TWI286330B - Manufacturing method of ceramic printed circuit board and manufacturing method of electronic components using the same - Google Patents

Manufacturing method of ceramic printed circuit board and manufacturing method of electronic components using the same Download PDF

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Publication number
TWI286330B
TWI286330B TW093102219A TW93102219A TWI286330B TW I286330 B TWI286330 B TW I286330B TW 093102219 A TW093102219 A TW 093102219A TW 93102219 A TW93102219 A TW 93102219A TW I286330 B TWI286330 B TW I286330B
Authority
TW
Taiwan
Prior art keywords
light
photosensitive material
printed circuit
circuit board
exposure
Prior art date
Application number
TW093102219A
Other languages
English (en)
Chinese (zh)
Other versions
TW200423163A (en
Inventor
Masayuki Yoshida
Junichi Suto
Shunji Aoki
Genichi Watanabe
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200423163A publication Critical patent/TW200423163A/zh
Application granted granted Critical
Publication of TWI286330B publication Critical patent/TWI286330B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/127—Encapsulating or impregnating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW093102219A 2003-01-31 2004-01-30 Manufacturing method of ceramic printed circuit board and manufacturing method of electronic components using the same TWI286330B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003023245 2003-01-31
JP2003282557A JP3683891B2 (ja) 2003-01-31 2003-07-30 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法

Publications (2)

Publication Number Publication Date
TW200423163A TW200423163A (en) 2004-11-01
TWI286330B true TWI286330B (en) 2007-09-01

Family

ID=32828920

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102219A TWI286330B (en) 2003-01-31 2004-01-30 Manufacturing method of ceramic printed circuit board and manufacturing method of electronic components using the same

Country Status (4)

Country Link
US (1) US7540931B2 (https=)
JP (1) JP3683891B2 (https=)
TW (1) TWI286330B (https=)
WO (1) WO2004068516A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566657B (zh) * 2011-11-03 2017-01-11 製陶技術股份有限公司 製造陶瓷電路板的方法及陶瓷電路板

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US7467928B2 (en) * 2002-12-12 2008-12-23 Board Of Trustees Of The University Of Arkansas Microfluidic device utilizing magnetohydrodynamics and method for fabrication thereof
US20060091534A1 (en) 2002-12-13 2006-05-04 Matsushita Electric Industrial Co., Ltd. Chip part manufacturing method and chip parts
US20050079450A1 (en) * 2003-08-28 2005-04-14 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
JP2006173163A (ja) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd チップコイル
US20060163774A1 (en) * 2005-01-25 2006-07-27 Norbert Abels Methods for shaping green bodies and articles made by such methods
DE102010035488B4 (de) * 2010-08-26 2018-11-15 Snaptrack, Inc. Herstellung von keramischen Grünfolien sowie deren Verwendung zur Herstellung von Keramiken
CN103563486B (zh) * 2011-05-20 2016-01-27 松下知识产权经营株式会社 有机电致发光元件
KR20150005292A (ko) * 2013-07-05 2015-01-14 삼성전기주식회사 코일 부품
CN115116737A (zh) 2021-03-09 2022-09-27 Tdk株式会社 层叠线圈部件的制造方法
JP2022138107A (ja) * 2021-03-09 2022-09-22 Tdk株式会社 積層コイル部品の製造方法

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JP2005072539A (ja) 2003-08-28 2005-03-17 Tdk Corp セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4151846B2 (ja) * 2004-03-03 2008-09-17 Ｔｄｋ株式会社 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられるセラミックグリーンシートの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566657B (zh) * 2011-11-03 2017-01-11 製陶技術股份有限公司 製造陶瓷電路板的方法及陶瓷電路板

Also Published As

Publication number Publication date
TW200423163A (en) 2004-11-01
US7540931B2 (en) 2009-06-02
JP3683891B2 (ja) 2005-08-17
WO2004068516A1 (ja) 2004-08-12
US20060213602A1 (en) 2006-09-28
JP2004253771A (ja) 2004-09-09

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MM4A Annulment or lapse of patent due to non-payment of fees