GB0113365D0 - Windowed non-ceramic package having embedded frame - Google Patents
Windowed non-ceramic package having embedded frameInfo
- Publication number
- GB0113365D0 GB0113365D0 GBGB0113365.1A GB0113365A GB0113365D0 GB 0113365 D0 GB0113365 D0 GB 0113365D0 GB 0113365 A GB0113365 A GB 0113365A GB 0113365 D0 GB0113365 D0 GB 0113365D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- ceramic package
- embedded frame
- frame
- mold compound
- windowed non
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
An integrated circuit (IC) package includes a mold compound (12), a die (16), and a window (34). The mold compound (12) has a frame (32) embedded within it. The frame (32) has a coefficient of thermal expansion that is less than the mold compound (12). The IC package is capable of being attached to a circuit board via a mass reflow process.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/219,186 US6072232A (en) | 1998-10-13 | 1998-12-21 | Windowed non-ceramic package having embedded frame |
PCT/US1999/028012 WO2000038230A1 (en) | 1998-12-21 | 1999-11-23 | Windowed non-ceramic package having embedded frame |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0113365D0 true GB0113365D0 (en) | 2001-07-25 |
GB2359927A GB2359927A (en) | 2001-09-05 |
GB2359927B GB2359927B (en) | 2003-11-26 |
Family
ID=22818234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0113365A Expired - Fee Related GB2359927B (en) | 1998-12-21 | 1999-11-23 | Windowed non-ceramic package having embedded frame |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP2002533926A (en) |
KR (1) | KR100490692B1 (en) |
CN (1) | CN1225786C (en) |
AU (1) | AU1744800A (en) |
DE (1) | DE19983826T1 (en) |
GB (1) | GB2359927B (en) |
TW (1) | TWI249234B (en) |
WO (1) | WO2000038230A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6825540B2 (en) * | 2001-12-05 | 2004-11-30 | Matsushita Electric Industrial Co., Ltd. | Miniaturized, resin-sealed solid state imaging apparatus |
CN104154995B (en) * | 2014-08-21 | 2016-09-28 | 中国科学院光电研究院 | A kind of EO-1 hyperion detection integration module and manufacture method thereof |
CN111551775A (en) * | 2020-06-16 | 2020-08-18 | 新纳传感系统有限公司 | Method for manufacturing current sensor |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4285002A (en) * | 1978-01-19 | 1981-08-18 | International Computers Limited | Integrated circuit package |
JPS60115247A (en) * | 1983-11-28 | 1985-06-21 | Fujitsu Ltd | Semiconductor device |
JPH0724287B2 (en) * | 1987-02-12 | 1995-03-15 | 三菱電機株式会社 | Semiconductor device having light transmitting window and method of manufacturing the same |
ATE186795T1 (en) * | 1990-07-21 | 1999-12-15 | Mitsui Chemicals Inc | ONE PACKAGE SEMICONDUCTOR ARRANGEMENT |
US5324888A (en) * | 1992-10-13 | 1994-06-28 | Olin Corporation | Metal electronic package with reduced seal width |
JP2784126B2 (en) * | 1993-02-23 | 1998-08-06 | 京セラ株式会社 | Manufacturing method of semiconductor device storage package |
US6326678B1 (en) * | 1993-09-03 | 2001-12-04 | Asat, Limited | Molded plastic package with heat sink and enhanced electrical performance |
US5498900A (en) * | 1993-12-22 | 1996-03-12 | Honeywell Inc. | Semiconductor package with weldable ceramic lid |
US5471011A (en) * | 1994-05-26 | 1995-11-28 | Ak Technology, Inc. | Homogeneous thermoplastic semi-conductor chip carrier package |
US5471001A (en) * | 1994-12-15 | 1995-11-28 | E. I. Du Pont De Nemours And Company | Crystallization of adipic acid |
JP3471111B2 (en) * | 1995-03-20 | 2003-11-25 | 三菱電機株式会社 | Semiconductor device |
JPH0992748A (en) * | 1995-09-21 | 1997-04-04 | Mitsubishi Materials Corp | Package for semiconductor element |
JP3292798B2 (en) * | 1995-10-04 | 2002-06-17 | 三菱電機株式会社 | Semiconductor device |
JPH09107054A (en) * | 1995-10-13 | 1997-04-22 | Sony Corp | Semiconductor device |
US5821617A (en) * | 1996-07-29 | 1998-10-13 | Microsemi Corporation | Surface mount package with low coefficient of thermal expansion |
JPH10189792A (en) * | 1996-12-27 | 1998-07-21 | Sony Corp | Semiconductor package |
JP2002020358A (en) * | 2000-07-07 | 2002-01-23 | Kansai Tlo Kk | New water-soluble chiral shift reagent comprising complex of rare earth metal with amino acid derivative ligand and optically resolving agent comprising the complex |
JP2002174956A (en) * | 2000-12-06 | 2002-06-21 | Ricoh Co Ltd | Image forming device |
JP2003042150A (en) * | 2001-07-31 | 2003-02-13 | Koyo Seiko Co Ltd | Rolling bearing unit |
-
1999
- 1999-11-23 GB GB0113365A patent/GB2359927B/en not_active Expired - Fee Related
- 1999-11-23 AU AU17448/00A patent/AU1744800A/en not_active Abandoned
- 1999-11-23 KR KR10-2001-7007833A patent/KR100490692B1/en not_active IP Right Cessation
- 1999-11-23 JP JP2000590209A patent/JP2002533926A/en active Pending
- 1999-11-23 DE DE19983826T patent/DE19983826T1/en not_active Withdrawn
- 1999-11-23 CN CNB998148369A patent/CN1225786C/en not_active Expired - Fee Related
- 1999-11-23 WO PCT/US1999/028012 patent/WO2000038230A1/en active IP Right Grant
- 1999-12-20 TW TW088122398A patent/TWI249234B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20020018993A (en) | 2002-03-09 |
GB2359927A (en) | 2001-09-05 |
KR100490692B1 (en) | 2005-05-24 |
CN1331841A (en) | 2002-01-16 |
DE19983826T1 (en) | 2002-03-07 |
TWI249234B (en) | 2006-02-11 |
JP2002533926A (en) | 2002-10-08 |
AU1744800A (en) | 2000-07-12 |
WO2000038230A1 (en) | 2000-06-29 |
CN1225786C (en) | 2005-11-02 |
GB2359927B (en) | 2003-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20101123 |