TWI249234B - Windowed non-ceramic package having embedded frame - Google Patents

Windowed non-ceramic package having embedded frame Download PDF

Info

Publication number
TWI249234B
TWI249234B TW088122398A TW88122398A TWI249234B TW I249234 B TWI249234 B TW I249234B TW 088122398 A TW088122398 A TW 088122398A TW 88122398 A TW88122398 A TW 88122398A TW I249234 B TWI249234 B TW I249234B
Authority
TW
Taiwan
Prior art keywords
lead frame
package
mold compound
mold
die
Prior art date
Application number
TW088122398A
Other languages
English (en)
Chinese (zh)
Inventor
Zong-Fu Li
Kabul Sengupta
Deborah L Thompson
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/219,186 external-priority patent/US6072232A/en
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of TWI249234B publication Critical patent/TWI249234B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW088122398A 1998-12-21 1999-12-20 Windowed non-ceramic package having embedded frame TWI249234B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/219,186 US6072232A (en) 1998-10-13 1998-12-21 Windowed non-ceramic package having embedded frame

Publications (1)

Publication Number Publication Date
TWI249234B true TWI249234B (en) 2006-02-11

Family

ID=22818234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088122398A TWI249234B (en) 1998-12-21 1999-12-20 Windowed non-ceramic package having embedded frame

Country Status (8)

Country Link
JP (1) JP2002533926A (enExample)
KR (1) KR100490692B1 (enExample)
CN (1) CN1225786C (enExample)
AU (1) AU1744800A (enExample)
DE (1) DE19983826T1 (enExample)
GB (1) GB2359927B (enExample)
TW (1) TWI249234B (enExample)
WO (1) WO2000038230A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
CN104154995B (zh) * 2014-08-21 2016-09-28 中国科学院光电研究院 一种高光谱探测集成模块及其制造方法
CN111551775A (zh) * 2020-06-16 2020-08-18 新纳传感系统有限公司 一种电流传感器的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS60115247A (ja) * 1983-11-28 1985-06-21 Fujitsu Ltd 半導体装置
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
CA2047486C (en) * 1990-07-21 2002-03-05 Shigeru Katayama Semiconductor device and method for manufacturing the same
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
JP2784126B2 (ja) * 1993-02-23 1998-08-06 京セラ株式会社 半導体素子収納用パッケージの製造方法
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
JP3471111B2 (ja) * 1995-03-20 2003-11-25 三菱電機株式会社 半導体装置
JPH0992748A (ja) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置
JPH09107054A (ja) * 1995-10-13 1997-04-22 Sony Corp 半導体装置
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
JPH10189792A (ja) * 1996-12-27 1998-07-21 Sony Corp 半導体パッケージ
JP2002020358A (ja) * 2000-07-07 2002-01-23 Kansai Tlo Kk アミノ酸誘導体配位子と希土類金属の錯体からなる新規水溶性キラルシフト試薬及び光学分割試薬
JP2002174956A (ja) * 2000-12-06 2002-06-21 Ricoh Co Ltd 画像形成装置
JP2003042150A (ja) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd 転がり軸受装置

Also Published As

Publication number Publication date
GB0113365D0 (en) 2001-07-25
KR20020018993A (ko) 2002-03-09
KR100490692B1 (ko) 2005-05-24
CN1331841A (zh) 2002-01-16
AU1744800A (en) 2000-07-12
CN1225786C (zh) 2005-11-02
GB2359927A (en) 2001-09-05
JP2002533926A (ja) 2002-10-08
DE19983826T1 (de) 2002-03-07
GB2359927B (en) 2003-11-26
WO2000038230A1 (en) 2000-06-29

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees