GB2359927B - Windowed non-ceramic package having embedded frame - Google Patents

Windowed non-ceramic package having embedded frame

Info

Publication number
GB2359927B
GB2359927B GB0113365A GB0113365A GB2359927B GB 2359927 B GB2359927 B GB 2359927B GB 0113365 A GB0113365 A GB 0113365A GB 0113365 A GB0113365 A GB 0113365A GB 2359927 B GB2359927 B GB 2359927B
Authority
GB
United Kingdom
Prior art keywords
ceramic package
embedded frame
frame
mold compound
windowed non
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0113365A
Other languages
English (en)
Other versions
GB0113365D0 (en
GB2359927A (en
Inventor
Zong-Fu Li
Kabul Sengupta
Deborah L Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/219,186 external-priority patent/US6072232A/en
Application filed by Intel Corp filed Critical Intel Corp
Publication of GB0113365D0 publication Critical patent/GB0113365D0/en
Publication of GB2359927A publication Critical patent/GB2359927A/en
Application granted granted Critical
Publication of GB2359927B publication Critical patent/GB2359927B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB0113365A 1998-12-21 1999-11-23 Windowed non-ceramic package having embedded frame Expired - Fee Related GB2359927B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/219,186 US6072232A (en) 1998-10-13 1998-12-21 Windowed non-ceramic package having embedded frame
PCT/US1999/028012 WO2000038230A1 (en) 1998-12-21 1999-11-23 Windowed non-ceramic package having embedded frame

Publications (3)

Publication Number Publication Date
GB0113365D0 GB0113365D0 (en) 2001-07-25
GB2359927A GB2359927A (en) 2001-09-05
GB2359927B true GB2359927B (en) 2003-11-26

Family

ID=22818234

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0113365A Expired - Fee Related GB2359927B (en) 1998-12-21 1999-11-23 Windowed non-ceramic package having embedded frame

Country Status (8)

Country Link
JP (1) JP2002533926A (enExample)
KR (1) KR100490692B1 (enExample)
CN (1) CN1225786C (enExample)
AU (1) AU1744800A (enExample)
DE (1) DE19983826T1 (enExample)
GB (1) GB2359927B (enExample)
TW (1) TWI249234B (enExample)
WO (1) WO2000038230A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
CN104154995B (zh) * 2014-08-21 2016-09-28 中国科学院光电研究院 一种高光谱探测集成模块及其制造方法
CN111551775A (zh) * 2020-06-16 2020-08-18 新纳传感系统有限公司 一种电流传感器的制造方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
US4626960A (en) * 1983-11-28 1986-12-02 Fujitsu Limited Semiconductor device having soldered bond between base and cap thereof
US5343076A (en) * 1990-07-21 1994-08-30 Mitsui Petrochemical Industries, Ltd. Semiconductor device with an airtight space formed internally within a hollow package
US5399805A (en) * 1992-10-13 1995-03-21 Olin Corporation Metal electronic package with reduced seal width
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
JPH0992748A (ja) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
US5701033A (en) * 1995-03-20 1997-12-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5814883A (en) * 1995-10-04 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor chip
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
JP2002020358A (ja) * 2000-07-07 2002-01-23 Kansai Tlo Kk アミノ酸誘導体配位子と希土類金属の錯体からなる新規水溶性キラルシフト試薬及び光学分割試薬
JP2002174956A (ja) * 2000-12-06 2002-06-21 Ricoh Co Ltd 画像形成装置
JP2003042150A (ja) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd 転がり軸受装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724287B2 (ja) * 1987-02-12 1995-03-15 三菱電機株式会社 光透過用窓を有する半導体装置とその製造方法
JP2784126B2 (ja) * 1993-02-23 1998-08-06 京セラ株式会社 半導体素子収納用パッケージの製造方法
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
JPH09107054A (ja) * 1995-10-13 1997-04-22 Sony Corp 半導体装置
JPH10189792A (ja) * 1996-12-27 1998-07-21 Sony Corp 半導体パッケージ

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
US4626960A (en) * 1983-11-28 1986-12-02 Fujitsu Limited Semiconductor device having soldered bond between base and cap thereof
US5343076A (en) * 1990-07-21 1994-08-30 Mitsui Petrochemical Industries, Ltd. Semiconductor device with an airtight space formed internally within a hollow package
US5399805A (en) * 1992-10-13 1995-03-21 Olin Corporation Metal electronic package with reduced seal width
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
US5701033A (en) * 1995-03-20 1997-12-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH0992748A (ja) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
US5814883A (en) * 1995-10-04 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor chip
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
JP2002020358A (ja) * 2000-07-07 2002-01-23 Kansai Tlo Kk アミノ酸誘導体配位子と希土類金属の錯体からなる新規水溶性キラルシフト試薬及び光学分割試薬
JP2002174956A (ja) * 2000-12-06 2002-06-21 Ricoh Co Ltd 画像形成装置
JP2003042150A (ja) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd 転がり軸受装置

Also Published As

Publication number Publication date
GB0113365D0 (en) 2001-07-25
KR20020018993A (ko) 2002-03-09
KR100490692B1 (ko) 2005-05-24
CN1331841A (zh) 2002-01-16
TWI249234B (en) 2006-02-11
AU1744800A (en) 2000-07-12
CN1225786C (zh) 2005-11-02
GB2359927A (en) 2001-09-05
JP2002533926A (ja) 2002-10-08
DE19983826T1 (de) 2002-03-07
WO2000038230A1 (en) 2000-06-29

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20101123