TWI237320B - Cutting method of substrate and cutting apparatus of the same - Google Patents

Cutting method of substrate and cutting apparatus of the same Download PDF

Info

Publication number
TWI237320B
TWI237320B TW093102648A TW93102648A TWI237320B TW I237320 B TWI237320 B TW I237320B TW 093102648 A TW093102648 A TW 093102648A TW 93102648 A TW93102648 A TW 93102648A TW I237320 B TWI237320 B TW I237320B
Authority
TW
Taiwan
Prior art keywords
cutting
substrate
machine
aforementioned
sealed substrate
Prior art date
Application number
TW093102648A
Other languages
English (en)
Chinese (zh)
Other versions
TW200425309A (en
Inventor
Tomoki Ueyama
Yasuhiro Iwata
Shinobu Hashimoto
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200425309A publication Critical patent/TW200425309A/zh
Application granted granted Critical
Publication of TWI237320B publication Critical patent/TWI237320B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41C—CORSETS; BRASSIERES
    • A41C3/00—Brassieres
    • A41C3/12—Component parts
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41B—SHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
    • A41B9/00—Undergarments
    • A41B9/16—Shoulder-straps forming part of the undergarments
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41F—GARMENT FASTENINGS; SUSPENDERS
    • A41F15/00—Shoulder or like straps

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW093102648A 2003-05-09 2004-02-05 Cutting method of substrate and cutting apparatus of the same TWI237320B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003131761A JP4162535B2 (ja) 2003-05-09 2003-05-09 封止済基板の切断方法及び装置

Publications (2)

Publication Number Publication Date
TW200425309A TW200425309A (en) 2004-11-16
TWI237320B true TWI237320B (en) 2005-08-01

Family

ID=33506855

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102648A TWI237320B (en) 2003-05-09 2004-02-05 Cutting method of substrate and cutting apparatus of the same

Country Status (3)

Country Link
JP (1) JP4162535B2 (ja)
KR (1) KR100593135B1 (ja)
TW (1) TWI237320B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200089A (ja) * 2008-02-19 2009-09-03 Towa Corp 基板の切断方法及び装置
JP5312857B2 (ja) 2008-06-30 2013-10-09 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP5457660B2 (ja) * 2008-11-07 2014-04-02 アピックヤマダ株式会社 切断方法及び切断装置
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6143668B2 (ja) 2013-12-28 2017-06-07 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法
KR101474752B1 (ko) * 2013-12-31 2014-12-30 엠에스테크놀러지 주식회사 비트 이동경로 자동설정 방법 및 장치
KR101447127B1 (ko) * 2013-12-31 2014-10-07 엠에스테크놀러지 주식회사 비트 이동경로 자동설정 방법
JP6235391B2 (ja) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
KR101633083B1 (ko) * 2015-12-31 2016-06-23 (주)래딕스 인쇄회로기판 라우팅 장치
JP6912745B1 (ja) * 2019-09-27 2021-08-04 株式会社東京精密 ダイシング装置及び方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152432A (ja) * 1991-11-29 1993-06-18 Nec Kansai Ltd フルオートダイサ
JPH0663780A (ja) * 1992-08-20 1994-03-08 Nkk Corp レーザー切断設備
JP2988621B2 (ja) 1996-10-18 1999-12-13 ユーエイチティー株式会社 切断加工装置
JP2001121481A (ja) 1999-10-28 2001-05-08 Nec Machinery Corp プリント基板切断装置
KR100428945B1 (ko) * 2001-06-22 2004-04-28 (주)네온테크 반도체 웨이퍼 쏘잉 장치

Also Published As

Publication number Publication date
TW200425309A (en) 2004-11-16
JP2004335862A (ja) 2004-11-25
KR100593135B1 (ko) 2006-06-26
JP4162535B2 (ja) 2008-10-08
KR20040096765A (ko) 2004-11-17

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MM4A Annulment or lapse of patent due to non-payment of fees