ATE73964T1 - Duennschicht-feldeffekttransistor mit kurzem kanal und verfahren zu seiner herstellung. - Google Patents
Duennschicht-feldeffekttransistor mit kurzem kanal und verfahren zu seiner herstellung.Info
- Publication number
- ATE73964T1 ATE73964T1 AT84112205T AT84112205T ATE73964T1 AT E73964 T1 ATE73964 T1 AT E73964T1 AT 84112205 T AT84112205 T AT 84112205T AT 84112205 T AT84112205 T AT 84112205T AT E73964 T1 ATE73964 T1 AT E73964T1
- Authority
- AT
- Austria
- Prior art keywords
- thin film
- field effect
- effect transistor
- manufacture
- channel field
- Prior art date
Links
- 230000005669 field effect Effects 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000010409 thin film Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78663—Amorphous silicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/557,773 US4654295A (en) | 1983-12-05 | 1983-12-05 | Method of making short channel thin film field effect transistor |
EP84112205A EP0151224B1 (de) | 1983-12-05 | 1984-10-11 | Dünnschicht-Feldeffekttransistor mit kurzem Kanal und Verfahren zu seiner Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE73964T1 true ATE73964T1 (de) | 1992-04-15 |
Family
ID=24226830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT84112205T ATE73964T1 (de) | 1983-12-05 | 1984-10-11 | Duennschicht-feldeffekttransistor mit kurzem kanal und verfahren zu seiner herstellung. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4654295A (de) |
EP (1) | EP0151224B1 (de) |
JP (1) | JPS60144973A (de) |
AT (1) | ATE73964T1 (de) |
CA (1) | CA1233571A (de) |
DE (1) | DE3485599D1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60164364A (ja) * | 1984-02-07 | 1985-08-27 | Seiko Instr & Electronics Ltd | 薄膜半導体装置の製造方法 |
US5063168A (en) * | 1986-07-02 | 1991-11-05 | National Semiconductor Corporation | Process for making bipolar transistor with polysilicon stringer base contact |
US4974046A (en) * | 1986-07-02 | 1990-11-27 | National Seimconductor Corporation | Bipolar transistor with polysilicon stringer base contact |
JP3255942B2 (ja) * | 1991-06-19 | 2002-02-12 | 株式会社半導体エネルギー研究所 | 逆スタガ薄膜トランジスタの作製方法 |
US5294520A (en) * | 1992-08-25 | 1994-03-15 | International Business Machines Corporation | Zero undercut etch process |
US5780922A (en) * | 1996-11-27 | 1998-07-14 | The Regents Of The University Of California | Ultra-low phase noise GE MOSFETs |
US6362097B1 (en) | 1998-07-14 | 2002-03-26 | Applied Komatsu Technlology, Inc. | Collimated sputtering of semiconductor and other films |
US6268621B1 (en) | 1999-08-03 | 2001-07-31 | International Business Machines Corporation | Vertical channel field effect transistor |
US6991987B1 (en) * | 2002-11-27 | 2006-01-31 | Advanced Micro Devices, Inc. | Method for producing a low defect homogeneous oxynitride |
JP3908213B2 (ja) * | 2003-09-30 | 2007-04-25 | 富士通株式会社 | レジストパターンの形成方法及び半導体装置の製造方法 |
WO2007142603A1 (en) * | 2006-06-09 | 2007-12-13 | Agency For Science, Technology And Research | An integrated shadow mask and method of fabrication thereof |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB967002A (en) * | 1961-05-05 | 1964-08-19 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
US3669661A (en) * | 1970-03-06 | 1972-06-13 | Westinghouse Electric Corp | Method of producing thin film transistors |
US3849136A (en) * | 1973-07-31 | 1974-11-19 | Ibm | Masking of deposited thin films by use of a masking layer photoresist composite |
DE2432719B2 (de) * | 1974-07-08 | 1977-06-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum erzeugen von feinen strukturen aus aufdampfbaren materialien auf einer unterlage und anwendung des verfahrens |
US4067724A (en) * | 1975-09-13 | 1978-01-10 | Bayer Aktiengesellschaft | N-(1,2,4-Triazin-5-on-4-yl)-glycines and herbicidal compositions |
US4265934A (en) * | 1975-12-12 | 1981-05-05 | Hughes Aircraft Company | Method for making improved Schottky-barrier gate gallium arsenide field effect devices |
US4045594A (en) * | 1975-12-31 | 1977-08-30 | Ibm Corporation | Planar insulation of conductive patterns by chemical vapor deposition and sputtering |
JPS53104185A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Production of semiconductor device |
US4212935A (en) * | 1978-02-24 | 1980-07-15 | International Business Machines Corporation | Method of modifying the development profile of photoresists |
US4293624A (en) * | 1979-06-26 | 1981-10-06 | The Perkin-Elmer Corporation | Method for making a mask useful in X-ray lithography |
JPS5648151A (en) * | 1979-09-26 | 1981-05-01 | Nec Corp | Wiring formation of semiconductor device |
JPS5669835A (en) * | 1979-11-09 | 1981-06-11 | Japan Electronic Ind Dev Assoc<Jeida> | Method for forming thin film pattern |
US4389481A (en) * | 1980-06-02 | 1983-06-21 | Xerox Corporation | Method of making planar thin film transistors, transistor arrays |
JPS5744143A (en) * | 1980-08-29 | 1982-03-12 | Tokyo Ohka Kogyo Co Ltd | Composition and method for forming micropattern |
US4376672A (en) * | 1981-10-26 | 1983-03-15 | Applied Materials, Inc. | Materials and methods for plasma etching of oxides and nitrides of silicon |
US4409262A (en) * | 1982-02-01 | 1983-10-11 | The United States Of America As Represented By The Secretary Of The Navy | Fabrication of submicron-wide lines with shadow depositions |
JPS58148458A (ja) * | 1982-03-01 | 1983-09-03 | Stanley Electric Co Ltd | 薄膜トランジスタ |
JPS58170067A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 薄膜トランジスタの製造方法 |
-
1983
- 1983-12-05 US US06/557,773 patent/US4654295A/en not_active Expired - Lifetime
-
1984
- 1984-10-11 AT AT84112205T patent/ATE73964T1/de not_active IP Right Cessation
- 1984-10-11 EP EP84112205A patent/EP0151224B1/de not_active Expired - Lifetime
- 1984-10-11 CA CA000465170A patent/CA1233571A/en not_active Expired
- 1984-10-11 DE DE8484112205T patent/DE3485599D1/de not_active Expired - Fee Related
- 1984-12-05 JP JP59257263A patent/JPS60144973A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS60144973A (ja) | 1985-07-31 |
EP0151224A2 (de) | 1985-08-14 |
EP0151224B1 (de) | 1992-03-18 |
DE3485599D1 (de) | 1992-04-23 |
CA1233571A (en) | 1988-03-01 |
US4654295A (en) | 1987-03-31 |
EP0151224A3 (en) | 1987-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |