TWI249622B - Bi-convex solid immersion lens - Google Patents
Bi-convex solid immersion lens Download PDFInfo
- Publication number
- TWI249622B TWI249622B TW091137365A TW91137365A TWI249622B TW I249622 B TWI249622 B TW I249622B TW 091137365 A TW091137365 A TW 091137365A TW 91137365 A TW91137365 A TW 91137365A TW I249622 B TWI249622 B TW I249622B
- Authority
- TW
- Taiwan
- Prior art keywords
- lens
- immersion lens
- solid immersion
- disclosed
- inspected
- Prior art date
Links
- 238000007654 immersion Methods 0.000 title abstract description 6
- 239000007787 solid Substances 0.000 title abstract 3
- 238000010276 construction Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/122—Flying-type heads, e.g. analogous to Winchester type in magnetic recording
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1372—Lenses
- G11B7/1374—Objective lenses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1372—Lenses
- G11B7/1378—Separate aberration correction lenses; Cylindrical lenses to generate astigmatism; Beam expanders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1387—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector using the near-field effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/135—Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B7/1372—Lenses
- G11B2007/13727—Compound lenses, i.e. two or more lenses co-operating to perform a function, e.g. compound objective lens including a solid immersion lens, positive and negative lenses either bonded together or with adjustable spacing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Lenses (AREA)
- Microscoopes, Condenser (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
1249622 850 管道 870操縱器 903 絕緣基材層 907其他裝置層 915 凹穴 922 底部表面 945 流道 8 60 x-y-z 臺架 9 0 0 覆晶 905 第一主動層 909 待測面 920 浸入式鏡頭 942 底部表面 950 管道
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/052,011 US6594086B1 (en) | 2002-01-16 | 2002-01-16 | Bi-convex solid immersion lens |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200302354A TW200302354A (en) | 2003-08-01 |
TWI249622B true TWI249622B (en) | 2006-02-21 |
Family
ID=21974831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091137365A TWI249622B (en) | 2002-01-16 | 2002-12-25 | Bi-convex solid immersion lens |
Country Status (9)
Country | Link |
---|---|
US (4) | US6594086B1 (zh) |
EP (1) | EP1466194B1 (zh) |
JP (1) | JP4195921B2 (zh) |
KR (3) | KR100872751B1 (zh) |
CN (1) | CN1610843A (zh) |
AT (1) | ATE358826T1 (zh) |
DE (1) | DE60219360T2 (zh) |
TW (1) | TWI249622B (zh) |
WO (1) | WO2003062864A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401468B (zh) * | 2007-06-29 | 2013-07-11 | Intel Corp | 熱控制型固體浸沒透鏡裝置 |
US10133051B2 (en) | 2014-03-11 | 2018-11-20 | Fei Efa, Inc. | Self correcting floating SIL tip |
Families Citing this family (48)
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US6594086B1 (en) * | 2002-01-16 | 2003-07-15 | Optonics, Inc. (A Credence Company) | Bi-convex solid immersion lens |
US7426171B2 (en) * | 2002-11-18 | 2008-09-16 | Sony Corporation | Optical lens, condenser lens, optical pickup, and optical recording/reproducing apparatus |
TWI328691B (en) * | 2003-03-20 | 2010-08-11 | Hamamatsu Photonics Kk | Solid immersion lens and microscope |
US7221502B2 (en) * | 2003-03-20 | 2007-05-22 | Hamamatsu Photonics K.K. | Microscope and sample observation method |
TWI336777B (en) * | 2003-03-20 | 2011-02-01 | Hamamatsu Photonics Kk | Solid immersion lens (sil) and specimen observation method by sil |
TWI269886B (en) * | 2003-03-20 | 2007-01-01 | Hamamatsu Photonics Kk | Microscope and specimen observation method |
DE10343722A1 (de) * | 2003-09-17 | 2005-04-14 | Carl Zeiss Jena Gmbh | Festkörper-Immersionslinsen-Spektroskopie und -Mikroskopie |
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US7046418B2 (en) * | 2003-10-08 | 2006-05-16 | Gentex Corporation | Reversible electrodeposition devices and associated electrochemical media |
US20050094258A1 (en) * | 2003-10-31 | 2005-05-05 | Hamamatsu Photonics K.K. | Solid immersion lens moving device and microscope using the same |
US7576928B2 (en) * | 2003-10-31 | 2009-08-18 | Hamamatsu Photonics K.K. | Solid immersion lens holder |
CN100410718C (zh) * | 2003-10-31 | 2008-08-13 | 浜松光子学株式会社 | 试样观察方法 |
US7110172B2 (en) * | 2004-02-27 | 2006-09-19 | Hamamatsu Photonics K.K. | Microscope and sample observation method |
US7312921B2 (en) * | 2004-02-27 | 2007-12-25 | Hamamatsu Photonics K.K. | Microscope and sample observation method |
JP4643994B2 (ja) * | 2005-01-19 | 2011-03-02 | 浜松ホトニクス株式会社 | 固浸レンズホルダ |
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CN100359578C (zh) * | 2004-09-14 | 2008-01-02 | 索尼株式会社 | 固体浸没透镜以及制造该固体浸没透镜的方法 |
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JP2006112808A (ja) * | 2004-10-12 | 2006-04-27 | Fujikura Ltd | 表面プラズモンセンサー |
US7314767B2 (en) * | 2005-05-27 | 2008-01-01 | Credence Systems Corporation | Method for local wafer thinning and reinforcement |
US7659981B2 (en) * | 2005-08-26 | 2010-02-09 | Dcg Systems, Inc. | Apparatus and method for probing integrated circuits using polarization difference probing |
US7450245B2 (en) | 2005-06-29 | 2008-11-11 | Dcg Systems, Inc. | Method and apparatus for measuring high-bandwidth electrical signals using modulation in an optical probing system |
US7616312B2 (en) | 2005-06-29 | 2009-11-10 | Dcg Systems, Inc. | Apparatus and method for probing integrated circuits using laser illumination |
US7733100B2 (en) | 2005-08-26 | 2010-06-08 | Dcg Systems, Inc. | System and method for modulation mapping |
JP5045148B2 (ja) * | 2006-04-27 | 2012-10-10 | セイコーエプソン株式会社 | プラスチック偏光レンズ |
FR2902226B1 (fr) | 2006-06-12 | 2010-01-29 | Commissariat Energie Atomique | Composant optique fonctionnant en transmission en champ proche |
US20070291361A1 (en) * | 2006-06-19 | 2007-12-20 | Credence Systems Corporation | Lens housing with integrated thermal management |
CN101126491B (zh) * | 2006-08-18 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管模组 |
US8424594B2 (en) * | 2007-12-10 | 2013-04-23 | Presto Engineering, Inc. | Apparatus for thermal control in the analysis of electronic devices |
US8553322B2 (en) | 2008-11-04 | 2013-10-08 | Dcg Systems, Inc. | Variable magnification optics with spray cooling |
US8754633B2 (en) | 2009-05-01 | 2014-06-17 | Dcg Systems, Inc. | Systems and method for laser voltage imaging state mapping |
US8072699B2 (en) * | 2009-06-17 | 2011-12-06 | Semicaps Pte Ltd | Solid immersion lens optics assembly |
US8767199B2 (en) * | 2010-10-15 | 2014-07-01 | Infrared Laboratories, Inc. | Inspection system utilizing solid immersion lenses |
CN102540408A (zh) * | 2011-12-26 | 2012-07-04 | 吉林大学 | 超半球型电光固浸透镜 |
EP2867918A1 (en) * | 2012-06-26 | 2015-05-06 | Kla-Tencor Corporation | Near field metrology |
TWI512867B (zh) * | 2012-12-14 | 2015-12-11 | Yayatech Co Ltd | 晶圓切割道之檢測方法及其檢測治具 |
US8873032B1 (en) | 2013-05-07 | 2014-10-28 | CheckPoint Technologies, LLC. | Optical probing system having reliable temperature control |
US9030658B1 (en) | 2013-05-07 | 2015-05-12 | Checkpoint Technologies, Llc | Multi-resolution optical probing system having reliable temperature control and mechanical isolation |
US9182580B1 (en) | 2013-08-30 | 2015-11-10 | Checkpoint Technologies, Llc | Optical probe system having accurate positional and orientational adjustments for multiple optical objectives |
US9217855B1 (en) | 2013-08-30 | 2015-12-22 | Checkpoint Technologies, Llc | Multi-magnification high sensitivity optical system for probing electronic devices |
WO2016047666A1 (ja) * | 2014-09-26 | 2016-03-31 | 浜松ホトニクス株式会社 | 固浸レンズホルダ及び画像取得装置 |
US9417281B1 (en) | 2014-09-30 | 2016-08-16 | Checkpoint Technologies Llc | Adjustable split-beam optical probing (ASOP) |
KR20170011708A (ko) * | 2015-07-24 | 2017-02-02 | 엘지전자 주식회사 | 광학 렌즈 및 이를 포함하는 백라이트 유닛과 디스플레이 디바이스 |
NL2017505A (en) * | 2015-10-09 | 2017-04-11 | Asml Netherlands Bv | Method and apparatus for inspection and metrology |
CN112384839B (zh) * | 2018-07-06 | 2022-10-28 | 奥林巴斯株式会社 | 物镜光学系统和内窥镜 |
WO2020150239A1 (en) * | 2019-01-14 | 2020-07-23 | University Of Washington | Apparatuses, systems and methods for solid immersion meniscus lenses |
US11329722B2 (en) | 2020-03-27 | 2022-05-10 | Relative Dynamics Incorporated | Optical terminals |
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-
2002
- 2002-01-16 US US10/052,011 patent/US6594086B1/en not_active Expired - Lifetime
- 2002-12-11 KR KR1020077015713A patent/KR100872751B1/ko not_active IP Right Cessation
- 2002-12-11 JP JP2003562674A patent/JP4195921B2/ja not_active Expired - Fee Related
- 2002-12-11 CN CNA028227859A patent/CN1610843A/zh active Pending
- 2002-12-11 AT AT02806615T patent/ATE358826T1/de not_active IP Right Cessation
- 2002-12-11 WO PCT/US2002/039538 patent/WO2003062864A2/en active Application Filing
- 2002-12-11 KR KR1020087015284A patent/KR20080064912A/ko not_active Application Discontinuation
- 2002-12-11 DE DE60219360T patent/DE60219360T2/de not_active Expired - Lifetime
- 2002-12-11 EP EP02806615A patent/EP1466194B1/en not_active Expired - Lifetime
- 2002-12-11 KR KR1020047007230A patent/KR100870214B1/ko not_active IP Right Cessation
- 2002-12-25 TW TW091137365A patent/TWI249622B/zh not_active IP Right Cessation
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2003
- 2003-05-19 US US10/440,866 patent/US6778327B2/en not_active Expired - Lifetime
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- 2004-07-01 US US10/883,542 patent/US7227702B2/en not_active Expired - Lifetime
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401468B (zh) * | 2007-06-29 | 2013-07-11 | Intel Corp | 熱控制型固體浸沒透鏡裝置 |
US10133051B2 (en) | 2014-03-11 | 2018-11-20 | Fei Efa, Inc. | Self correcting floating SIL tip |
US10718933B2 (en) | 2014-03-11 | 2020-07-21 | Fei Efa, Inc. | Self correcting floating SIL tip |
Also Published As
Publication number | Publication date |
---|---|
EP1466194A2 (en) | 2004-10-13 |
KR20080064912A (ko) | 2008-07-09 |
US7492529B2 (en) | 2009-02-17 |
DE60219360T2 (de) | 2007-12-13 |
US7227702B2 (en) | 2007-06-05 |
US20040240074A1 (en) | 2004-12-02 |
WO2003062864A2 (en) | 2003-07-31 |
KR100870214B1 (ko) | 2008-11-27 |
US6594086B1 (en) | 2003-07-15 |
US20030202255A1 (en) | 2003-10-30 |
KR20070087002A (ko) | 2007-08-27 |
US20070205795A1 (en) | 2007-09-06 |
TW200302354A (en) | 2003-08-01 |
JP2005515514A (ja) | 2005-05-26 |
JP4195921B2 (ja) | 2008-12-17 |
KR100872751B1 (ko) | 2008-12-08 |
US6778327B2 (en) | 2004-08-17 |
CN1610843A (zh) | 2005-04-27 |
DE60219360D1 (de) | 2007-05-16 |
ATE358826T1 (de) | 2007-04-15 |
KR20040075862A (ko) | 2004-08-30 |
WO2003062864A3 (en) | 2003-10-16 |
EP1466194B1 (en) | 2007-04-04 |
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