TWI296138B - A semiconductor device and a method of manufacturing the same - Google Patents

A semiconductor device and a method of manufacturing the same Download PDF

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Publication number
TWI296138B
TWI296138B TW092114906A TW92114906A TWI296138B TW I296138 B TWI296138 B TW I296138B TW 092114906 A TW092114906 A TW 092114906A TW 92114906 A TW92114906 A TW 92114906A TW I296138 B TWI296138 B TW I296138B
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Taiwan
Prior art keywords
semiconductor wafer
semiconductor device
wire
wires
semiconductor
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Application number
TW092114906A
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English (en)
Chinese (zh)
Other versions
TW200406810A (en
Inventor
Ito Fujio
Suzuki Hiromichi
Original Assignee
Hitachi Ltd
Hitachi Ulsi Sys Co Ltd
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Application filed by Hitachi Ltd, Hitachi Ulsi Sys Co Ltd filed Critical Hitachi Ltd
Publication of TW200406810A publication Critical patent/TW200406810A/zh
Application granted granted Critical
Publication of TWI296138B publication Critical patent/TWI296138B/zh

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW092114906A 2002-06-07 2003-06-02 A semiconductor device and a method of manufacturing the same TWI296138B (en)

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US7067905B2 (en) * 2002-08-08 2006-06-27 Micron Technology, Inc. Packaged microelectronic devices including first and second casings
US20040137664A1 (en) * 2003-01-09 2004-07-15 Gidon Elazar Advanced packaging shell for pocketable consumer electronic devices
JP4407489B2 (ja) * 2004-11-19 2010-02-03 株式会社デンソー 半導体装置の製造方法ならびに半導体装置の製造装置
JP2007095804A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
KR100815013B1 (ko) * 2005-09-27 2008-03-18 토와 가부시기가이샤 전자부품의 수지밀봉 성형 방법 및 장치
US7863737B2 (en) * 2006-04-01 2011-01-04 Stats Chippac Ltd. Integrated circuit package system with wire bond pattern
US7926173B2 (en) 2007-07-05 2011-04-19 Occam Portfolio Llc Method of making a circuit assembly
WO2008138011A1 (en) * 2007-05-08 2008-11-13 Occam Portfolio Llc Electronic assemblies without solder and methods for their manufacture
US8300425B2 (en) * 2007-07-31 2012-10-30 Occam Portfolio Llc Electronic assemblies without solder having overlapping components
JP5334239B2 (ja) 2008-06-24 2013-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8212342B2 (en) * 2009-12-10 2012-07-03 Stats Chippac Ltd. Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
TWI416637B (zh) 2010-10-15 2013-11-21 南茂科技股份有限公司 晶片封裝結構及晶片封裝方法
US8946875B2 (en) * 2012-01-20 2015-02-03 Intersil Americas LLC Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems
TWI550823B (zh) * 2014-04-10 2016-09-21 南茂科技股份有限公司 晶片封裝結構
CN113496955A (zh) * 2020-04-01 2021-10-12 上海凯虹科技电子有限公司 一种塑封模具
US11621181B2 (en) * 2020-05-05 2023-04-04 Asmpt Singapore Pte. Ltd. Dual-sided molding for encapsulating electronic devices
US20250246521A1 (en) * 2024-01-29 2025-07-31 Nxp B.V. Semiconductor device with dual downset leadframe and method therefor

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US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
JP2954148B1 (ja) 1998-03-25 1999-09-27 松下電子工業株式会社 樹脂封止型半導体装置の製造方法およびその製造装置
JP3424184B2 (ja) 1998-05-13 2003-07-07 株式会社三井ハイテック 樹脂封止型半導体装置
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