TWI287484B - Composition and method for polishing a sapphire surface - Google Patents

Composition and method for polishing a sapphire surface Download PDF

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Publication number
TWI287484B
TWI287484B TW095107298A TW95107298A TWI287484B TW I287484 B TWI287484 B TW I287484B TW 095107298 A TW095107298 A TW 095107298A TW 95107298 A TW95107298 A TW 95107298A TW I287484 B TWI287484 B TW I287484B
Authority
TW
Taiwan
Prior art keywords
sapphire
polishing
salt
weight
acid
Prior art date
Application number
TW095107298A
Other languages
English (en)
Chinese (zh)
Other versions
TW200635704A (en
Inventor
Isaac Cherian
Mukesh Desai
Kevin Moeggenborg
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200635704A publication Critical patent/TW200635704A/zh
Application granted granted Critical
Publication of TWI287484B publication Critical patent/TWI287484B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW095107298A 2005-03-04 2006-03-03 Composition and method for polishing a sapphire surface TWI287484B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65865305P 2005-03-04 2005-03-04

Publications (2)

Publication Number Publication Date
TW200635704A TW200635704A (en) 2006-10-16
TWI287484B true TWI287484B (en) 2007-10-01

Family

ID=37215174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107298A TWI287484B (en) 2005-03-04 2006-03-03 Composition and method for polishing a sapphire surface

Country Status (9)

Country Link
US (1) US20060196849A1 (https=)
EP (1) EP1868953A4 (https=)
JP (1) JP2008531319A (https=)
KR (1) KR20070114800A (https=)
CN (1) CN101511532A (https=)
CA (1) CA2599401A1 (https=)
IL (1) IL185418A0 (https=)
TW (1) TWI287484B (https=)
WO (1) WO2006115581A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9283648B2 (en) 2012-08-24 2016-03-15 Ecolab Usa Inc. Methods of polishing sapphire surfaces
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101159658B1 (ko) * 2006-12-28 2012-06-25 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판 연마 방법
JP5098483B2 (ja) * 2007-07-25 2012-12-12 住友金属鉱山株式会社 サファイア基板の研磨方法
US9120960B2 (en) 2007-10-05 2015-09-01 Saint-Gobain Ceramics & Plastics, Inc. Composite slurries of nano silicon carbide and alumina
CN101302403B (zh) * 2008-07-03 2011-10-19 大连理工大学 用于大尺寸金刚石晶圆超精密低损伤抛光的抛光液及制备方法
US8628385B2 (en) 2008-12-15 2014-01-14 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of use
JP5443192B2 (ja) * 2010-02-10 2014-03-19 株式会社ディスコ サファイア基板の加工方法
WO2011136387A1 (ja) * 2010-04-28 2011-11-03 株式会社バイコウスキージャパン サファイア研磨用スラリー、及びサファイアの研磨方法
CN102585705B (zh) * 2011-12-21 2014-02-05 上海新安纳电子科技有限公司 一种用于蓝宝石衬底的化学机械抛光液及其应用
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
CN103184010A (zh) * 2012-04-05 2013-07-03 铜陵市琨鹏光电科技有限公司 一种用于led用蓝宝石衬底片精密抛光的抛光液
CN102775916B (zh) * 2012-07-16 2015-01-07 芜湖海森材料科技有限公司 一种提高蓝宝石表面质量的抛光组合物
US9221289B2 (en) 2012-07-27 2015-12-29 Apple Inc. Sapphire window
CN102873590B (zh) * 2012-10-24 2015-07-15 广州普贺宝石饰品有限公司 黑曜石抛光方法
CN102911606A (zh) * 2012-11-10 2013-02-06 长治虹源科技晶片技术有限公司 一种蓝宝石抛光液及配制方法
US9232672B2 (en) 2013-01-10 2016-01-05 Apple Inc. Ceramic insert control mechanism
JP6436517B2 (ja) * 2013-02-20 2018-12-12 株式会社フジミインコーポレーテッド 研磨用組成物
CN103252708B (zh) * 2013-05-29 2016-01-06 南京航空航天大学 基于固结磨料抛光垫的蓝宝石衬底的超精密加工方法
US9388328B2 (en) 2013-08-23 2016-07-12 Diamond Innovations, Inc. Lapping slurry having a cationic surfactant
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
US9632537B2 (en) 2013-09-23 2017-04-25 Apple Inc. Electronic component embedded in ceramic material
US9678540B2 (en) 2013-09-23 2017-06-13 Apple Inc. Electronic component embedded in ceramic material
CN103753381B (zh) * 2013-11-12 2016-06-22 江苏吉星新材料有限公司 A-面蓝宝石晶片的表面抛光方法
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US9225056B2 (en) 2014-02-12 2015-12-29 Apple Inc. Antenna on sapphire structure
JP6506913B2 (ja) * 2014-03-31 2019-04-24 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
JP6408236B2 (ja) * 2014-04-03 2018-10-17 昭和電工株式会社 研磨組成物、及び該研磨組成物を用いた基板の研磨方法
CN208557082U (zh) * 2014-08-27 2019-03-01 苹果公司 一种电子设备和用于电子设备的盖
WO2016033417A1 (en) * 2014-08-29 2016-03-03 Cabot Microelectronics Corporation Composition and method for polishing a sapphire surface
WO2016060113A1 (ja) * 2014-10-14 2016-04-21 花王株式会社 サファイア板用研磨液組成物
JP6536176B2 (ja) * 2015-05-27 2019-07-03 日立化成株式会社 サファイア用研磨液、貯蔵液及び研磨方法
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
US10112278B2 (en) * 2015-09-25 2018-10-30 Apple Inc. Polishing a ceramic component using a formulated slurry
CN105462504A (zh) * 2015-12-11 2016-04-06 蓝思科技（长沙）有限公司 一种c向蓝宝石抛光液及其制备方法
RU2635132C1 (ru) * 2017-02-20 2017-11-09 Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") Полировальная суспензия для сапфировых подложек
US10377014B2 (en) 2017-02-28 2019-08-13 Ecolab Usa Inc. Increased wetting of colloidal silica as a polishing slurry
US10775889B1 (en) 2017-07-21 2020-09-15 Apple Inc. Enclosure with locally-flexible regions
CN110018028B (zh) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
CN119912878B (zh) * 2025-04-02 2025-06-10 芯越微电子材料(嘉兴)有限公司 一种化学机械抛光液及应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927316B2 (ja) * 1976-06-11 1984-07-04 日本電信電話株式会社 結晶の無じよう乱鏡面研摩方法
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
CA2039998A1 (en) * 1990-10-09 1992-04-10 Donald C. Zipperian Mechanochemical polishing abrasive
JPH10204416A (ja) * 1997-01-21 1998-08-04 Fujimi Inkooporeetetsudo:Kk 研磨用組成物
JP4132432B2 (ja) * 1999-07-02 2008-08-13 日産化学工業株式会社 研磨用組成物
US20040055993A1 (en) * 1999-10-12 2004-03-25 Moudgil Brij M. Materials and methods for control of stability and rheological behavior of particulate suspensions
KR100826072B1 (ko) * 2000-05-12 2008-04-29 닛산 가가쿠 고교 가부시키 가이샤 연마용 조성물
US7416680B2 (en) * 2001-10-12 2008-08-26 International Business Machines Corporation Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
US7306748B2 (en) * 2003-04-25 2007-12-11 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining ceramics
US7201784B2 (en) * 2003-06-30 2007-04-10 Intel Corporation Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics
US7968465B2 (en) * 2003-08-14 2011-06-28 Dupont Air Products Nanomaterials Llc Periodic acid compositions for polishing ruthenium/low K substrates
US7223156B2 (en) * 2003-11-14 2007-05-29 Amcol International Corporation Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces
KR101159658B1 (ko) * 2006-12-28 2012-06-25 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판 연마 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9283648B2 (en) 2012-08-24 2016-03-15 Ecolab Usa Inc. Methods of polishing sapphire surfaces
US9446493B2 (en) 2012-08-24 2016-09-20 Ecolab Usa Inc. Kit for polishing sapphire surfaces
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces

Also Published As

Publication number Publication date
JP2008531319A (ja) 2008-08-14
WO2006115581A2 (en) 2006-11-02
CA2599401A1 (en) 2006-11-02
EP1868953A4 (en) 2010-08-25
KR20070114800A (ko) 2007-12-04
CN101511532A (zh) 2009-08-19
US20060196849A1 (en) 2006-09-07
TW200635704A (en) 2006-10-16
IL185418A0 (en) 2008-01-06
EP1868953A2 (en) 2007-12-26
WO2006115581A3 (en) 2009-04-02

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MM4A Annulment or lapse of patent due to non-payment of fees