TWI255802B - Manufacturing method and manufacturing device of display device - Google Patents

Manufacturing method and manufacturing device of display device

Info

Publication number
TWI255802B
TWI255802B TW093110903A TW93110903A TWI255802B TW I255802 B TWI255802 B TW I255802B TW 093110903 A TW093110903 A TW 093110903A TW 93110903 A TW93110903 A TW 93110903A TW I255802 B TWI255802 B TW I255802B
Authority
TW
Taiwan
Prior art keywords
display device
manufacturing
substrates
units
substrate
Prior art date
Application number
TW093110903A
Other languages
English (en)
Chinese (zh)
Other versions
TW200424140A (en
Inventor
Hisao Yamazaki
Mitsuru Igarashi
Original Assignee
Hitachi Displays Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Displays Ltd filed Critical Hitachi Displays Ltd
Publication of TW200424140A publication Critical patent/TW200424140A/zh
Application granted granted Critical
Publication of TWI255802B publication Critical patent/TWI255802B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW093110903A 2003-04-28 2004-04-20 Manufacturing method and manufacturing device of display device TWI255802B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003124224 2003-04-28
JP2003429584A JP4131853B2 (ja) 2003-04-28 2003-12-25 表示装置の製造方法及び製造装置

Publications (2)

Publication Number Publication Date
TW200424140A TW200424140A (en) 2004-11-16
TWI255802B true TWI255802B (en) 2006-06-01

Family

ID=33302271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093110903A TWI255802B (en) 2003-04-28 2004-04-20 Manufacturing method and manufacturing device of display device

Country Status (3)

Country Link
US (1) US7079216B2 (https=)
JP (1) JP4131853B2 (https=)
TW (1) TWI255802B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102540513A (zh) * 2010-12-28 2012-07-04 富士通株式会社 显示器件的制造方法及制造装置
TWI468355B (https=) * 2010-03-15 2015-01-11
TWI617410B (zh) * 2013-07-08 2018-03-11 Mitsuboshi Diamond Ind Co Ltd 貼合基板之加工裝置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006259566A (ja) * 2005-03-18 2006-09-28 Hitachi Displays Ltd 表示装置とその製造方法
KR100978259B1 (ko) 2005-06-20 2010-08-26 엘지디스플레이 주식회사 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법
JP2007059209A (ja) 2005-08-24 2007-03-08 Toyota Industries Corp エレクトロルミネッセンスパネル及びその製造方法
JP2007156310A (ja) * 2005-12-08 2007-06-21 Nec Lcd Technologies Ltd 液晶パネルの製造方法
KR100972512B1 (ko) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
WO2009060691A1 (ja) * 2007-11-05 2009-05-14 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板の加工方法およびスクライブ装置
KR101105631B1 (ko) * 2008-06-18 2012-01-18 미쓰보시 다이야몬도 고교 가부시키가이샤 기판 가공 시스템
JP5256554B2 (ja) * 2008-07-18 2013-08-07 株式会社シライテック 液晶パネルの割断装置
TWI393878B (zh) * 2008-08-18 2013-04-21 Chunghwa Picture Tubes Ltd 面板檢測裝置及檢測面板的方法
JP5777849B2 (ja) * 2009-05-29 2015-09-09 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
KR100966082B1 (ko) * 2009-06-16 2010-06-28 주식회사 토비스 액정 패널 절단 방법
TWI385137B (zh) * 2009-08-19 2013-02-11 Chimei Innolux Corp 面板製造方法、面板與顯示面板結構
CN103946169B (zh) * 2011-11-16 2017-10-24 日本电气硝子株式会社 板玻璃切断装置、板玻璃切断方法、板玻璃制作方法、及板玻璃切断系统
KR101895606B1 (ko) * 2012-04-18 2018-10-18 주식회사 탑 엔지니어링 브레이킹 유닛 및 이를 갖는 스크라이브 장치
KR102048921B1 (ko) 2012-06-20 2019-11-27 삼성디스플레이 주식회사 셀 절단 장치 및 셀 절단 방법
US9434085B2 (en) * 2013-06-04 2016-09-06 Shenzhen China Star Optoelectronics Technology Co., Ltd Cutting system for glass substrate
DE112014006038B4 (de) * 2013-12-27 2025-04-24 AGC Inc. Verfahren zur Verarbeitung einer zerbrechlichen Platte und Vorrichtung zur Verarbeitung einer zerbrechlichen Platte
JP2016104683A (ja) * 2014-11-19 2016-06-09 坂東機工株式会社 ガラス板の折割方法及びその折割装置
US10494289B2 (en) 2015-01-29 2019-12-03 Corning Incorporated Methods and apparatus for fabricating respective sections from a glass web
CN104808370B (zh) * 2015-05-22 2017-10-31 合肥京东方光电科技有限公司 一种对盒设备、对位方法
JP6410157B2 (ja) * 2017-02-28 2018-10-24 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置
CN107129136B (zh) * 2017-06-28 2020-02-14 重庆华瑞玻璃有限公司 一种玻璃用切割装置
KR101991268B1 (ko) * 2017-09-27 2019-06-20 주식회사 탑 엔지니어링 스크라이빙 장치 및 스크라이빙 방법
CN108490676A (zh) * 2018-03-23 2018-09-04 惠州市华星光电技术有限公司 液晶显示器及其制造方法
KR102671725B1 (ko) * 2019-06-17 2024-06-05 주식회사 탑 엔지니어링 단재 제거 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH063633A (ja) * 1992-06-18 1994-01-14 Fujitsu Ltd 液晶表示パネルの製造方法
JP3042192B2 (ja) * 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 貼り合せガラス基板の裁断方法及びその装置
JP3619314B2 (ja) * 1996-03-11 2005-02-09 サンエー技研株式会社 露光装置
JP3498895B2 (ja) * 1997-09-25 2004-02-23 シャープ株式会社 基板の切断方法および表示パネルの製造方法
CN100361914C (zh) * 2001-03-16 2008-01-16 三星宝石工业株式会社 割划方法、刀轮、使用该刀轮的割划设备和制造该刀轮的设备
JP3943356B2 (ja) * 2001-08-17 2007-07-11 株式会社日立製作所 液晶表示装置の製造方法
JP3969992B2 (ja) * 2001-10-15 2007-09-05 株式会社シライテック 液晶パネルの分断システム
KR100789455B1 (ko) * 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 방법
JP2003313036A (ja) * 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
US7295279B2 (en) * 2002-06-28 2007-11-13 Lg.Philips Lcd Co., Ltd. System and method for manufacturing liquid crystal display devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468355B (https=) * 2010-03-15 2015-01-11
CN102540513A (zh) * 2010-12-28 2012-07-04 富士通株式会社 显示器件的制造方法及制造装置
TWI617410B (zh) * 2013-07-08 2018-03-11 Mitsuboshi Diamond Ind Co Ltd 貼合基板之加工裝置

Also Published As

Publication number Publication date
US7079216B2 (en) 2006-07-18
JP2004348111A (ja) 2004-12-09
US20040212774A1 (en) 2004-10-28
JP4131853B2 (ja) 2008-08-13
TW200424140A (en) 2004-11-16

Similar Documents

Publication Publication Date Title
TWI255802B (en) Manufacturing method and manufacturing device of display device
TW200509391A (en) A device having multiple silicide types and a method for its fabrication
TW200633050A (en) Manufacturing method for semiconductor chips
EP1434282A3 (en) Protective layer for an organic thin-film transistor
AU2003264511A1 (en) Method for forming insulating film on substrate, method for manufacturing semiconductor device and substrate-processing apparatus
TW200721327A (en) Semiconductor device and method of manufacturing the same
TW200715514A (en) Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same
TW200707754A (en) Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate
TW200625400A (en) Integrated passive devices
TWI263465B (en) Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate
WO2008063337A3 (en) Semiconductor-on-diamond devices and associated methods
TW200620664A (en) Semicomductor device and method for manufacturing the same
EP4135043A4 (en) DISPLAY SUBSTRATE AND PRODUCTION METHOD THEREOF AND DISPLAY DEVICE
EP4057333A3 (en) Method of bonding of semiconductor elements to substrates
TW200629618A (en) Electronic devices and processes for forming electronic devices
WO2008132980A1 (ja) 撮像装置の製造方法、撮像装置及び携帯端末
TW200512925A (en) Semiconductor device having fuse and capacitor at the same level and method of fabricating the same
TW200619734A (en) Method of manufacturing flexible display device
TW200644104A (en) Manufacturing method for electronic component, electronic component, and electronic equipment
WO2005057663A3 (en) Method and apparatus for fabrication of metal-oxide semiconductor integrated circuit devices
TW200614396A (en) Bumping process and structure thereof
EP4203040A4 (en) DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE
TW200620560A (en) A device having multiple silicide types and a method for its fabrication
EP4207328A4 (en) MANUFACTURING METHOD FOR A DISPLAY SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY DEVICE
TW200623948A (en) Manufacturing method for organic electronic device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees