TWI260686B - Coating film forming apparatus - Google Patents
Coating film forming apparatus Download PDFInfo
- Publication number
- TWI260686B TWI260686B TW094110774A TW94110774A TWI260686B TW I260686 B TWI260686 B TW I260686B TW 094110774 A TW094110774 A TW 094110774A TW 94110774 A TW94110774 A TW 94110774A TW I260686 B TWI260686 B TW I260686B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- substrate
- processing liquid
- nozzle
- roller
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004113023 | 2004-04-07 | ||
| JP2004273645A JP4386430B2 (ja) | 2004-04-07 | 2004-09-21 | 塗布膜形成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200537585A TW200537585A (en) | 2005-11-16 |
| TWI260686B true TWI260686B (en) | 2006-08-21 |
Family
ID=35469892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094110774A TWI260686B (en) | 2004-04-07 | 2005-04-04 | Coating film forming apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4386430B2 (https=) |
| KR (1) | KR101069494B1 (https=) |
| TW (1) | TWI260686B (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100803147B1 (ko) * | 2007-04-04 | 2008-02-14 | 세메스 주식회사 | 도포장치 및 이를 이용한 처리액의 도포 방법 |
| KR100840528B1 (ko) | 2007-04-13 | 2008-06-23 | 주식회사 케이씨텍 | 슬릿 코터용 예비토출장치 |
| KR200456618Y1 (ko) * | 2007-05-07 | 2011-11-09 | 주식회사 케이씨텍 | 슬릿 코터용 예비토출장치 |
| KR100969347B1 (ko) | 2009-09-07 | 2010-07-09 | 한국기계연구원 | 멀티 코터 및 이를 이용한 코팅 방법과 롤 프린팅 방법 |
| KR20140024953A (ko) * | 2011-07-27 | 2014-03-03 | 스미도모쥬기가이고교 가부시키가이샤 | 기판제조장치 및 기판제조방법 |
| JP5912403B2 (ja) * | 2011-10-21 | 2016-04-27 | 東京エレクトロン株式会社 | 塗布処理装置 |
| KR101744512B1 (ko) * | 2016-02-04 | 2017-06-20 | 황중국 | 양면 코팅장치 |
| CN117184835A (zh) * | 2022-05-31 | 2023-12-08 | 上海德沪涂膜设备有限公司 | 涂布设备 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11169769A (ja) * | 1997-12-08 | 1999-06-29 | Toray Ind Inc | 塗布装置及び塗布方法並びにカラーフィルタの製造装置及び製造方法 |
| JP2001070858A (ja) * | 1999-07-07 | 2001-03-21 | Canon Inc | 塗料の塗工装置および塗工方法 |
-
2004
- 2004-09-21 JP JP2004273645A patent/JP4386430B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-04 TW TW094110774A patent/TWI260686B/zh not_active IP Right Cessation
- 2005-04-06 KR KR1020050028560A patent/KR101069494B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060045531A (ko) | 2006-05-17 |
| KR101069494B1 (ko) | 2011-09-30 |
| JP4386430B2 (ja) | 2009-12-16 |
| TW200537585A (en) | 2005-11-16 |
| JP2005322873A (ja) | 2005-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |