ES2195786A1 - Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser. - Google Patents

Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser.

Info

Publication number
ES2195786A1
ES2195786A1 ES200201114A ES200201114A ES2195786A1 ES 2195786 A1 ES2195786 A1 ES 2195786A1 ES 200201114 A ES200201114 A ES 200201114A ES 200201114 A ES200201114 A ES 200201114A ES 2195786 A1 ES2195786 A1 ES 2195786A1
Authority
ES
Spain
Prior art keywords
marks
chips
codes
laser
reading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200201114A
Other languages
English (en)
Other versions
ES2195786B1 (es
Inventor
Fantoba Manuel Lozano
Garcia Carles Perello
Sard Xavier Enrich
Vallejo Joaquin Santander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Priority to ES200201114A priority Critical patent/ES2195786B1/es
Priority to AU2003236212A priority patent/AU2003236212A1/en
Priority to PCT/ES2003/000207 priority patent/WO2003098683A1/es
Publication of ES2195786A1 publication Critical patent/ES2195786A1/es
Application granted granted Critical
Publication of ES2195786B1 publication Critical patent/ES2195786B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Sistema de alineamiento de obleas y de lectura de microcódigos de barras y de marcas en chips con láser. La invención es un sistema para leer marcas del tamaño de micras en obleas de semiconductor, adaptable a estaciones de prueba para medirlas. Estas pueden ser códigos de barras conteniendo información o marcas especiales para el alineamiento de los ejes de los chips en la oblea con respecto a los ejes de movimiento X e Y de la estación. Consiste en un sistema lector láser de los utilizados en reproductores de CD y permite resolución de micrómetros. El sistema de lectura está fijo y es la oblea, gracias a los motores de la estación de pruebas, quién se mueve. Las ventajas son su simplicidad, puede adaptarse a cualquier estación de pruebas existente y resulta muy barato. Además permite la lectura de microcódigos de barras, conteniendo información relevante de cada chip.
ES200201114A 2002-05-16 2002-05-16 Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser. Expired - Fee Related ES2195786B1 (es)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ES200201114A ES2195786B1 (es) 2002-05-16 2002-05-16 Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser.
AU2003236212A AU2003236212A1 (en) 2002-05-16 2003-05-09 System for aligning wafers and for reading micro bar-codes and marks on chips using laser
PCT/ES2003/000207 WO2003098683A1 (es) 2002-05-16 2003-05-09 Sistema de alineamiento de obleas y de lectura de microcódigos de barras y de marcas en chips con láser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200201114A ES2195786B1 (es) 2002-05-16 2002-05-16 Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser.

Publications (2)

Publication Number Publication Date
ES2195786A1 true ES2195786A1 (es) 2003-12-01
ES2195786B1 ES2195786B1 (es) 2005-03-16

Family

ID=29433277

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200201114A Expired - Fee Related ES2195786B1 (es) 2002-05-16 2002-05-16 Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser.

Country Status (3)

Country Link
AU (1) AU2003236212A1 (es)
ES (1) ES2195786B1 (es)
WO (1) WO2003098683A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101812209B1 (ko) * 2016-02-16 2017-12-26 주식회사 이오테크닉스 레이저 마킹 장치 및 레이저 마킹 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0243520A1 (en) * 1986-04-29 1987-11-04 Ibm Deutschland Gmbh Interferometric mask-wafer alignment
JPH01117335A (ja) * 1987-10-30 1989-05-10 Tokyo Electron Ltd プローブ装置
US5705320A (en) * 1996-11-12 1998-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Recovery of alignment marks and laser marks after chemical-mechanical-polishing
US5733711A (en) * 1996-01-02 1998-03-31 Micron Technology, Inc. Process for forming both fixed and variable patterns on a single photoresist resin mask
JPH11135390A (ja) * 1997-10-27 1999-05-21 Sony Corp Ｉｄが印字されているウェーハ、半導体デバイスの製造方法および半導体デバイスの製造装置
JP2002246446A (ja) * 2001-02-20 2002-08-30 Assist Japan Kk ウェハアライメント装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0243520A1 (en) * 1986-04-29 1987-11-04 Ibm Deutschland Gmbh Interferometric mask-wafer alignment
JPH01117335A (ja) * 1987-10-30 1989-05-10 Tokyo Electron Ltd プローブ装置
US5733711A (en) * 1996-01-02 1998-03-31 Micron Technology, Inc. Process for forming both fixed and variable patterns on a single photoresist resin mask
US5705320A (en) * 1996-11-12 1998-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Recovery of alignment marks and laser marks after chemical-mechanical-polishing
JPH11135390A (ja) * 1997-10-27 1999-05-21 Sony Corp Ｉｄが印字されているウェーハ、半導体デバイスの製造方法および半導体デバイスの製造装置
JP2002246446A (ja) * 2001-02-20 2002-08-30 Assist Japan Kk ウェハアライメント装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Vol. 13 Nö 356 (E-803) 09.08.1989, IC=H01L 21/66, G01R 31/28 & JP 01117335 A (TOKYO ELECTRON LTD.) 10.05.1989, resumen; figura 2. *

Also Published As

Publication number Publication date
AU2003236212A1 (en) 2003-12-02
WO2003098683A1 (es) 2003-11-27
ES2195786B1 (es) 2005-03-16

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