WO2008132980A1 - 撮像装置の製造方法、撮像装置及び携帯端末 - Google Patents

撮像装置の製造方法、撮像装置及び携帯端末 Download PDF

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Publication number
WO2008132980A1
WO2008132980A1 PCT/JP2008/056887 JP2008056887W WO2008132980A1 WO 2008132980 A1 WO2008132980 A1 WO 2008132980A1 JP 2008056887 W JP2008056887 W JP 2008056887W WO 2008132980 A1 WO2008132980 A1 WO 2008132980A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
imaging
portable terminal
manufacturing
elements
Prior art date
Application number
PCT/JP2008/056887
Other languages
English (en)
French (fr)
Inventor
Keiichi Kawazu
Seiichi Isoguchi
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2009511750A priority Critical patent/JPWO2008132980A1/ja
Priority to US12/595,927 priority patent/US20100127341A1/en
Publication of WO2008132980A1 publication Critical patent/WO2008132980A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14632—Wafer-level processed structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)

Abstract

　本発明は、より低コストの撮像装置を製造できる製造方法、該製造方法による低コストの撮像装置及びそれを用いた携帯端末を提供する。シリコンウェハ１１を撮像素子１２毎に切断し、複数の撮像素子１２を基板２１上に載置することにより、良品の撮像素子１２のみを後工程に投入することができ、切断前に撮像素子１２の不良品を判別しておくことで、それに組み付ける撮像光学系ユニットＯＵを無駄にすることがなくなり、低コストで撮像装置を製造できる。
PCT/JP2008/056887 2007-04-17 2008-04-07 撮像装置の製造方法、撮像装置及び携帯端末 WO2008132980A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009511750A JPWO2008132980A1 (ja) 2007-04-17 2008-04-07 撮像装置の製造方法、撮像装置及び携帯端末
US12/595,927 US20100127341A1 (en) 2007-04-17 2008-04-07 Imaging Device Manufacturing Method, Imaging Device and Portable Terminal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007108069 2007-04-17
JP2007-108069 2007-04-17

Publications (1)

Publication Number Publication Date
WO2008132980A1 true WO2008132980A1 (ja) 2008-11-06

Family

ID=39925439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056887 WO2008132980A1 (ja) 2007-04-17 2008-04-07 撮像装置の製造方法、撮像装置及び携帯端末

Country Status (3)

Country Link
US (1) US20100127341A1 (ja)
JP (1) JPWO2008132980A1 (ja)
WO (1) WO2008132980A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2385553A3 (en) * 2009-07-29 2012-04-25 Kingpak Technology Inc. Image sensor package structure
EP2341541A3 (en) * 2009-12-31 2012-08-08 Kingpak Technology Inc. Image sensor packaging structure with predetermined focal length
WO2018198266A1 (ja) * 2017-04-27 2018-11-01 オリンパス株式会社 内視鏡、撮像モジュール、および、撮像モジュールの製造方法
JP2020060551A (ja) * 2018-10-05 2020-04-16 旭化成エレクトロニクス株式会社 光デバイス

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8299589B2 (en) * 2010-07-26 2012-10-30 TDK Taiwan, Corp. Packaging device of image sensor
JP2016100573A (ja) * 2014-11-26 2016-05-30 株式会社東芝 電子モジュール、及びカメラモジュール
DE102017210379A1 (de) * 2017-06-21 2018-12-27 Robert Bosch Gmbh Bildsensormodul
US10943894B2 (en) * 2018-10-05 2021-03-09 Asahi Kasei Microdevices Corporation Optical device having lens block having recessed portion covering photoelectric conversion block
TWI846530B (zh) * 2023-06-30 2024-06-21 晉弘科技股份有限公司 影像感測模組製作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001292365A (ja) * 2000-04-07 2001-10-19 Mitsubishi Electric Corp 撮像装置及びその製造方法
JP2003348395A (ja) * 2002-05-23 2003-12-05 Rohm Co Ltd イメージセンサモジュールおよびその製造方法
JP2005539276A (ja) * 2002-09-17 2005-12-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP2006005211A (ja) * 2004-06-18 2006-01-05 Iwate Toshiba Electronics Co Ltd 固体撮像装置及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001292365A (ja) * 2000-04-07 2001-10-19 Mitsubishi Electric Corp 撮像装置及びその製造方法
JP2003348395A (ja) * 2002-05-23 2003-12-05 Rohm Co Ltd イメージセンサモジュールおよびその製造方法
JP2005539276A (ja) * 2002-09-17 2005-12-22 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP2006005211A (ja) * 2004-06-18 2006-01-05 Iwate Toshiba Electronics Co Ltd 固体撮像装置及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2385553A3 (en) * 2009-07-29 2012-04-25 Kingpak Technology Inc. Image sensor package structure
EP2385554A3 (en) * 2009-07-29 2012-04-25 Kingpak Technology Inc. Image sensor package structure
EP2341541A3 (en) * 2009-12-31 2012-08-08 Kingpak Technology Inc. Image sensor packaging structure with predetermined focal length
US8441086B2 (en) 2009-12-31 2013-05-14 Kingpak Technology Inc. Image sensor packaging structure with predetermined focal length
WO2018198266A1 (ja) * 2017-04-27 2018-11-01 オリンパス株式会社 内視鏡、撮像モジュール、および、撮像モジュールの製造方法
US11304598B2 (en) 2017-04-27 2022-04-19 Olympus Corporation Endoscope system and method of manufacturing image capturing module used in the endoscope system
JP2020060551A (ja) * 2018-10-05 2020-04-16 旭化成エレクトロニクス株式会社 光デバイス

Also Published As

Publication number Publication date
US20100127341A1 (en) 2010-05-27
JPWO2008132980A1 (ja) 2010-07-22

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