TWI236965B - Film adhering method and device - Google Patents

Film adhering method and device Download PDF

Info

Publication number
TWI236965B
TWI236965B TW092114756A TW92114756A TWI236965B TW I236965 B TWI236965 B TW I236965B TW 092114756 A TW092114756 A TW 092114756A TW 92114756 A TW92114756 A TW 92114756A TW I236965 B TWI236965 B TW I236965B
Authority
TW
Taiwan
Prior art keywords
film
substrate
pressing roller
roller
adhered
Prior art date
Application number
TW092114756A
Other languages
English (en)
Chinese (zh)
Other versions
TW200415003A (en
Inventor
Koji Hironaka
Fumiaki Numajiri
Katsuyoshi Watanabe
Takeshi Ishida
Takeshi Fujii
Original Assignee
Hitachi Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ind Co Ltd filed Critical Hitachi Ind Co Ltd
Publication of TW200415003A publication Critical patent/TW200415003A/zh
Application granted granted Critical
Publication of TWI236965B publication Critical patent/TWI236965B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1875—Tensioning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B2037/1063—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using an electrostatic force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/021—Treatment by energy or chemical effects using electrical effects
    • B32B2310/025—Electrostatic charges

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW092114756A 2003-02-07 2003-05-30 Film adhering method and device TWI236965B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003030264A JP3774701B2 (ja) 2003-02-07 2003-02-07 フィルム貼付方法及び装置

Publications (2)

Publication Number Publication Date
TW200415003A TW200415003A (en) 2004-08-16
TWI236965B true TWI236965B (en) 2005-08-01

Family

ID=32957200

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092114756A TWI236965B (en) 2003-02-07 2003-05-30 Film adhering method and device

Country Status (4)

Country Link
JP (1) JP3774701B2 (ja)
KR (1) KR100550649B1 (ja)
CN (1) CN1307033C (ja)
TW (1) TWI236965B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780559B2 (ja) * 2005-12-14 2011-09-28 株式会社日立プラントテクノロジー フィルム貼付方法およびその装置
JP2007245438A (ja) * 2006-03-15 2007-09-27 Hitachi Plant Technologies Ltd フィルム貼付方法とその装置
KR100749152B1 (ko) * 2006-05-09 2007-08-14 (주)화백엔지니어링 필름 리와인드 장치
KR100743398B1 (ko) * 2006-06-13 2007-08-02 (주)두일알에스 패널의 라미네이팅 장치 및 방법
JP5015824B2 (ja) * 2008-02-29 2012-08-29 日東電工株式会社 粘着フィルム位置検出器および粘着フィルム貼付装置
KR20130127950A (ko) * 2012-05-15 2013-11-25 시바우라 메카트로닉스 가부시끼가이샤 테이프 부재의 공급 장치, 점착 테이프의 접착 장치 및 테이프 부재의 공급 방법
US9067374B2 (en) * 2012-11-30 2015-06-30 The Boeing Company Method and apparatus for applying film material to elongate members
CN104210693A (zh) * 2014-08-26 2014-12-17 浙江万江木业有限公司 一种专用于胶合板的贴膜装置
JP5885813B1 (ja) * 2014-12-03 2016-03-16 日東電工株式会社 光学的表示装置の製造方法及び製造装置
CN107949180B (zh) * 2017-12-18 2020-03-24 厦门市铂联科技股份有限公司 一种fpc覆盖膜方法及装置
JP7020189B2 (ja) * 2018-03-02 2022-02-16 トヨタ自動車株式会社 フィルム搬送装置、フィルム搬送方法、及びフィルム貼付け装置
CN108556333B (zh) * 2018-06-15 2024-03-26 嘉兴市品鼎电器有限公司 一种led灯导光板的覆膜装置
CN110884110B (zh) * 2019-11-27 2024-08-02 肇庆宏旺金属实业有限公司 贴膜机
CN111438927A (zh) * 2020-04-21 2020-07-24 徐州优元防静电设备有限公司 一种除静电式贴膜机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115864U (ja) * 1982-01-27 1983-08-08 三菱電機株式会社 車両用充電発電機
DE9200625U1 (de) * 1992-01-21 1993-05-19 Robert Bosch Gmbh, 7000 Stuttgart Anschlußdeckel für Elektrokraftstoffpumpe
US5207562A (en) * 1992-04-30 1993-05-04 The Marley Company Submersible pump with handle providing electrical connection and oil port
JP3046550B2 (ja) * 1996-08-29 2000-05-29 東海興業株式会社 ケース一体コネクタ、及びその成形方法
JP3463641B2 (ja) * 2000-01-21 2003-11-05 株式会社デンソー 圧力検出装置の製造方法

Also Published As

Publication number Publication date
KR100550649B1 (ko) 2006-02-08
CN1519095A (zh) 2004-08-11
TW200415003A (en) 2004-08-16
KR20040073934A (ko) 2004-08-21
JP3774701B2 (ja) 2006-05-17
JP2004237636A (ja) 2004-08-26
CN1307033C (zh) 2007-03-28

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MM4A Annulment or lapse of patent due to non-payment of fees