TWI260686B - Coating film forming apparatus - Google Patents
Coating film forming apparatus Download PDFInfo
- Publication number
- TWI260686B TWI260686B TW094110774A TW94110774A TWI260686B TW I260686 B TWI260686 B TW I260686B TW 094110774 A TW094110774 A TW 094110774A TW 94110774 A TW94110774 A TW 94110774A TW I260686 B TWI260686 B TW I260686B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- substrate
- processing liquid
- nozzle
- roller
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 210
- 239000011248 coating agent Substances 0.000 title claims abstract description 172
- 239000000758 substrate Substances 0.000 claims abstract description 181
- 238000012545 processing Methods 0.000 claims abstract description 132
- 239000007788 liquid Substances 0.000 claims abstract description 94
- 230000037452 priming Effects 0.000 claims abstract description 9
- 238000011282 treatment Methods 0.000 claims description 72
- 238000001035 drying Methods 0.000 claims description 22
- 230000003020 moisturizing effect Effects 0.000 claims description 12
- 238000000265 homogenisation Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 29
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 160
- 238000010438 heat treatment Methods 0.000 description 41
- 238000012546 transfer Methods 0.000 description 38
- 238000011161 development Methods 0.000 description 30
- 235000012431 wafers Nutrition 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 7
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 6
- 238000001291 vacuum drying Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 208000005156 Dehydration Diseases 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 239000003550 marker Substances 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004042 decolorization Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004113023 | 2004-04-07 | ||
| JP2004273645A JP4386430B2 (ja) | 2004-04-07 | 2004-09-21 | 塗布膜形成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200537585A TW200537585A (en) | 2005-11-16 |
| TWI260686B true TWI260686B (en) | 2006-08-21 |
Family
ID=35469892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094110774A TWI260686B (en) | 2004-04-07 | 2005-04-04 | Coating film forming apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4386430B2 (ko) |
| KR (1) | KR101069494B1 (ko) |
| TW (1) | TWI260686B (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100803147B1 (ko) * | 2007-04-04 | 2008-02-14 | 세메스 주식회사 | 도포장치 및 이를 이용한 처리액의 도포 방법 |
| KR100840528B1 (ko) | 2007-04-13 | 2008-06-23 | 주식회사 케이씨텍 | 슬릿 코터용 예비토출장치 |
| KR200456618Y1 (ko) * | 2007-05-07 | 2011-11-09 | 주식회사 케이씨텍 | 슬릿 코터용 예비토출장치 |
| KR100969347B1 (ko) | 2009-09-07 | 2010-07-09 | 한국기계연구원 | 멀티 코터 및 이를 이용한 코팅 방법과 롤 프린팅 방법 |
| KR20140024953A (ko) * | 2011-07-27 | 2014-03-03 | 스미도모쥬기가이고교 가부시키가이샤 | 기판제조장치 및 기판제조방법 |
| JP5912403B2 (ja) * | 2011-10-21 | 2016-04-27 | 東京エレクトロン株式会社 | 塗布処理装置 |
| KR101744512B1 (ko) * | 2016-02-04 | 2017-06-20 | 황중국 | 양면 코팅장치 |
| CN117184835A (zh) * | 2022-05-31 | 2023-12-08 | 上海德沪涂膜设备有限公司 | 涂布设备 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11169769A (ja) * | 1997-12-08 | 1999-06-29 | Toray Ind Inc | 塗布装置及び塗布方法並びにカラーフィルタの製造装置及び製造方法 |
| JP2001070858A (ja) * | 1999-07-07 | 2001-03-21 | Canon Inc | 塗料の塗工装置および塗工方法 |
-
2004
- 2004-09-21 JP JP2004273645A patent/JP4386430B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-04 TW TW094110774A patent/TWI260686B/zh not_active IP Right Cessation
- 2005-04-06 KR KR1020050028560A patent/KR101069494B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060045531A (ko) | 2006-05-17 |
| KR101069494B1 (ko) | 2011-09-30 |
| JP4386430B2 (ja) | 2009-12-16 |
| JP2005322873A (ja) | 2005-11-17 |
| TW200537585A (en) | 2005-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |