TWI252261B - Etching liquid composition - Google Patents
Etching liquid composition Download PDFInfo
- Publication number
- TWI252261B TWI252261B TW090122162A TW90122162A TWI252261B TW I252261 B TWI252261 B TW I252261B TW 090122162 A TW090122162 A TW 090122162A TW 90122162 A TW90122162 A TW 90122162A TW I252261 B TWI252261 B TW I252261B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- mass
- acid
- salts
- etching
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims abstract description 35
- 239000000203 mixture Substances 0.000 title claims abstract description 24
- 239000007788 liquid Substances 0.000 title claims abstract description 12
- 239000002253 acid Substances 0.000 claims abstract description 29
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 229920001400 block copolymer Polymers 0.000 claims abstract description 15
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 24
- 150000003839 salts Chemical class 0.000 claims description 24
- -1 polyethylene Polymers 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 229920001451 polypropylene glycol Polymers 0.000 claims description 12
- 239000004698 Polyethylene Substances 0.000 claims description 11
- 239000007864 aqueous solution Substances 0.000 claims description 11
- 229920000573 polyethylene Polymers 0.000 claims description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 8
- 239000003945 anionic surfactant Substances 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 235000006408 oxalic acid Nutrition 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 4
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 238000005187 foaming Methods 0.000 abstract description 10
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 5
- 230000002079 cooperative effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- FOGYNLXERPKEGN-UHFFFAOYSA-N 3-(2-hydroxy-3-methoxyphenyl)-2-[2-methoxy-4-(3-sulfopropyl)phenoxy]propane-1-sulfonic acid Chemical compound COC1=CC=CC(CC(CS(O)(=O)=O)OC=2C(=CC(CCCS(O)(=O)=O)=CC=2)OC)=C1O FOGYNLXERPKEGN-UHFFFAOYSA-N 0.000 description 2
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 2
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 2
- 229920000137 polyphosphoric acid Polymers 0.000 description 2
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- HVTQDSGGHBWVTR-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-phenylmethoxypyrazol-1-yl]-1-morpholin-4-ylethanone Chemical compound C(C1=CC=CC=C1)OC1=NN(C=C1C=1C=NC(=NC=1)NC1CC2=CC=CC=C2C1)CC(=O)N1CCOCC1 HVTQDSGGHBWVTR-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- KWXICGTUELOLSQ-UHFFFAOYSA-N 4-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=C(S(O)(=O)=O)C=C1 KWXICGTUELOLSQ-UHFFFAOYSA-N 0.000 description 1
- YMRMGNMHZNFVAE-UHFFFAOYSA-N C(CCC)[Ru] Chemical compound C(CCC)[Ru] YMRMGNMHZNFVAE-UHFFFAOYSA-N 0.000 description 1
- 241000238366 Cephalopoda Species 0.000 description 1
- UNPLRYRWJLTVAE-UHFFFAOYSA-N Cloperastine hydrochloride Chemical compound Cl.C1=CC(Cl)=CC=C1C(C=1C=CC=CC=1)OCCN1CCCCC1 UNPLRYRWJLTVAE-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Weting (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- ing And Chemical Polishing (AREA)
Description
1252261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 4 蕃二磺酸、1-蓁酚-3,6-二磺酸之類的芳香族聚磺酸及其鹽 類等。其中尤以蕃磺酸甲醛縮合物及其鹽類、聚苯乙婦續 酸及其鹽類、木質續酸及其鹽類為佳。 蕃磺酸甲醛縮合物及其鹽類有如聚星NP 1〇〇(注:商品 名’ 「tK U又夕一」的音譯)(日本油脂公司產製)、魯諾克 斯(注:商品名’ 「儿.7ッ夕又」的音 譯)1000,1000(:,1500八(以上為東邦化學工業公司產製)、億 屋德D-2(注:商品名’ 「彳才卜」的音譯)、三洋麗裝 龍PHL(注:商品名,「三洋b 口 >」的音譯)(以上為三洋 化成公司產製)、羅馬PWA-40(三能布克公司產製名,「廿 > / :/ =1」的音譯)、德摩爾N(注:商品名,「宁乇一儿」 的音譯)、德摩爾AS(以上,花王公司產製)等商品名稱市售 者。特別以銨鹽或游離酸的羅馬PWA-40或德摩爾As為 佳。聚本乙烯橫酸及其鹽類則有如聚笛19〇〇(注:商品名, 「术。丁<」的音譯)(獅王公司)商品名,而木質續酸及其 鹽類則有如蘇魯布魯9047K(注:商品名,「ν^τΚ —儿」的 音譯)(東邦化學工業公司產製),分別以鈉鹽市售。當使用 為電子工業用時’含納等金屬屬較不佳之情況,可利用離 子交換樹脂等處理,在去除鈉之後便可使用。 本發明中所採用的聚環氧乙烷-聚環氧丙烷塊狀共聚 物,其本身不僅可減少ΙΤΟ膜蝕刻後的殘渣,更藉由與該 磺酸化合物的組合,更可大幅提昇殘渣去除性,並具有抑 制發泡性的作用。聚環氧乙烷_聚環氧丙烷塊狀共聚物係隨 聚環氧乙烷與聚環氧丙烷的比率、分子量而有各種型態, 由界面活性劑廠商提供而有多數種市售。譬如三洋化成工 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閱讀背面之注意事項再場寫本頁} -訂· 線_
1252261 五、發明説明() 7 A7 B7 經濟部智慧財產局員工消費合作社印製 實施例2 3.4 實施例3 3.4 蘇魯布魯 9047K 0.1質量% 實施例4 3.4 璦棒485 0.001質量% 實施例5 0.5 聚笛1900 0.01質量% 實施例6 5.0 聚笛1900 0.1質量% 實施例7 3.4 聚笛1900 0.001質量% 璦棒785 0.01質量% 實施例8 3.4 聚笛1900 0.01質量% 璦棒785 0.01質量% 實施例9 3.4 蘇魯布魯 9047K 0.1質量% 璦棒785 0.1質量% 實施例10 3.4 璦棒485 0.01質量% 實施例11 3.4 新歌爾 707SF 0.03質量% 璦棒710 0.005質量% 甲醇 10質量% 實施例12 3.4 新歌爾 707SF 0.03質量% 璦棒710 0.005質量% 2-丙醇 10質量% 實施例13 3.4 新歌爾 707SF 0.03質量% 璦棒710 0.005質量% 正丁醇 5質量% 實施例14 3.4 聚笛1900 10:0質量% 實施例15 3.4 德摩爾AS 1.0質量% ※添加水,總量為100。 (請先閱讀背面之注意事項再塡寫本頁) 線· 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) -10- 1252261五、發明説明( 經濟部智慧財產局員Η消費合作社印製 聚笛1900:獅王公司產製,聚續酸鈉鹽 蘇魯布魯9047K:東邦化學工業公司產製 生氣木質磺酸鈉 鹽 德摩爾AS:花王公司產製,蕃續酸福嗎縮合物的錄鹽 新歌爾707SF:日本乳化劑公司產製,聚環氧乙烯^殊 芳基磺酸銨鹽 璦棒485,710,785:第-業製藥公司產製,聚環氧乙烧 -聚環氧丙燒塊狀共聚物 針對上述所示蝕刻液,進行以下項目的探討。 (發泡性-泡沫高度) 在100ml比色管中填入試料20ml,並設定於Ts式搖晃 機上,進行2分鐘的振動。待振動結束後,測量3〇秒後、$ 分鐘後的泡沐高度,並進行發泡性評估。 (蝕刻速度) 將在1500人膜厚的非晶矽ιτο膜上形成有光阻圖案的 基板,浸潰50°C的蝕刻液中1分鐘,然後經水洗、乾燥後, 剝離光阻,再利用觸針式膜厚計測量蝕刻量。 (蝕刻後的殘渣) ① 將在玻璃基板上形成有ITO膜的基板,由敍刻速度計 算出正常蝕刻時間1.8倍時間,進行蝕刻,然後進行電子顯 微鏡觀察’並評估敍刻後的殘渣。 ② 將在玻璃基板上形成氮化矽膜,更形成1丁〇膜的基 板,由#刻速度計算出正常蝕刻時間1 ·8倍時間,進行蝕 刻,然後進行電子顯微鏡觀察,並評估蝕刻後的殘渣。 結果如表2中所示。 本紙張尺度適用中國國家標準(CNS)A4規格(21〇Χ 297公爱) f請先閱讀背面之注意事项再攝寫本買」
-11- 1252261 五、發明説明() 9 A7 B7 發泡性(泡沫高度) 蝕刻速度 蝕刻後的殘渣 30秒後 5分鐘後 ① ② 比較例1 0mm 0mm 135〇A/min X X 比較例2 180 160 1320 ◎ X 實施例1 0 0 1320 〇 實施例2 0 0 1300 〇 〇 實施例3 6 0 1350 〇 〇 實施例4 5 0 1320 〇 實施例5 0 0 650 〇 實施例6 0 0 1400 〇 實施例7 9 0 1350 ◎ 實施例8 5 0 1320 ◎ 實施例9 6 0 1350 ◎ 〇 實施例10 4 0 1300 ◎ 實施例11 20 7 1290 〇 實施例12 0 0 1360 〇. 實施例13 30 1 1350 〇 實施例14 4 . 0 1350 〇 ◎ 實施例15 3 0 1320 〇 ◎ (請先閱讀背面之注意事項再塡寫本頁) ;τ 線' 經濟部智慧財產局員工消費合作社印製 殘渣評估X :整面殘餘頗多的殘渣 〇:稍微存在 ◎:完全無存在 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) -12- 申請-ΕΓ言 —和u 案 號 ? ^ ί >^Μ Ιο V 類 別 Sr (以上各攔由本局填註) 明 1252261辱/ 2 2似號專酸^‘:時:修正 A4 C4 專利説明書 中‘文 蝕刻液組成物 發明 名稱 英 文
Etching liquid composition 姓 名 國 籍 1. 石川典夫 2. 森清人 1.曰本2.曰本 t 裝 發明 人 住、居所 1. 日本國埼玉縣草加市稻荷1-7-1關東化學股份有限公司中央研究所内 2. 曰本國埼玉縣草加市稻荷卜7-1關東化學股份有限公司中央研究所内 訂 姓 名 (名稱) 曰商•關東化學股份有限公司 經濟部智慧財/|局0(工消#合作社印製 國 籍 住、居所 (事務所) 代表人 姓 名 曰本 曰本國東京都中央區日本橋本町3 丁目2番8號 野澤俊大郎 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐)
証 ..U· 月 【發明所屬技術領域】 (請先閲讀背面之注意事項再填寫本頁)
本發明係相關LCD等顯示裝置之透明電極膜的餘列 液。 X 【習知技術】 按,LCD或場致發光顯示裝置的透明電極,有如氧化 銦錫、氧化銦、氧化錫、氧化鋅等,主要乃採用氧化銦錫(以 下稱「ITO」)。ITO膜的蝕刻液,習知便有提案採用如① 氣化鐵(Π )水溶液、②碳酸水溶液、③鱗酸水溶液、④鹽酸 -硝酸混合液(王水)、⑤草酸水溶液等。但是,該等卻具有 以下問題點,在實用上尚嫌不足。 ① 氯化鐵(BI )水溶液,雖蝕刻速度較大且價廉,但側 餘量亦較大,且含有對半導體產生不良影響的以之缺點。 ② 蛾酸水溶液,雖側蝕量較少,蝕刻特性較佳,但峨 卻較容易游離而欠缺安定性,且屬高價位。 線_ ③ 磷酸水溶液,在對配線所採用的A1進行蝕刻時,當 蝕刻後將殘留殘渣。 ④ 鹽酸-硝酸混合液(王水),在時間變化上將頗激烈, 在處理程序上頗難控制,且無法排放出。 經濟部智慧財產局員工消費合作社印製 ⑤ 草酸水溶液,雖具有安定性佳、價廉,且不致蝕刻 A1等頗多優點’但在钱刻後卻將殘留殘逢。 相關採用草酸水溶液之情況時的殘渣,雖在曰本特開 7-141932號公報中,有開示採用十二烷基苯磺酸而減少殘 渣的技術,但其卻存在發泡性較高的缺點。 另’近年在玻璃基板上形成氮化矽膜等之後,再於其 上形成ITO膜的程序,亦正被探討中,而裝置構造亦將變 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公爱) -4- 五、發明說明(2 )
化。因此,殘渣的去除性亦轉變為不足。 【發明欲解決之課題】 即,本發明之課題乃在於解決上述習知問題點,遂提 供-種可抑制發泡性且㈣後亦無產生錢的透 用蝕刻液。 膜 【解決課題之手段】 本發明者為解決上述課題,遂經深入探討,發現藉由 使透明導電膜用蝕刻液中,含有聚磺酸化合物或4定^面 活f·生剤,便可解決相關的課題,並再更深入的研究,钟果 終於完成本發明。 即,本發明係關於蝕刻液組成物,乃含有透明導電膜 用蝕刻液、與由聚磺酸化合物及聚環氧乙烷_聚環氧丙烷塊 狀共聚物所構成的組群中至少選擇一種化合物。 再者,本發明係相關上述組成物,其中該透明導電膜 係氧化銦錫(ITO)膜。 、 再者,本發明係相關上述組成物,其中該透明導電膜 用姓刻液係草酸水溶液。 八再者,本發明係相關上述組成物,其中該由聚磺酸化 合物及聚環氧乙烷-聚環氧丙烷塊狀共聚物所構成的組群 中至少選擇一種化合物的濃度係0 0001〜10質量%。 再者,本發明係相關上述組成物,其中該聚磺酸化合 物係由萘磺酸甲醛縮合物及其鹽類、聚笨乙烯磺酸及其 鹽類、及木質磺酸及其鹽類中選擇其中一種或二種以上。 再者,本發明係相關上述組成物,更進一步含有語酸 鹽型陰離子界面活性劑。 1252261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明( 再者’本發明係相關上述組成物,更進一步含有水溶 性低碳數醇類。 再者’本發明係相關上述組成物,其中該水溶性低碳 數醇類係由甲醇、乙醇、正丙醇、異丙醇及正丁醇中選擇 一種或二種以上。 再者’本發明係相關上述組成物,其中該水溶性低碳 數醇類的濃度係1〜10質量%。 藉由本發明,聚環氧乙烷-聚環氧丙烷塊狀共聚物具有 去除ITO膜姓刻後殘渣的作用,甚至更意外的事得知若將 聚石黃酸化合物或磺酸鹽型陰離子界面活性劑,與聚環氧乙 院-聚環氧丙烧塊狀共聚物共同組合的話,將可更進一步提 南去除作用。再者,對磺酸鹽型陰離子界面活性劑的發泡, 聚壤氧乙燒-聚環氧丙烷塊狀共聚物或水溶性醇類亦具抑 制發泡作用。 【發明實施態樣】 以下針對本發明的實施態樣進行詳述。 首先,本發明中所採用的草酸濃度係依蝕刻速度足 夠,且不致析出結晶的範圍内進行決定。草酸濃度在Q l 質量%以下,於5(TC下的蝕刻速度為1〇〇人/1^11以下,而無 法獲得實用的蝕刻速度。在1 0〇/〇以上且25 〇c以下,將析出 結晶,對保存性或排放性將造成阻礙。較佳的濃度可判斷 為0.5〜5質量%。 其次,本發明所採用的聚磺酸化合物可舉例如萘磺酸 甲醛縮合物及其鹽類、聚苯乙烯磺酸及其鹽類、木質磺酸 及其鹽類、聚乙烯磺酸及其鹽類等高分子化合物、或丨',5_ ------------裝--------訂--------- (請先Μ讀背面之注意事項再填寫本頁) A7 1252261 五、發明說明(5 ) 業公司的新保羅PE系列(注:商品名,「二二一求—儿、 藥公司產製的璦棒系列(注:商品名,「工八^ 衣 」曰澤)( #410,420,450,485,710,720,740,750,785)^ 比率在80〜90%的高比率的話,消泡效果較佳,而聚環=乙 二的比率在50%以上的話’蝕刻後的殘潰去除效果::顯 著。 ” 本發明中所採用磺酸鹽型陰離子界面活性劑,可舉例 如十二烷基笨磺酸之類烷基苯磺酸及其鹽類、烷基硫^醋 及其鹽類、磺基琥珀酸之二烷基酯及其鹽類、聚環氧乙烯 烷基醚磺酸或聚環氧乙烯烯丙基醚磺酸及及其鹽類。其中 尤以聚環氧乙烯烷基醚磺酸或聚環氧乙烯烯丙基醚磺酸及 及其鹽類,因為發泡比較少,所以特別佳。該等有如市售 的商品名新歌爾560SF(注:商品名,「Newc〇1」的音譯): 新歌爾707SF(以上由曰本乳化劑公司產製)、日產阿帕尼爾 S系列(注:商品名,「二木儿」白勺音譯)(日本油 脂公司產製)等。該等磺酸鹽型陰離子界面活性劑,亦如同 前述聚磺酸化合物般,雖具有蝕刻時殘渣的去除性,但卻 具有發泡性,所以尚嫌不足。為抑制發泡性,可添加水溶 性低碳數醇類。水溶性低礙數醇類係可採用如甲醇、乙醇、 正丙烷、異丙醇、正丁醇等。水溶性低碳數醇類的濃度, 最好1〜10質量%。若濃度過低的話,便無法獲得使用效果, 反之若過高的話,則對光阻的膨潤等將造成障礙。 該等聚磺酸化合物、磺酸鹽型陰離子界面活性劑、或 系環氧乙烧-聚環氧丙烷塊狀共聚物的濃度為0 0001〜10質 -I i-i I I 1 I II · n n I I I ϋ I (請先Μ讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -8- 1252261 A7 B7 五、發明說明( 量%,特別以0.001〜10質量%為佳。當聚石黃酸化合物與聚環 氧乙烷水%氧丙烷塊狀共聚物共同組合時,聚磺酸化合物 為0.001〜1〇質,聚環氧乙烧_聚環氧丙烧塊狀共聚物為 o.oool〜1質量%,聚磺酸化合物與聚環氧乙烷_聚環氧丙烷 塊狀共聚物’在此濃度範圍内可自由調配。當聚磺酸化合 物、碩酸鹽型陰離子界面活性劑、或聚環氧乙烷_聚環氧丙 烷塊狀共聚物的濃度呈較低的情況時,殘渣去除將嫌不 足;反之,即便過高的話,亦無法獲得所期待的效果。該 等化合物,隨ITO膜的基底材料需要進行適當選擇。譬如 在玻璃基材上,聚磺酸化合物為0 001〜01質量%便可發揮 效果,但在氮化矽膜上則濃度若未提昇至01〜10質量%的 話,便無法顯現出效果。 【實施例】 以下,同時顯示本發明之實施例與比較例,雖詳細列 示發明内容’但本發明並不僅顯於該等實施例。 表1係本發明蝕刻液及供比較用的蝕刻液組成。 【表1】 ------------11-----11111 (請先B3讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 草酸 聚磺酸化合物 磺酸鹽型陰 離子界面活 性劑 聚環氧乙烷-聚 環氧丙烷塊狀 共聚物 醇類 比較例1 3.4質量% 比較例2 3.4 十二烷基苯 磺酸0.03質 量% 實施例1 3.4 聚笛1900 0.1質量% -- -9 .纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
Claims (1)
- 252261六、申請專封範圍 經濟部智慧財產局員工消費合作杜印製 1 · 一種蝕刻液組成物,其特徵在於:含有相對於該蝕刻液組 泛物的王貝里之〉辰度為含有南於0.1質量%低於10質量% 草酸的水溶液所構成之透明導電膜用蝕刻液、與至少一 種化合物選自相對於該蝕刻液組合物的全質量之濃度為 0·0001〜10質量%聚磺酸化合物及聚環氧乙烷_聚環氧丙 烷塊狀共聚物之蝕刻液組合物,其中該聚磺酸化合物係 至少一種選自萘磺酸甲醛縮合物及其鹽類、聚苯乙烯石黃 酸及其鹽類、及木質續酸及其鹽類。 2 ·如申凊專利範圍第1項所述組成物,其中該透明導電膜係 氧化銦錫(ΙΤΟ)膜。 3 ·如申請專利範圍第1項所述組成物,係更進一步含有磺酸 鹽型陰離子界面活性劑。 4 ·如申叫專利範圍第1項所述組成物,係更進一步含有水溶 性低碳數醇類D 5·如申請專利範圍第4項所述組成物,其中該水溶性低碳數 醇類係至;一種選自甲醇、乙醇、正丙醇、異丙醇及正 丁醇。 6.如申請專利範圍第4項料組成物,其巾該水溶性低碳數 醇類相對於敍刻組合物的全質量濃度為卜1〇質量%。 i紙張尺度適財邮^^NS)A4規格⑽χ撕 - (請先«讀背面之注意事項再填寫本頁) 線- -13 -
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000272528 | 2000-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI252261B true TWI252261B (en) | 2006-04-01 |
Family
ID=18758628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090122162A TWI252261B (en) | 2000-09-08 | 2001-09-06 | Etching liquid composition |
Country Status (7)
Country | Link |
---|---|
US (2) | US6914039B2 (zh) |
EP (2) | EP1646091A3 (zh) |
KR (1) | KR100821884B1 (zh) |
CN (1) | CN1253527C (zh) |
DE (1) | DE60124473T2 (zh) |
SG (1) | SG89419A1 (zh) |
TW (1) | TWI252261B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452173B (zh) * | 2008-01-15 | 2014-09-11 | Mitsubishi Paper Mills Ltd | 銅或銅合金用之蝕刻液,蝕刻前處理液及蝕刻方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1646091A3 (en) * | 2000-09-08 | 2006-04-19 | Kanto Kagaku Kabushiki Kaisha | Etching liquid composition |
US6943142B2 (en) * | 2002-01-09 | 2005-09-13 | Air Products And Chemicals, Inc. | Aqueous stripping and cleaning composition |
TWI339680B (en) * | 2002-02-19 | 2011-04-01 | Kanto Kagaku | Washing liquid composition for semiconductor substrate |
KR100519368B1 (ko) * | 2002-03-29 | 2005-10-07 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
JP4375991B2 (ja) * | 2003-04-09 | 2009-12-02 | 関東化学株式会社 | 半導体基板洗浄液組成物 |
JP4085094B2 (ja) * | 2004-02-19 | 2008-04-30 | シャープ株式会社 | 導電素子基板の製造方法、液晶表示装置の製造方法 |
TWI364072B (en) * | 2004-03-18 | 2012-05-11 | Dongjin Semichem Co Ltd | Etching composition |
KR101232249B1 (ko) * | 2004-08-10 | 2013-02-12 | 간또 가가꾸 가부시끼가이샤 | 반도체 기판 세정액 및 반도체 기판 세정방법 |
KR101167312B1 (ko) * | 2005-06-30 | 2012-07-19 | 엘지디스플레이 주식회사 | 미세 패턴 형성 방법과 그를 이용한 액정 표시 장치 및 그제조 방법 |
DE102005031469A1 (de) * | 2005-07-04 | 2007-01-11 | Merck Patent Gmbh | Medium zur Ätzung von oxidischen, transparenten, leitfähigen Schichten |
JP4816250B2 (ja) * | 2006-05-25 | 2011-11-16 | 三菱瓦斯化学株式会社 | エッチング液組成物及びエッチング方法 |
KR20100098409A (ko) * | 2007-11-22 | 2010-09-06 | 간또 가가꾸 가부시끼가이샤 | 에칭액 조성물 |
JP5354989B2 (ja) * | 2008-08-14 | 2013-11-27 | 関東化学株式会社 | 透明導電膜用エッチング液組成物 |
JP6014985B2 (ja) * | 2010-10-01 | 2016-10-26 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び洗浄方法 |
JP6261926B2 (ja) * | 2013-09-18 | 2018-01-17 | 関東化學株式会社 | 金属酸化物エッチング液組成物およびエッチング方法 |
CN104587936B (zh) * | 2015-01-30 | 2017-03-22 | 东莞佰鸿电子有限公司 | 一种光化学反应系统 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3898141A (en) * | 1974-02-08 | 1975-08-05 | Bell Telephone Labor Inc | Electrolytic oxidation and etching of III-V compound semiconductors |
US4344863A (en) * | 1978-08-04 | 1982-08-17 | Exxon Research & Engineering Co. | Process for defoaming acid gas scrubbing solutions and defoaming solutions |
US4532066A (en) * | 1984-03-05 | 1985-07-30 | Sterling Drug Inc. | Stable mildly acidic aqueous polishing cleanser and preparation thereof |
JPS63114132A (ja) * | 1986-10-31 | 1988-05-19 | Showa Denko Kk | 表面処理液 |
JPH04338643A (ja) * | 1991-05-16 | 1992-11-25 | Seiko Epson Corp | シリコンウェハーの加工方法 |
US5264109A (en) * | 1991-09-16 | 1993-11-23 | Siemens Power Corporation | Zirconium and zirconium alloy passivation process |
JP3289734B2 (ja) * | 1992-05-13 | 2002-06-10 | エルナー株式会社 | 電解コンデンサ用アルミニウム箔のエッチング方法 |
EP0691676B1 (en) * | 1993-02-04 | 1999-05-12 | Daikin Industries, Limited | Wet-etching composition for semiconductors excellent in wettability |
JPH07141932A (ja) * | 1993-11-18 | 1995-06-02 | Kanto Chem Co Inc | 透明導電膜のエッチング液組成物 |
US5489735A (en) * | 1994-01-24 | 1996-02-06 | D'muhala; Thomas F. | Decontamination composition for removing norms and method utilizing the same |
JPH09208267A (ja) * | 1996-02-02 | 1997-08-12 | Nippon Sheet Glass Co Ltd | 透明導電膜の電極加工方法 |
JPH1055993A (ja) * | 1996-08-09 | 1998-02-24 | Hitachi Ltd | 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法 |
US5968848A (en) * | 1996-12-27 | 1999-10-19 | Tokyo Ohka Kogyo Co., Ltd. | Process for treating a lithographic substrate and a rinse solution for the treatment |
US6284721B1 (en) * | 1997-01-21 | 2001-09-04 | Ki Won Lee | Cleaning and etching compositions |
KR100248113B1 (ko) * | 1997-01-21 | 2000-03-15 | 이기원 | 전자 표시 장치 및 기판용 세정 및 식각 조성물 |
JPH1129882A (ja) | 1997-07-08 | 1999-02-02 | Kanto Bussan Kk | 基材のエッチング方法及びそれに用いる酸性インク |
WO2000011107A1 (en) | 1998-08-18 | 2000-03-02 | Ki Won Lee | Ito etching composition |
SG78405A1 (en) * | 1998-11-17 | 2001-02-20 | Fujimi Inc | Polishing composition and rinsing composition |
JP4230631B2 (ja) * | 1999-12-20 | 2009-02-25 | 東芝電子エンジニアリング株式会社 | 透明導電膜のエッチング液組成物 |
US6310019B1 (en) * | 2000-07-05 | 2001-10-30 | Wako Pure Chemical Industries, Ltd. | Cleaning agent for a semi-conductor substrate |
EP1646091A3 (en) * | 2000-09-08 | 2006-04-19 | Kanto Kagaku Kabushiki Kaisha | Etching liquid composition |
-
2001
- 2001-09-05 EP EP05077944A patent/EP1646091A3/en not_active Withdrawn
- 2001-09-05 EP EP01307555A patent/EP1187225B1/en not_active Expired - Lifetime
- 2001-09-05 DE DE60124473T patent/DE60124473T2/de not_active Expired - Lifetime
- 2001-09-06 TW TW090122162A patent/TWI252261B/zh not_active IP Right Cessation
- 2001-09-06 US US09/947,483 patent/US6914039B2/en not_active Expired - Lifetime
- 2001-09-07 SG SG200105485A patent/SG89419A1/en unknown
- 2001-09-07 CN CNB011420510A patent/CN1253527C/zh not_active Expired - Lifetime
- 2001-09-08 KR KR1020010055280A patent/KR100821884B1/ko active IP Right Grant
-
2005
- 2005-05-13 US US11/128,622 patent/US7507350B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452173B (zh) * | 2008-01-15 | 2014-09-11 | Mitsubishi Paper Mills Ltd | 銅或銅合金用之蝕刻液,蝕刻前處理液及蝕刻方法 |
Also Published As
Publication number | Publication date |
---|---|
US20050209119A1 (en) | 2005-09-22 |
DE60124473D1 (de) | 2006-12-28 |
CN1253527C (zh) | 2006-04-26 |
EP1187225B1 (en) | 2006-11-15 |
US7507350B2 (en) | 2009-03-24 |
EP1646091A3 (en) | 2006-04-19 |
EP1187225A3 (en) | 2003-07-23 |
KR100821884B1 (ko) | 2008-04-16 |
US6914039B2 (en) | 2005-07-05 |
SG89419A1 (en) | 2002-06-18 |
DE60124473T2 (de) | 2007-09-06 |
EP1187225A2 (en) | 2002-03-13 |
CN1346864A (zh) | 2002-05-01 |
US20020055447A1 (en) | 2002-05-09 |
KR20020020654A (ko) | 2002-03-15 |
EP1646091A2 (en) | 2006-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI252261B (en) | Etching liquid composition | |
TW570971B (en) | Etching composition and use thereof | |
TWI224128B (en) | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same | |
TW467767B (en) | Electroless metal deposition of electronic components in an enclosable vessel | |
TW434196B (en) | Selective etching of silicate | |
TW404960B (en) | Resin etching solution and etching process | |
CN108121149A (zh) | TiN硬掩模和蚀刻残留物去除 | |
TW200826193A (en) | Etchant composition | |
CN102576170B (zh) | 制造用于液晶显示器的阵列基板的方法 | |
CN111630632A (zh) | 药液、基板的处理方法 | |
TW201026819A (en) | Etching liquid composition for transparent conductive film | |
TW527440B (en) | Remover for a ruthenium containing metal and use thereof | |
JP6670917B1 (ja) | エッチング液、被処理体の処理方法、及び半導体素子の製造方法。 | |
TW536667B (en) | Method for the preparation of a base material of electronic parts and resist remover used therefor | |
CN106757029A (zh) | 一种侧蚀小的铜蚀刻液 | |
TW403777B (en) | Wet-etching composition for semiconductors excellent in wettability | |
TW202102721A (zh) | 組成物、套組、基板的處理方法 | |
TW200300445A (en) | Etching liquid | |
TW201250818A (en) | Etching method and etching liquid used therein, manufacturing method of semiconductor element using the same | |
TWI228283B (en) | Composition for photoresist removing solution | |
Caillau et al. | Fifty nanometer lines patterned into silica using water developable chitosan bioresist and electron beam lithography | |
TW466635B (en) | Method to etch and structurize the oxide-films | |
WO2003081658A1 (fr) | Composition de produit d'attaque | |
CN109930153A (zh) | 刻蚀液及刻蚀装置 | |
CN115232624A (zh) | 一种用于纳米级氧化硅中间层蚀刻的缓冲氧化物蚀刻液 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |