TWI275790B - Analysis method - Google Patents
Analysis method Download PDFInfo
- Publication number
- TWI275790B TWI275790B TW093111195A TW93111195A TWI275790B TW I275790 B TWI275790 B TW I275790B TW 093111195 A TW093111195 A TW 093111195A TW 93111195 A TW93111195 A TW 93111195A TW I275790 B TWI275790 B TW I275790B
- Authority
- TW
- Taiwan
- Prior art keywords
- bath
- working electrode
- range
- metal
- electrode
- Prior art date
Links
- 238000004458 analytical method Methods 0.000 title abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 238000007747 plating Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 24
- 229910052737 gold Inorganic materials 0.000 claims description 24
- 239000010931 gold Substances 0.000 claims description 24
- 238000005457 optimization Methods 0.000 claims description 23
- 238000009713 electroplating Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000011088 calibration curve Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 7
- 230000000087 stabilizing effect Effects 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000006641 stabilisation Effects 0.000 claims description 2
- 238000011105 stabilization Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 125000001475 halogen functional group Chemical group 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 238000005272 metallurgy Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000012074 organic phase Substances 0.000 claims 1
- 239000012071 phase Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000001755 vocal effect Effects 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 18
- 229910052697 platinum Inorganic materials 0.000 description 9
- 241001125862 Tinca tinca Species 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 7
- 244000007853 Sarothamnus scoparius Species 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 230000003321 amplification Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000010306 acid treatment Methods 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- -1 brightener Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 241000894007 species Species 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000003287 bathing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 206010011469 Crying Diseases 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000238413 Octopus Species 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000033558 biomineral tissue development Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- HWYADQRFBFBOKE-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co][W][W] HWYADQRFBFBOKE-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001523 electrospinning Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23G—THREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
- B23G1/00—Thread cutting; Automatic machines specially designed therefor
- B23G1/02—Thread cutting; Automatic machines specially designed therefor on an external or internal cylindrical or conical surface, e.g. on recesses
- B23G1/04—Machines with one working-spindle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23G—THREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
- B23G1/00—Thread cutting; Automatic machines specially designed therefor
- B23G1/44—Equipment or accessories specially designed for machines or devices for thread cutting
- B23G1/50—Equipment or accessories specially designed for machines or devices for thread cutting for cutting thread by successive operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23G—THREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
- B23G5/00—Thread-cutting tools; Die-heads
- B23G5/08—Thread-cutting tools; Die-heads with means for adjustment
- B23G5/083—Adjustable dies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
- G01N27/423—Coulometry
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23G—THREAD CUTTING; WORKING OF SCREWS, BOLT HEADS, OR NUTS, IN CONJUNCTION THEREWITH
- B23G2210/00—Details of threads produced
- B23G2210/08—External threads
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46538803P | 2003-04-25 | 2003-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200508605A TW200508605A (en) | 2005-03-01 |
| TWI275790B true TWI275790B (en) | 2007-03-11 |
Family
ID=32962779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093111195A TWI275790B (en) | 2003-04-25 | 2004-04-22 | Analysis method |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060151327A1 (enExample) |
| EP (1) | EP1471348A1 (enExample) |
| JP (1) | JP2004325441A (enExample) |
| KR (1) | KR20040092432A (enExample) |
| CN (1) | CN1550578A (enExample) |
| TW (1) | TWI275790B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004323971A (ja) * | 2003-04-25 | 2004-11-18 | Rohm & Haas Electronic Materials Llc | 改良された浴分析 |
| KR100649725B1 (ko) * | 2005-08-31 | 2006-11-27 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 에너지 회수장치 및 회수방법 |
| CN101470097B (zh) * | 2007-12-25 | 2013-05-29 | 比亚迪股份有限公司 | 一种电镀液中有机添加剂浓度的测定方法 |
| CN102272356A (zh) * | 2008-11-07 | 2011-12-07 | 克斯塔里克公司 | 电沉积液、系统及方法 |
| WO2011038463A1 (en) * | 2009-10-02 | 2011-04-07 | Newcastle Innovation Limited | Supercapacitor electrodes |
| JP5888152B2 (ja) * | 2012-07-05 | 2016-03-16 | 住友金属鉱山株式会社 | パラジウムめっき液の劣化状態評価方法、パラジウムめっき方法 |
| US9783908B2 (en) | 2012-10-23 | 2017-10-10 | Moses Lake Industries, Inc. | Plating bath metrology |
| JP6426336B2 (ja) * | 2013-10-25 | 2018-11-21 | 理研計器株式会社 | 定電位電解式ガスセンサ |
| CN103698384B (zh) * | 2013-12-17 | 2016-02-10 | 上海交通大学 | 深孔镀铜加速剂的测量方法 |
| EP2937686B1 (en) * | 2014-04-22 | 2017-03-08 | Rohm and Haas Electronic Materials LLC | Electroplating bath analysis |
| KR101711293B1 (ko) * | 2015-08-06 | 2017-03-03 | 서울대학교산학협력단 | 도금용액에 포함된 가속제 농도의 측정방법 |
| CA3092515A1 (en) * | 2018-03-23 | 2019-09-26 | Mara Nanotech Korea, Inc. | Methods of manufacturing biosensor nanowells |
| KR102101941B1 (ko) | 2018-03-23 | 2020-05-29 | 주식회사 마라나노텍코리아 | 바이오 센서 제조방법 |
| CN110872724A (zh) * | 2018-09-03 | 2020-03-10 | 东莞市脉拓表面处理科技有限公司 | 调配电镀药水的方法及装置 |
| CN114005759A (zh) * | 2021-10-29 | 2022-02-01 | 华天科技(宝鸡)有限公司 | 一种引线框架及其制备方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| US4132605A (en) * | 1976-12-27 | 1979-01-02 | Rockwell International Corporation | Method for evaluating the quality of electroplating baths |
| US4666567A (en) * | 1981-07-31 | 1987-05-19 | The Boeing Company | Automated alternating polarity pulse electrolytic processing of electrically conductive substances |
| US4479852A (en) * | 1983-01-21 | 1984-10-30 | International Business Machines Corporation | Method for determination of concentration of organic additive in plating bath |
| US4631116A (en) * | 1985-06-05 | 1986-12-23 | Hughes Aircraft Company | Method of monitoring trace constituents in plating baths |
| US4917774A (en) * | 1986-04-24 | 1990-04-17 | Shipley Company Inc. | Method for analyzing additive concentration |
| US4917777A (en) * | 1986-04-24 | 1990-04-17 | Shipley Company Inc. | Method for analyzing additive concentration |
| US4812210A (en) * | 1987-10-16 | 1989-03-14 | The United States Department Of Energy | Measuring surfactant concentration in plating solutions |
| US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
| US5049246A (en) * | 1989-06-20 | 1991-09-17 | Hull Harry F | Electrolytic processing apparatus and method with time multiplexed power supply |
| US5223118A (en) * | 1991-03-08 | 1993-06-29 | Shipley Company Inc. | Method for analyzing organic additives in an electroplating bath |
| US5192403A (en) * | 1991-05-16 | 1993-03-09 | International Business Machines Corporation | Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures |
| US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
| US5298132A (en) * | 1993-03-25 | 1994-03-29 | Hughes Aircraft Company | Method for monitoring purification treatment in plating baths |
| US5972192A (en) * | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
| US6365033B1 (en) * | 1999-05-03 | 2002-04-02 | Semitoof, Inc. | Methods for controlling and/or measuring additive concentration in an electroplating bath |
| US6471845B1 (en) * | 1998-12-15 | 2002-10-29 | International Business Machines Corporation | Method of controlling chemical bath composition in a manufacturing environment |
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| DE60113214T2 (de) * | 2000-11-02 | 2006-06-08 | Shipley Co., L.L.C., Marlborough | Plattierungsbadanalyse |
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| US6808611B2 (en) * | 2002-06-27 | 2004-10-26 | Applied Materials, Inc. | Methods in electroanalytical techniques to analyze organic components in plating baths |
| US6749739B2 (en) * | 2002-10-07 | 2004-06-15 | Eci Technology, Inc. | Detection of suppressor breakdown contaminants in a plating bath |
| US6709561B1 (en) * | 2002-11-06 | 2004-03-23 | Eci Technology, Inc. | Measurement of the concentration of a reducing agent in an electroless plating bath |
| US6673226B1 (en) * | 2002-12-20 | 2004-01-06 | Eci Technology | Voltammetric measurement of halide ion concentration |
-
2004
- 2004-03-29 JP JP2004095067A patent/JP2004325441A/ja active Pending
- 2004-04-16 EP EP20040252227 patent/EP1471348A1/en not_active Withdrawn
- 2004-04-21 KR KR1020040027367A patent/KR20040092432A/ko not_active Withdrawn
- 2004-04-22 TW TW093111195A patent/TWI275790B/zh not_active IP Right Cessation
- 2004-04-23 CN CNA2004100346913A patent/CN1550578A/zh active Pending
- 2004-04-24 US US10/831,761 patent/US20060151327A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20060151327A1 (en) | 2006-07-13 |
| TW200508605A (en) | 2005-03-01 |
| EP1471348A1 (en) | 2004-10-27 |
| CN1550578A (zh) | 2004-12-01 |
| JP2004325441A (ja) | 2004-11-18 |
| KR20040092432A (ko) | 2004-11-03 |
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