TWI233147B - Chamber and associated methods for wafer processing - Google Patents

Chamber and associated methods for wafer processing Download PDF

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Publication number
TWI233147B
TWI233147B TW093107840A TW93107840A TWI233147B TW I233147 B TWI233147 B TW I233147B TW 093107840 A TW093107840 A TW 093107840A TW 93107840 A TW93107840 A TW 93107840A TW I233147 B TWI233147 B TW I233147B
Authority
TW
Taiwan
Prior art keywords
wafer
volume
pressure
fluid
plate
Prior art date
Application number
TW093107840A
Other languages
English (en)
Chinese (zh)
Other versions
TW200425243A (en
Inventor
John Parks
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/404,502 external-priority patent/US7153388B2/en
Priority claimed from US10/404,472 external-priority patent/US7392815B2/en
Priority claimed from US10/404,402 external-priority patent/US7357115B2/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200425243A publication Critical patent/TW200425243A/zh
Application granted granted Critical
Publication of TWI233147B publication Critical patent/TWI233147B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093107840A 2003-03-31 2004-03-23 Chamber and associated methods for wafer processing TWI233147B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/404,502 US7153388B2 (en) 2003-03-31 2003-03-31 Chamber for high-pressure wafer processing and method for making the same
US10/404,472 US7392815B2 (en) 2003-03-31 2003-03-31 Chamber for wafer cleaning and method for making the same
US10/404,402 US7357115B2 (en) 2003-03-31 2003-03-31 Wafer clamping apparatus and method for operating the same

Publications (2)

Publication Number Publication Date
TW200425243A TW200425243A (en) 2004-11-16
TWI233147B true TWI233147B (en) 2005-05-21

Family

ID=33303846

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107840A TWI233147B (en) 2003-03-31 2004-03-23 Chamber and associated methods for wafer processing

Country Status (7)

Country Link
EP (1) EP1609174B1 (enExample)
JP (1) JP4560040B2 (enExample)
KR (3) KR101121938B1 (enExample)
AT (1) ATE535935T1 (enExample)
MY (2) MY142891A (enExample)
TW (1) TWI233147B (enExample)
WO (1) WO2004093166A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732306B (zh) * 2015-10-04 2021-07-01 美商應用材料股份有限公司 減低容積的處理腔室
US11424137B2 (en) 2015-10-04 2022-08-23 Applied Materials, Inc. Drying process for high aspect ratio features

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8323420B2 (en) 2005-06-30 2012-12-04 Lam Research Corporation Method for removing material from semiconductor wafer and apparatus for performing the same
US8544483B2 (en) 2005-04-01 2013-10-01 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
JP4861016B2 (ja) * 2006-01-23 2012-01-25 株式会社東芝 処理装置
CN101484974B (zh) 2006-07-07 2013-11-06 Fsi国际公司 用于处理微电子工件的设备和方法以及遮挡结构
KR20100031681A (ko) 2007-05-18 2010-03-24 브룩스 오토메이션 인코퍼레이티드 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR20110005699A (ko) 2008-05-09 2011-01-18 에프에스아이 인터내쇼날 인크. 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법
JP5655735B2 (ja) * 2011-07-26 2015-01-21 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2731950B2 (ja) 1989-07-13 1998-03-25 キヤノン株式会社 露光方法
EP0463853B1 (en) 1990-06-29 1998-11-04 Canon Kabushiki Kaisha Vacuum chuck
US5960555A (en) 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US6032997A (en) * 1998-04-16 2000-03-07 Excimer Laser Systems Vacuum chuck
WO2000005750A1 (en) 1998-07-23 2000-02-03 Applied Materials, Inc. Improved substrate support member
US6279976B1 (en) 1999-05-13 2001-08-28 Micron Technology, Inc. Wafer handling device having conforming perimeter seal
KR100750018B1 (ko) * 2000-07-26 2007-08-16 동경 엘렉트론 주식회사 반도체 기판의 처리를 위한 고압 챔버 및 반도체 기판의고압 처리를 위한 장치
US6716084B2 (en) * 2001-01-11 2004-04-06 Nutool, Inc. Carrier head for holding a wafer and allowing processing on a front face thereof to occur
US6684523B2 (en) * 2001-08-27 2004-02-03 Applied Materials, Inc. Particle removal apparatus
US20030047551A1 (en) * 2001-09-13 2003-03-13 Worm Steven Lee Guard heater and pressure chamber assembly including the same
JP3960462B2 (ja) * 2001-09-17 2007-08-15 大日本スクリーン製造株式会社 基板処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732306B (zh) * 2015-10-04 2021-07-01 美商應用材料股份有限公司 減低容積的處理腔室
US11133174B2 (en) 2015-10-04 2021-09-28 Applied Materials, Inc. Reduced volume processing chamber
US11424137B2 (en) 2015-10-04 2022-08-23 Applied Materials, Inc. Drying process for high aspect ratio features

Also Published As

Publication number Publication date
WO2004093166A2 (en) 2004-10-28
KR101071603B1 (ko) 2011-10-10
KR101121938B1 (ko) 2012-03-14
EP1609174A2 (en) 2005-12-28
ATE535935T1 (de) 2011-12-15
MY141406A (en) 2010-04-30
KR101121937B1 (ko) 2012-03-14
JP2007524990A (ja) 2007-08-30
TW200425243A (en) 2004-11-16
KR20110028540A (ko) 2011-03-18
JP4560040B2 (ja) 2010-10-13
EP1609174B1 (en) 2011-11-30
KR20050118226A (ko) 2005-12-15
KR20110028541A (ko) 2011-03-18
WO2004093166A3 (en) 2005-01-06
MY142891A (en) 2011-01-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees