ATE280742T1 - Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung - Google Patents

Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung

Info

Publication number
ATE280742T1
ATE280742T1 AT96917703T AT96917703T ATE280742T1 AT E280742 T1 ATE280742 T1 AT E280742T1 AT 96917703 T AT96917703 T AT 96917703T AT 96917703 T AT96917703 T AT 96917703T AT E280742 T1 ATE280742 T1 AT E280742T1
Authority
AT
Austria
Prior art keywords
production
light
ceramic
green film
ceramic green
Prior art date
Application number
AT96917703T
Other languages
English (en)
Inventor
Tomohiko Ogata
Takaki Masaki
Yuichiro Iguchi
Tuyosi Tanaka
Keiji Iwanaga
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Application granted granted Critical
Publication of ATE280742T1 publication Critical patent/ATE280742T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Materials For Photolithography (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Packages (AREA)
AT96917703T 1996-06-17 1996-06-17 Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung ATE280742T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1996/001658 WO1997048658A1 (en) 1996-06-17 1996-06-17 Photosensitive ceramic green sheet, ceramic package, and process for producing the same

Publications (1)

Publication Number Publication Date
ATE280742T1 true ATE280742T1 (de) 2004-11-15

Family

ID=14153421

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96917703T ATE280742T1 (de) 1996-06-17 1996-06-17 Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung

Country Status (6)

Country Link
US (1) US6159322A (de)
EP (1) EP0845445B1 (de)
KR (1) KR100418834B1 (de)
AT (1) ATE280742T1 (de)
DE (1) DE69633728T2 (de)
WO (1) WO1997048658A1 (de)

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DE69910335T2 (de) * 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
JP3394938B2 (ja) * 1999-03-25 2003-04-07 株式会社村田製作所 感光性導体ペースト
JP3882500B2 (ja) * 2000-03-02 2007-02-14 株式会社村田製作所 厚膜絶縁組成物およびそれを用いたセラミック電子部品、ならびに電子装置
US6417062B1 (en) * 2000-05-01 2002-07-09 General Electric Company Method of forming ruthenium oxide films
US6645424B2 (en) * 2000-06-12 2003-11-11 Guigne International Ltd. Combustion synthesis of glass (Al2O3-CaO-X-Y) ceramic (TiB2) composites
TW526693B (en) * 2000-06-15 2003-04-01 Murata Manufacturing Co Multilayer circuit component and method for manufacturing the same
JP4659329B2 (ja) * 2000-06-26 2011-03-30 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
KR100411253B1 (ko) * 2001-05-07 2003-12-18 삼성전기주식회사 다층 세라믹 소자의 제조방법
DE10126958A1 (de) * 2001-06-01 2002-12-05 Philips Corp Intellectual Pty Flüssigkristallbildschirm mit verbesserter Hintergrundbeleuchtung
US7156935B2 (en) * 2002-04-26 2007-01-02 Murata Manufacturing Co., Ltd. Method of manufacturing ceramic laminated body
US20040134875A1 (en) * 2002-11-22 2004-07-15 Kyocera Corporation Circuit-parts sheet and method of producing a multi-layer circuit board
JP3683891B2 (ja) * 2003-01-31 2005-08-17 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
US7641438B2 (en) * 2003-08-14 2010-01-05 Keyes Fibre Corporation Variable-sized molded product tray denesting apparatus
US20050079450A1 (en) * 2003-08-28 2005-04-14 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
JP2005072539A (ja) * 2003-08-28 2005-03-17 Tdk Corp セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4372493B2 (ja) * 2003-08-28 2009-11-25 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
EP1574491B1 (de) * 2004-03-11 2009-05-13 Corning Incorporated Keramikzusammensetzung mit einem Silsesquioxanpolymer
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
CN1906715B (zh) * 2004-12-20 2010-06-16 株式会社村田制作所 层压陶瓷电子元件及其制造方法
US7655864B2 (en) * 2006-07-13 2010-02-02 E.I Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
JP2008085034A (ja) * 2006-09-27 2008-04-10 Kyocera Corp 配線基板
KR100806755B1 (ko) * 2006-12-22 2008-02-27 요업기술원 감광성 저온 동시소성 세라믹 조성물 및 그 제조방법
DE102007063603B4 (de) * 2007-04-25 2009-11-12 Rainer Ronniger Verfahren und Vorrichtung zur Herstellung von keramischen Folien mit UV-LED
CN102944196B (zh) * 2012-11-02 2015-08-19 上海华力微电子有限公司 一种检测半导体圆形接触孔圆度的方法
KR101417445B1 (ko) * 2012-12-03 2014-07-08 송해근 중온 동시 소성용 마그네시아 세라믹 기판 조성물
US20140356637A1 (en) * 2013-05-29 2014-12-04 E I Du Pont De Nemours And Company Method of manufacturing a ceramic electronic component
CN114933486B (zh) * 2022-04-28 2023-07-28 辽宁大学 一种基于水基浆料的3d打印制备多孔陶瓷块体的方法

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Also Published As

Publication number Publication date
EP0845445B1 (de) 2004-10-27
DE69633728T2 (de) 2005-12-22
US6159322A (en) 2000-12-12
EP0845445A4 (de) 1999-10-27
EP0845445A1 (de) 1998-06-03
KR100418834B1 (ko) 2004-06-16
KR19990037659A (ko) 1999-05-25
WO1997048658A1 (en) 1997-12-24
DE69633728D1 (de) 2004-12-02

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