TWI274869B - Apparatus and method for inspecting bumps - Google Patents

Apparatus and method for inspecting bumps Download PDF

Info

Publication number
TWI274869B
TWI274869B TW094142738A TW94142738A TWI274869B TW I274869 B TWI274869 B TW I274869B TW 094142738 A TW094142738 A TW 094142738A TW 94142738 A TW94142738 A TW 94142738A TW I274869 B TWI274869 B TW I274869B
Authority
TW
Taiwan
Prior art keywords
image
bump
inspection
area
inspection area
Prior art date
Application number
TW094142738A
Other languages
English (en)
Chinese (zh)
Other versions
TW200630608A (en
Inventor
Yuji Akagi
Jun Onishi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200630608A publication Critical patent/TW200630608A/zh
Application granted granted Critical
Publication of TWI274869B publication Critical patent/TWI274869B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
TW094142738A 2005-02-25 2005-12-05 Apparatus and method for inspecting bumps TWI274869B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005051393A JP4577717B2 (ja) 2005-02-25 2005-02-25 バンプ検査装置および方法

Publications (2)

Publication Number Publication Date
TW200630608A TW200630608A (en) 2006-09-01
TWI274869B true TWI274869B (en) 2007-03-01

Family

ID=36935865

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142738A TWI274869B (en) 2005-02-25 2005-12-05 Apparatus and method for inspecting bumps

Country Status (4)

Country Link
JP (1) JP4577717B2 (ko)
KR (1) KR100719712B1 (ko)
CN (1) CN100470239C (ko)
TW (1) TWI274869B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346720B2 (ja) * 2009-07-10 2013-11-20 東レエンジニアリング株式会社 接合強度測定装置および接合強度測定方法
KR101654825B1 (ko) 2014-07-08 2016-09-22 (주)자비스 기판의 밀집 검사 부위의 엑스레이 검사 방법
KR20160006052A (ko) 2014-07-08 2016-01-18 (주)자비스 전자 기판의 엑스레이 검사 방법
KR20160011222A (ko) 2016-01-18 2016-01-29 (주)자비스 전자 기판의 엑스레이 검사 방법
KR102137186B1 (ko) 2017-01-20 2020-07-23 (주)자비스 전자 기판의 엑스레이 검사 방법
JP2022061127A (ja) * 2020-10-06 2022-04-18 東レエンジニアリング株式会社 外観検査装置および方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239005A (ja) * 1986-04-11 1987-10-19 Fuji Photo Film Co Ltd 表面形状検査装置
JP3051279B2 (ja) * 1993-05-13 2000-06-12 シャープ株式会社 バンプ外観検査方法およびバンプ外観検査装置
JPH07140090A (ja) * 1993-11-17 1995-06-02 Nichiden Mach Ltd 外観検査の項目判別方法
JP3515199B2 (ja) * 1995-01-06 2004-04-05 大日本スクリーン製造株式会社 欠陥検査装置
JPH11218499A (ja) * 1998-02-03 1999-08-10 Hitachi Denshi Ltd 外観検査装置およびその画像処理方法
JP2001176907A (ja) * 1999-12-16 2001-06-29 Shinko Electric Ind Co Ltd バンプ検査装置
JP4546607B2 (ja) * 2000-04-18 2010-09-15 パナソニック株式会社 良品パターン登録方法及びパターン検査方法
JP2002358509A (ja) * 2001-06-01 2002-12-13 Dainippon Screen Mfg Co Ltd 穴検査装置
JP2003065970A (ja) * 2001-08-27 2003-03-05 Nec Corp 異物検査方法およびその装置

Also Published As

Publication number Publication date
KR100719712B1 (ko) 2007-05-17
JP4577717B2 (ja) 2010-11-10
CN100470239C (zh) 2009-03-18
JP2006234667A (ja) 2006-09-07
KR20060094844A (ko) 2006-08-30
TW200630608A (en) 2006-09-01
CN1825095A (zh) 2006-08-30

Similar Documents

Publication Publication Date Title
JP6447637B2 (ja) 表面欠陥検出装置、表面欠陥検出方法、及び鋼材の製造方法
TWI274869B (en) Apparatus and method for inspecting bumps
TWI255338B (en) Technique for detecting a defect of an object by area segmentation of a color image of the object
TWI303311B (en) Inspecting method and apparatus thereof
TWI290747B (en) Inspecting method and apparatus thereof
US11210773B2 (en) Information processing apparatus, information processing method, and storage medium for defect inspection and detection
JP6079948B1 (ja) 表面欠陥検出装置および表面欠陥検出方法
JP2017009523A (ja) 表面欠陥検出方法、表面欠陥検出装置、及び鋼材の製造方法
JP2015535108A (ja) デジタル画像における錠剤の認識のための適応色補正のシステム及び方法
WO2016208626A1 (ja) 表面欠陥検出方法、表面欠陥検出装置、及び鋼材の製造方法
JP2019114146A (ja) 鉄筋検査支援装置
US20100060903A1 (en) Image Measuring Apparatus and Computer Program
JP2010091361A (ja) 画像検査方法および画像検査装置
JP2007155405A (ja) 外観検査方法及び外観検査装置
JP5509465B2 (ja) ガラスびん検査装置
KR20160105082A (ko) 기판 검사 장치 및 그 검사 방법
WO2018033898A1 (ko) 볼 그리드 어레이형 반도체 칩 패키지의 검사 방법
US8055056B2 (en) Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the same
JP2002288633A (ja) 画像処理装置およびその位置補正方法
JP2006145415A (ja) 表面検査方法及び装置
JP2010091360A (ja) 画像検査方法および画像検査装置
JP4218291B2 (ja) 画像処理装置
JP2000249658A (ja) 検査装置
JPH11101622A (ja) 圧着端子検査装置
JP2004170374A (ja) 表面欠陥検出装置、及び表面欠陥検出方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees