TWI248518B - Substrate inspection device and inspection method thereof - Google Patents

Substrate inspection device and inspection method thereof Download PDF

Info

Publication number
TWI248518B
TWI248518B TW093118200A TW93118200A TWI248518B TW I248518 B TWI248518 B TW I248518B TW 093118200 A TW093118200 A TW 093118200A TW 93118200 A TW93118200 A TW 93118200A TW I248518 B TWI248518 B TW I248518B
Authority
TW
Taiwan
Prior art keywords
substrate
inspection
electrode
indentation
wafer
Prior art date
Application number
TW093118200A
Other languages
English (en)
Chinese (zh)
Other versions
TW200528734A (en
Inventor
Yuki Kitamura
Shinya Umetani
Tsutomu Kawanishi
Shinichi Nishida
Original Assignee
Tecnos Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tecnos Co Ltd filed Critical Tecnos Co Ltd
Publication of TW200528734A publication Critical patent/TW200528734A/zh
Application granted granted Critical
Publication of TWI248518B publication Critical patent/TWI248518B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
TW093118200A 2004-02-16 2004-06-24 Substrate inspection device and inspection method thereof TWI248518B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004038330A JP3976740B2 (ja) 2004-02-16 2004-02-16 基板検査装置及び検査方法

Publications (2)

Publication Number Publication Date
TW200528734A TW200528734A (en) 2005-09-01
TWI248518B true TWI248518B (en) 2006-02-01

Family

ID=35002033

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118200A TWI248518B (en) 2004-02-16 2004-06-24 Substrate inspection device and inspection method thereof

Country Status (4)

Country Link
JP (1) JP3976740B2 (ja)
KR (1) KR100597833B1 (ja)
CN (1) CN1657958A (ja)
TW (1) TWI248518B (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4750451B2 (ja) * 2005-04-06 2011-08-17 三菱電機株式会社 電子部品実装位置検査方法及び電子部品実装位置検査装置
KR100570276B1 (ko) * 2005-10-04 2006-04-11 (주)글로벌링크 이방성 도전필름의 압흔 검사방법
JP4711859B2 (ja) * 2006-03-02 2011-06-29 パナソニック株式会社 部品接合方法及び部品接合装置
JP4909691B2 (ja) * 2006-09-20 2012-04-04 株式会社東芝 電子部品の実装状態検査方法、電子部品の実装状態検査装置及び電子機器の製造方法
JP4922800B2 (ja) 2007-03-19 2012-04-25 株式会社東芝 電子機器の製造方法
TW200848741A (en) 2007-06-15 2008-12-16 Au Optronics Corp An electro-optical apparatus and a circuit bonding detection device and detection method thereof
KR100847740B1 (ko) * 2008-01-31 2008-07-23 (주)글로벌링크 압흔검사시스템 및 압흔검사시스템의 제어방법
US7937233B2 (en) * 2008-04-17 2011-05-03 3M Innovative Properties Company Preferential defect marking on a web
KR100975832B1 (ko) * 2008-05-21 2010-08-13 윈텍 주식회사 압흔 검사장치 및 방법
JP5132610B2 (ja) * 2009-03-05 2013-01-30 株式会社東芝 電子部品の実装状態検査装置及び電子機器の製造方法
JP5307617B2 (ja) * 2009-04-27 2013-10-02 三菱電機株式会社 基板の実装状態検査方法および基板の実装状態検査装置
KR101294218B1 (ko) 2010-05-10 2013-08-07 동우 화인켐 주식회사 편광 필름 원반의 품질 판정 시스템 및 방법
JP5476262B2 (ja) * 2010-09-14 2014-04-23 積水化学工業株式会社 接続構造体及び接続構造体の製造方法
JP2012108012A (ja) * 2010-11-18 2012-06-07 Panasonic Corp 半田付け検査方法及び半田付け検査装置
JP2015179831A (ja) * 2014-02-27 2015-10-08 デクセリアルズ株式会社 接続体、接続体の製造方法及び検査方法
CN105738740A (zh) * 2016-03-29 2016-07-06 苏州市职业大学 一种基于图像定位的pcb板级emi测试方法
CN105699822A (zh) * 2016-03-29 2016-06-22 苏州市职业大学 一种基于图像定位的pcb板级emi测试装置
CN106855520B (zh) * 2017-02-10 2020-05-29 南京航空航天大学 一种基于机器视觉的工件缺陷检测方法
CN107621602B (zh) * 2017-08-15 2020-04-03 大族激光科技产业集团股份有限公司 集成电路芯片载板的测试方法
CN107526194A (zh) * 2017-08-15 2017-12-29 大连益盛达智能科技有限公司 全自动aoi粒子压痕检测机
JP7012575B2 (ja) * 2018-03-22 2022-01-28 芝浦メカトロニクス株式会社 検査装置及び検査方法
KR102113057B1 (ko) * 2018-09-19 2020-06-02 (주)제이스텍 도전성 필름부착시 압흔검사 색상표시 방법
CN110517614B (zh) * 2019-08-28 2022-11-22 苏州精速智能科技有限公司 一种液晶模组导电粒子不良的检测方法
JP7546823B2 (ja) * 2019-11-15 2024-09-09 義晴 加藤 電子部品検査装置及び電子部品検査方法
WO2023100697A1 (ja) 2021-11-30 2023-06-08 デクセリアルズ株式会社 異方性導電フィルム
CN114324360A (zh) * 2021-12-31 2022-04-12 深圳鼎晶科技有限公司 一种aoi压痕检测系统及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259700A (ja) * 1992-03-12 1993-10-08 Taiyo Yuden Co Ltd 回路基板検査装置
KR0179758B1 (ko) * 1995-06-26 1999-04-01 이희종 인쇄회로기판상의 부품 실장 상태 검사 방법
KR0169848B1 (ko) * 1995-10-31 1999-04-15 배순훈 화상 처리를 이용한 부품 흡착불량 검사 방법
KR20000013220U (ko) * 1998-12-24 2000-07-15 구자홍 비전 시스템
JP2000252332A (ja) 1999-02-26 2000-09-14 Hitachi Ltd 半導体および類似デバイスの検査システム

Also Published As

Publication number Publication date
CN1657958A (zh) 2005-08-24
JP3976740B2 (ja) 2007-09-19
KR100597833B1 (ko) 2006-07-06
JP2005227217A (ja) 2005-08-25
KR20050081830A (ko) 2005-08-19
TW200528734A (en) 2005-09-01

Similar Documents

Publication Publication Date Title
TWI248518B (en) Substrate inspection device and inspection method thereof
CN201145788Y (zh) Lcd/lcm自动光学检测装置
JP4909691B2 (ja) 電子部品の実装状態検査方法、電子部品の実装状態検査装置及び電子機器の製造方法
CN106651857B (zh) 一种印刷电路板贴片缺陷检测方法
TWI483325B (zh) A stitch check device, a probe device and a stitch check method, and a memory medium
TW201346251A (zh) 焊料檢查用之檢查基準登錄方法及使用該方法的基板檢查裝置
KR20180095972A (ko) 이중 스캔방식을 지원하는 고속 자동 광학 검사 장치
JP2011158363A (ja) Ｐｇａ実装基板の半田付け検査装置
KR101980755B1 (ko) 표시패널의 색감차 얼룩 자동 검사 장치 및 방법
JP4898828B2 (ja) 凝集判定方法
JP2009282010A (ja) 圧痕検査装置及び方法
JP2024520368A (ja) フィルム異物高速自動検出装置
CN105136818B (zh) 印刷基板的影像检测方法
KR100673392B1 (ko) 필름, 테이프 형태의 인쇄회로기판 외관 검사에서의 과검출방지를 위한 시스템 및 그 처리 방법
JP2007121315A (ja) 基板検査装置及び検査方法
KR101111383B1 (ko) 3차원 표면 형상 측정부가 구비되는 압흔 검사시스템
JP4052733B2 (ja) パターン付きウエハの異物検査方法
JP5307617B2 (ja) 基板の実装状態検査方法および基板の実装状態検査装置
JP2010204041A (ja) 電子部品の実装状態検査装置及び電子機器の製造方法
JP3722052B2 (ja) 半導体チップ実装用パッド部の評価方法及びその装置
JP4750451B2 (ja) 電子部品実装位置検査方法及び電子部品実装位置検査装置
JP2018137413A (ja) 接合状態検査装置、接合状態検査方法および接合状態検査プログラム
JP2018124076A (ja) 接合状態検査装置、接合状態検査方法および接合状態検査プログラム
JP4909215B2 (ja) 検査方法および装置
JPS61164145A (ja) 合わせガラスの検査装置