TWI266734B - Thin-plate supporting container - Google Patents
Thin-plate supporting container Download PDFInfo
- Publication number
- TWI266734B TWI266734B TW093114854A TW93114854A TWI266734B TW I266734 B TWI266734 B TW I266734B TW 093114854 A TW093114854 A TW 093114854A TW 93114854 A TW93114854 A TW 93114854A TW I266734 B TWI266734 B TW I266734B
- Authority
- TW
- Taiwan
- Prior art keywords
- thin plate
- shaped groove
- support
- semiconductor wafer
- container
- Prior art date
Links
- 239000013589 supplement Substances 0.000 claims description 28
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 213
- 239000004065 semiconductor Substances 0.000 abstract description 167
- 230000002093 peripheral effect Effects 0.000 abstract description 13
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000005192 partition Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S206/00—Special receptacle or package
- Y10S206/832—Semiconductor wafer boat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003403663 | 2003-12-02 | ||
| JP2003421482A JP4681221B2 (ja) | 2003-12-02 | 2003-12-18 | 薄板支持容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200519004A TW200519004A (en) | 2005-06-16 |
| TWI266734B true TWI266734B (en) | 2006-11-21 |
Family
ID=34467841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093114854A TWI266734B (en) | 2003-12-02 | 2004-05-26 | Thin-plate supporting container |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7357258B2 (fr) |
| EP (1) | EP1538662A3 (fr) |
| JP (1) | JP4681221B2 (fr) |
| KR (1) | KR20050053306A (fr) |
| CN (1) | CN100410154C (fr) |
| TW (1) | TWI266734B (fr) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI239931B (en) | 2003-05-19 | 2005-09-21 | Miraial Co Ltd | Lid unit for thin plate supporting container and thin plate supporting container |
| TWI276580B (en) * | 2003-12-18 | 2007-03-21 | Miraial Co Ltd | Lid unit for thin-plate supporting container |
| JP4789566B2 (ja) * | 2005-09-30 | 2011-10-12 | ミライアル株式会社 | 薄板保持容器及び薄板保持容器用処理装置 |
| US8365919B2 (en) * | 2005-12-29 | 2013-02-05 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
| US7422107B2 (en) * | 2006-01-25 | 2008-09-09 | Entegris, Inc. | Kinematic coupling with textured contact surfaces |
| US9675040B2 (en) * | 2006-07-13 | 2017-06-13 | California Institute Of Technology | Dual spectrum illuminator for containers |
| US20080157455A1 (en) * | 2006-12-29 | 2008-07-03 | Applied Materials, Inc. | Compliant substrate holding assembly |
| JP2011510491A (ja) * | 2008-01-13 | 2011-03-31 | インテグリス・インコーポレーテッド | 大口径のウエハ容器とウエハ取扱方法 |
| TWI337162B (en) * | 2008-07-31 | 2011-02-11 | Gudeng Prec Industral Co Ltd | A wafer container with constraints |
| CN102858653B (zh) * | 2010-05-24 | 2014-09-10 | 未来儿株式会社 | 基板收纳容器 |
| TWI465375B (zh) * | 2010-06-02 | 2014-12-21 | Gudeng Prec Industral Co Ltd | 一種配置有彈性件模組之晶圓盒 |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US8960442B2 (en) * | 2011-11-08 | 2015-02-24 | Miraial Co., Ltd. | Wafer storing container |
| WO2014064774A1 (fr) * | 2012-10-23 | 2014-05-01 | ミライアル株式会社 | Récipient de stockage de substrat |
| KR101408669B1 (ko) * | 2012-10-30 | 2014-07-02 | 주식회사 삼에스코리아 | 박판 수납용기 |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| JP6430195B2 (ja) * | 2014-09-29 | 2018-11-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板収納容器 |
| JP6391515B2 (ja) * | 2015-03-27 | 2018-09-19 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US11309200B2 (en) | 2017-02-27 | 2022-04-19 | Miraial Co., Ltd. | Substrate storage container |
| WO2018185894A1 (fr) * | 2017-04-05 | 2018-10-11 | ミライアル株式会社 | Récipient de stockage de carte |
| KR102605057B1 (ko) * | 2017-04-06 | 2023-11-24 | 미라이얼 가부시키가이샤 | 기판 수납 용기 |
| US11222800B2 (en) * | 2017-08-09 | 2022-01-11 | Mtraial Co., Ltd. | Substrate storage container |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| JP7085623B2 (ja) * | 2018-06-12 | 2022-06-16 | 東京エレクトロン株式会社 | 基板処理方法 |
| CN114287055A (zh) * | 2019-07-19 | 2022-04-05 | 恩特格里斯公司 | 晶片缓冲器 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4793488A (en) * | 1987-07-07 | 1988-12-27 | Empak, Inc. | Package for semiconductor wafers |
| JPH01274446A (ja) * | 1988-04-26 | 1989-11-02 | Nippon Steel Corp | ウェーハ保持用かご |
| US5207324A (en) * | 1991-03-08 | 1993-05-04 | Fluoroware, Inc. | Wafer cushion for shippers |
| JPH05251548A (ja) * | 1992-03-03 | 1993-09-28 | Mitsubishi Electric Corp | 半導体ウェハ収納容器 |
| JP3177003B2 (ja) * | 1992-07-31 | 2001-06-18 | 住友金属工業株式会社 | 半導体ウェーハの輸送用容器 |
| JPH0679152U (ja) * | 1993-04-22 | 1994-11-04 | 株式会社大八化成 | 半導体ウエーハ運搬用容器の構造 |
| US5816410A (en) * | 1994-07-15 | 1998-10-06 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
| JP2779143B2 (ja) * | 1995-03-17 | 1998-07-23 | 信越ポリマー株式会社 | 半導体ウェーハ収納容器 |
| US5874767A (en) * | 1996-05-14 | 1999-02-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device including a lateral power device |
| JPH1126567A (ja) * | 1997-07-03 | 1999-01-29 | Komatsu Ltd | 半導体ウェハ包装容器のウェハカセット |
| NL1010321C2 (nl) * | 1997-10-20 | 1999-09-08 | Fluoroware Inc | Wafeldrager. |
| JPH11145267A (ja) * | 1997-11-07 | 1999-05-28 | Hitachi Ltd | 基板収納容器および基板処理方法 |
| US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
| FR2785270B1 (fr) * | 1998-10-30 | 2001-01-19 | St Microelectronics Sa | Cassette de transport de plaquettes de semiconducteur |
| JP2000184605A (ja) | 1998-12-14 | 2000-06-30 | Mitsuoka Electric Mfg Co Ltd | 小型電気機器用充電装置 |
| US6082540A (en) * | 1999-01-06 | 2000-07-04 | Fluoroware, Inc. | Cushion system for wafer carriers |
| JP2000289795A (ja) * | 1999-04-06 | 2000-10-17 | Kakizaki Mamufacuturing Co Ltd | 薄板収納・輸送容器 |
| JP2000349135A (ja) * | 1999-06-03 | 2000-12-15 | Shin Etsu Polymer Co Ltd | ウェーハの回転抑制構造 |
| JP2002122382A (ja) | 2000-01-28 | 2002-04-26 | Ebara Corp | 基板容器 |
| JP2001298077A (ja) * | 2000-04-14 | 2001-10-26 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
| JP4372313B2 (ja) * | 2000-06-20 | 2009-11-25 | 信越ポリマー株式会社 | 基板収納容器 |
| JP2002124561A (ja) * | 2000-10-16 | 2002-04-26 | Shin Etsu Polymer Co Ltd | 基板の識別情報を読み取り可能な基板収納容器及び基板の識別情報の読み取り方法 |
| JP3938293B2 (ja) * | 2001-05-30 | 2007-06-27 | 信越ポリマー株式会社 | 精密基板収納容器及びその押さえ部材 |
| JP4030280B2 (ja) * | 2001-08-24 | 2008-01-09 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
| TW511649U (en) * | 2001-09-12 | 2002-11-21 | Ind Tech Res Inst | Wafer retainer |
| US6644477B2 (en) * | 2002-02-26 | 2003-11-11 | Entegris, Inc. | Wafer container cushion system |
| TWI283621B (en) | 2002-12-02 | 2007-07-11 | Miraial Co Ltd | Thin plate storage container |
| TWI239931B (en) | 2003-05-19 | 2005-09-21 | Miraial Co Ltd | Lid unit for thin plate supporting container and thin plate supporting container |
| US7017758B2 (en) * | 2003-07-09 | 2006-03-28 | Chartered Semiconductor Manufacturing Ltd. | Wafer protective cassette |
-
2003
- 2003-12-18 JP JP2003421482A patent/JP4681221B2/ja not_active Expired - Lifetime
-
2004
- 2004-05-26 TW TW093114854A patent/TWI266734B/zh not_active IP Right Cessation
- 2004-07-02 KR KR1020040051667A patent/KR20050053306A/ko not_active Application Discontinuation
- 2004-07-23 US US10/896,912 patent/US7357258B2/en active Active
- 2004-08-03 EP EP04018403A patent/EP1538662A3/fr not_active Withdrawn
- 2004-12-02 CN CNB2004100955983A patent/CN100410154C/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US7357258B2 (en) | 2008-04-15 |
| CN100410154C (zh) | 2008-08-13 |
| JP4681221B2 (ja) | 2011-05-11 |
| EP1538662A3 (fr) | 2008-12-10 |
| CN1623863A (zh) | 2005-06-08 |
| TW200519004A (en) | 2005-06-16 |
| US20050115865A1 (en) | 2005-06-02 |
| EP1538662A2 (fr) | 2005-06-08 |
| KR20050053306A (ko) | 2005-06-08 |
| JP2005191021A (ja) | 2005-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI266734B (en) | Thin-plate supporting container | |
| US20050218034A1 (en) | Lid unit for thin plate supporting container | |
| US7216766B2 (en) | Thin plate storage container with handled supporting member | |
| US7316315B2 (en) | Thin plate storage container and lid having at least one thin plate supporting member | |
| JP4146718B2 (ja) | 薄板支持容器 | |
| US20100258475A1 (en) | Retainer and substrate storage container | |
| JP2004059116A5 (fr) | ||
| KR20100127736A (ko) | 박판지지용기용 덮개 | |
| JP4296296B2 (ja) | 薄型ウエハー挿入体 | |
| JP2006521975A (ja) | ガラスシートの包装 | |
| TWI266736B (en) | Substrate conveyance tray | |
| JP4255261B2 (ja) | 基板収納容器 | |
| JP2006351604A (ja) | 薄板支持容器 | |
| JP4903893B2 (ja) | 薄板支持容器用蓋体 | |
| JP4621988B2 (ja) | 半導体ウェハ用カセット | |
| JP4110880B2 (ja) | 大型ガラス基板用トレイ形カセット | |
| JP2558708Y2 (ja) | 自動塗抹標本作成装置用標本収納カセット | |
| JP4024333B2 (ja) | 薄板支持器 | |
| CN212570948U (zh) | 一种晶圆柔性存料载具 | |
| JP2004071859A (ja) | ディスプレイ用基板収納用ボックス及びディスプレイ用基板の取り出し方法 | |
| KR100857938B1 (ko) | 백 그라운드 웨이퍼의 이송 용기 및 수납 방법 | |
| JP2001093969A (ja) | 基板トレイおよび基板収納方法 | |
| JPH11514954A (ja) | 動的連結体を有する搬送用および輸送用カセット | |
| JPH0626263U (ja) | 薄板用支持容器 | |
| JPH1017074A (ja) | 精密基板収納カセットの搬送用ハンドル |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |