DE3585048D1 - Verfahren und vorrichtung zur herstellung eines duennfilmes. - Google Patents

Verfahren und vorrichtung zur herstellung eines duennfilmes.

Info

Publication number
DE3585048D1
DE3585048D1 DE8585302794T DE3585048T DE3585048D1 DE 3585048 D1 DE3585048 D1 DE 3585048D1 DE 8585302794 T DE8585302794 T DE 8585302794T DE 3585048 T DE3585048 T DE 3585048T DE 3585048 D1 DE3585048 D1 DE 3585048D1
Authority
DE
Germany
Prior art keywords
producing
thin film
thin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585302794T
Other languages
English (en)
Inventor
Shigehiko Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3585048D1 publication Critical patent/DE3585048D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/203—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using physical deposition, e.g. vacuum deposition, sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
DE8585302794T 1984-04-24 1985-04-22 Verfahren und vorrichtung zur herstellung eines duennfilmes. Expired - Lifetime DE3585048D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59081121A JPS60225422A (ja) 1984-04-24 1984-04-24 薄膜形成方法およびその装置

Publications (1)

Publication Number Publication Date
DE3585048D1 true DE3585048D1 (de) 1992-02-13

Family

ID=13737548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585302794T Expired - Lifetime DE3585048D1 (de) 1984-04-24 1985-04-22 Verfahren und vorrichtung zur herstellung eines duennfilmes.

Country Status (5)

Country Link
US (1) US4639377A (de)
EP (1) EP0160479B1 (de)
JP (1) JPS60225422A (de)
KR (1) KR930010067B1 (de)
DE (1) DE3585048D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2578095B1 (fr) * 1985-02-28 1988-04-15 Avitaya Francois D Procede et dispositif de depot par croissance epitaxiale d'un materiau dope
US4800840A (en) * 1986-09-24 1989-01-31 Rockwell International Corporation Method and apparatus for vapor stream discrimination
JP3214505B2 (ja) * 1991-09-13 2001-10-02 株式会社デンソー 半導体装置の製造方法
DE4204650C1 (de) * 1992-02-15 1993-07-08 Hoffmeister, Helmut, Dr., 4400 Muenster, De
US5400739A (en) * 1992-10-09 1995-03-28 Texas Instruments Incorporated Method for controlling thin film growth of compound semiconductors using mass spectrometer detectors
US5330610A (en) * 1993-05-28 1994-07-19 Martin Marietta Energy Systems, Inc. Method of digital epilaxy by externally controlled closed-loop feedback

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2341827A (en) * 1944-02-15 Optical unit
US3168418A (en) * 1962-03-27 1965-02-02 Alloyd Electronics Device for monitoring and controlling evaporation rate in vacuum deposition
GB1010456A (en) * 1962-10-02 1965-11-17 G V Planer Ltd Means for measuring and/or controlling the evaporation rate in vacuum evaporation processes
US3347701A (en) * 1963-02-05 1967-10-17 Fujitsu Ltd Method and apparatus for vapor deposition employing an electron beam
DE1521247C3 (de) * 1965-03-10 1975-04-30 Fujitsu Ltd., Communications And Electronics, Tokio Vakuumbedampfungseinrichking mit einem lonenstrommeßfiihler zur Regelung der Verdampfungsgeschwindigkeit
US3419718A (en) * 1965-12-15 1968-12-31 Gulf General Atomic Inc Apparatus for measuring the flow of electrically neutral particles
CH490678A (fr) * 1967-04-21 1970-05-15 Battelle Development Corp Jauge de mesure de la vitesse d'évaporation sous vide
JPS5123950B1 (de) * 1970-01-30 1976-07-20
JPS5141546B2 (de) * 1972-01-21 1976-11-10
US4024399A (en) * 1975-01-06 1977-05-17 Jersey Nuclear-Avco Isotopes, Inc. Method and apparatus for measuring vapor flow in isotope separation
FR2370320A1 (fr) * 1976-11-05 1978-06-02 Thomson Csf Systeme de regulation de flux moleculaires, et son application aux techniques de co-evaporation
JPS5817607A (ja) * 1981-07-24 1983-02-01 Hitachi Condenser Co Ltd イオンプレ−テイング装置
JPS58185768A (ja) * 1982-04-23 1983-10-29 Shinko Seiki Kk 蒸発速度制御装置
CH651592A5 (de) * 1982-10-26 1985-09-30 Balzers Hochvakuum Dampfquelle fuer vakuumbedampfungsanlagen.

Also Published As

Publication number Publication date
EP0160479A2 (de) 1985-11-06
JPS60225422A (ja) 1985-11-09
KR930010067B1 (ko) 1993-10-14
EP0160479B1 (de) 1992-01-02
US4639377A (en) 1987-01-27
KR850007894A (ko) 1985-12-09
EP0160479A3 (en) 1988-03-30
JPH0458684B2 (de) 1992-09-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee