TWI290505B - Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method - Google Patents

Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method Download PDF

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Publication number
TWI290505B
TWI290505B TW094112745A TW94112745A TWI290505B TW I290505 B TWI290505 B TW I290505B TW 094112745 A TW094112745 A TW 094112745A TW 94112745 A TW94112745 A TW 94112745A TW I290505 B TWI290505 B TW I290505B
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
mechanical polishing
water
polishing pad
grinding
Prior art date
Application number
TW094112745A
Other languages
English (en)
Chinese (zh)
Other versions
TW200600261A (en
Inventor
Yukio Hosaka
Yuuji Shimoyama
Hiroshi Shiho
Nobuo Kawahashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200600261A publication Critical patent/TW200600261A/zh
Application granted granted Critical
Publication of TWI290505B publication Critical patent/TWI290505B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094112745A 2004-04-21 2005-04-21 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method TWI290505B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004125064 2004-04-21

Publications (2)

Publication Number Publication Date
TW200600261A TW200600261A (en) 2006-01-01
TWI290505B true TWI290505B (en) 2007-12-01

Family

ID=34935462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112745A TWI290505B (en) 2004-04-21 2005-04-21 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method

Country Status (5)

Country Link
US (1) US20050239380A1 (ko)
EP (1) EP1588803A1 (ko)
KR (1) KR100640141B1 (ko)
CN (1) CN100537143C (ko)
TW (1) TWI290505B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
JP2007255277A (ja) * 2006-03-23 2007-10-04 Jtekt Corp カムフォロア
EP2083027B8 (en) * 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
TWI568541B (zh) * 2010-12-22 2017-02-01 Jsr Corp Chemical mechanical grinding method
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
JP2014095392A (ja) * 2012-11-07 2014-05-22 Toyota Motor Corp 歯車およびその製造方法
JP6010511B2 (ja) 2013-08-22 2016-10-19 株式会社荏原製作所 研磨パッドの表面粗さ測定方法
WO2018079788A1 (ja) * 2016-10-31 2018-05-03 京セラ株式会社 プローブカード用基板、プローブカード、および検査装置
CN109997085B (zh) * 2016-11-29 2021-12-24 京瓷株式会社 表壳体
CN109153107A (zh) * 2017-03-31 2019-01-04 古河电气工业株式会社 抛光垫
JP7083256B2 (ja) 2018-02-19 2022-06-10 富士電機株式会社 半導体モジュール及びその製造方法
JP7118841B2 (ja) * 2018-09-28 2022-08-16 富士紡ホールディングス株式会社 研磨パッド
US11759909B2 (en) * 2020-06-19 2023-09-19 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
CN112461265B (zh) * 2020-11-20 2023-03-24 大连理工大学 一种石英半球谐振子纳米制造方法
KR102512675B1 (ko) * 2020-12-30 2023-03-21 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08216029A (ja) 1995-02-07 1996-08-27 Daiki:Kk 精密研磨シート
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP3668046B2 (ja) 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3918359B2 (ja) 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
JP2000296461A (ja) * 1999-04-13 2000-10-24 Speedfam-Ipec Co Ltd バッキングパッド構造体
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6679769B2 (en) * 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP2003039329A (ja) * 2001-08-02 2003-02-13 Mitsubishi Materials Corp 単層砥石及びその製造方法
WO2003032379A1 (fr) * 2001-10-09 2003-04-17 Hitachi Chemical Co., Ltd. Element de polissage pour procede cmp, procede de polissage de substrat comprenant l'utilisation de cet element, et procede de production d'un element de polissage pour cmp
WO2003082524A1 (en) * 2002-03-25 2003-10-09 Thomas West, Inc Smooth pads for cmp and polishing substrates
US20030216111A1 (en) * 2002-05-20 2003-11-20 Nihon Microcoating Co., Ltd. Non-foamed polishing pad and polishing method therewith
JP4790973B2 (ja) * 2003-03-28 2011-10-12 Ｈｏｙａ株式会社 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板
JP2004303983A (ja) * 2003-03-31 2004-10-28 Fuji Photo Film Co Ltd 研磨パッド

Also Published As

Publication number Publication date
KR100640141B1 (ko) 2006-10-31
CN1699019A (zh) 2005-11-23
CN100537143C (zh) 2009-09-09
TW200600261A (en) 2006-01-01
US20050239380A1 (en) 2005-10-27
EP1588803A1 (en) 2005-10-26
KR20060047248A (ko) 2006-05-18

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