用フィルムキャリアテープ)
21 配線パターン
22 スプロケットホール
23 絶縁保護層
50 半導体チップ
51 バンプ
Claims (6)
- 絶縁層と、この絶縁層の少なくとも一方面に積層された導体層をパターニングして形成されると共に半導体チップが実装される配線パターンを具備するCOF用フレキシブルプリント配線板であって、前記絶縁層の前記半導体チップが実装される側とは反対側の面上に、Si元素含有化合物を含有する離型剤により形成された離型層が、波長分散型蛍光X線分析装置で検出されるSi強度が0.15〜2.5kcpsとなる膜厚で設けられていることを特徴とするCOF用フレキシブルプリント配線板。
- 請求項1において、前記離型層が、波長分散型蛍光X線分析装置で検出されるSi強度が0.3〜1.0kcpsとなる膜厚で設けられていることを特徴とするCOF用フレキシブルプリント配線板。
- 請求項1又は2において、前記離型層が、シラン化合物、及びシリカゾルから選択される少なくとも一種を含有する離型剤であることを特徴とするCOF用フレキシブルプリント配線板。
- 絶縁層と、この絶縁層の少なくとも一方面に積層された導体層をパターニングして形成されると共に半導体チップが実装される配線パターンを具備するCOF用フレキシブルプリント配線板の製造方法であって、前記絶縁層の前記半導体チップが実装される側とは反対側の面上にSi元素含有化合物を含有する離型剤により離型層を形成する際に、その膜厚が波長分散型蛍光X線分析装置で検出されるSi強度が0.15〜2.5kcpsとなるように設けることを特徴とするCOF用フレキシブルプリント配線板の製造方法。
- 請求項4において、前記離型層を、その膜厚が波長分散型蛍光X線分析装置で検出されるSi強度が0.3〜1.0kcpsとなるように設けることを特徴とするCOF用フレキシブルプリント配線板の製造方法。
- 請求項4又は5において、前記離型層として、シラン化合物、及びシリカゾルから選択される少なくとも一種を含有する離型剤を用いることを特徴とするCOF用フレキシブルプリント配線板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005271789A JP4109689B2 (ja) | 2004-09-29 | 2005-09-20 | Cof用フレキシブルプリント配線板の製造方法 |
US11/235,138 US7382042B2 (en) | 2004-09-29 | 2005-09-27 | COF flexible printed wiring board and method of producing the wiring board |
TW094133469A TWI297390B (en) | 2004-09-29 | 2005-09-27 | Cof flexible printed wiring board and method of producing the wiring board |
CNA200510131518XA CN1784113A (zh) | 2004-09-29 | 2005-09-29 | Cof用挠性印刷布线板及其制造方法 |
KR1020050090986A KR100649711B1 (ko) | 2004-09-29 | 2005-09-29 | Cof용 플렉서블 프린트배선판 및 그 제조방법 |
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JP2004285500 | 2004-09-29 | ||
JP2005271789A JP4109689B2 (ja) | 2004-09-29 | 2005-09-20 | Cof用フレキシブルプリント配線板の製造方法 |
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JP2006128641A true JP2006128641A (ja) | 2006-05-18 |
JP4109689B2 JP4109689B2 (ja) | 2008-07-02 |
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JP2005271789A Expired - Fee Related JP4109689B2 (ja) | 2004-09-29 | 2005-09-20 | Cof用フレキシブルプリント配線板の製造方法 |
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US (1) | US7382042B2 (ja) |
JP (1) | JP4109689B2 (ja) |
KR (1) | KR100649711B1 (ja) |
CN (1) | CN1784113A (ja) |
TW (1) | TWI297390B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015009994A (ja) * | 2013-06-26 | 2015-01-19 | 尾池工業株式会社 | 無機結晶膜積層体の製造方法 |
JP2015026773A (ja) * | 2013-07-29 | 2015-02-05 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
CN110718515A (zh) * | 2019-09-30 | 2020-01-21 | 深圳市华星光电技术有限公司 | 覆晶薄膜 |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR101002346B1 (ko) * | 2003-12-30 | 2010-12-20 | 엘지디스플레이 주식회사 | 칩 실장형 필름 패키지 |
JP4485460B2 (ja) * | 2004-12-16 | 2010-06-23 | 三井金属鉱業株式会社 | フレキシブルプリント配線板 |
JP4588748B2 (ja) * | 2007-09-25 | 2010-12-01 | Okiセミコンダクタ株式会社 | Cofパッケージ |
JP4510066B2 (ja) * | 2007-11-06 | 2010-07-21 | 日東電工株式会社 | 配線回路基板の製造方法および検査方法 |
JP2010239022A (ja) * | 2009-03-31 | 2010-10-21 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線基板及びこれを用いた半導体装置 |
KR20140133106A (ko) * | 2013-05-09 | 2014-11-19 | 삼성디스플레이 주식회사 | 상이한 배선 패턴부들을 포함한 칩 온 필름, 이를 구비한 가요성 표시 장치 및 가요성 표시 장치의 제조 방법 |
US10398377B2 (en) * | 2015-09-04 | 2019-09-03 | Japan Science And Technology Agency | Connector substrate, sensor system, and wearable sensor system |
TW201811557A (zh) * | 2016-06-21 | 2018-04-01 | 日商Jx金屬股份有限公司 | 附脫模層的銅箔、積層體、印刷配線板的製造方法及電子機器的製造方法 |
CN107645824B (zh) | 2016-07-22 | 2022-07-01 | Lg伊诺特有限公司 | 柔性电路板、覆晶薄膜模块和包括柔性电路板的电子设备 |
CN108933111B (zh) * | 2018-09-28 | 2020-03-31 | 上海天马有机发光显示技术有限公司 | 一种覆晶薄膜散热结构和一种显示装置 |
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JP3889700B2 (ja) * | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
US7173322B2 (en) * | 2002-03-13 | 2007-02-06 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and method of producing the wiring board |
JP3726964B2 (ja) * | 2002-11-01 | 2005-12-14 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
JP3914165B2 (ja) | 2002-03-13 | 2007-05-16 | 三井金属鉱業株式会社 | 離型層転写用フィルム及び積層フィルム並びにcof用フレキシブルプリント配線板の製造方法 |
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2005
- 2005-09-20 JP JP2005271789A patent/JP4109689B2/ja not_active Expired - Fee Related
- 2005-09-27 TW TW094133469A patent/TWI297390B/zh not_active IP Right Cessation
- 2005-09-27 US US11/235,138 patent/US7382042B2/en not_active Expired - Fee Related
- 2005-09-29 KR KR1020050090986A patent/KR100649711B1/ko not_active IP Right Cessation
- 2005-09-29 CN CNA200510131518XA patent/CN1784113A/zh active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015009994A (ja) * | 2013-06-26 | 2015-01-19 | 尾池工業株式会社 | 無機結晶膜積層体の製造方法 |
JP2015026773A (ja) * | 2013-07-29 | 2015-02-05 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
CN110718515A (zh) * | 2019-09-30 | 2020-01-21 | 深圳市华星光电技术有限公司 | 覆晶薄膜 |
WO2021062919A1 (zh) * | 2019-09-30 | 2021-04-08 | Tcl华星光电技术有限公司 | 覆晶薄膜及显示装置 |
Also Published As
Publication number | Publication date |
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TW200617371A (en) | 2006-06-01 |
TWI297390B (en) | 2008-06-01 |
US20060065956A1 (en) | 2006-03-30 |
KR100649711B1 (ko) | 2006-11-27 |
US7382042B2 (en) | 2008-06-03 |
JP4109689B2 (ja) | 2008-07-02 |
CN1784113A (zh) | 2006-06-07 |
KR20060051800A (ko) | 2006-05-19 |
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