JP2007524990A5 - - Google Patents
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- Publication number
- JP2007524990A5 JP2007524990A5 JP2006507529A JP2006507529A JP2007524990A5 JP 2007524990 A5 JP2007524990 A5 JP 2007524990A5 JP 2006507529 A JP2006507529 A JP 2006507529A JP 2006507529 A JP2006507529 A JP 2006507529A JP 2007524990 A5 JP2007524990 A5 JP 2007524990A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- space
- fluid
- plate
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 claims description 274
- 239000012530 fluid Substances 0.000 claims description 254
- 238000000034 method Methods 0.000 claims description 77
- 238000004140 cleaning Methods 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 23
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 655
- 239000000463 material Substances 0.000 description 20
- 238000012546 transfer Methods 0.000 description 16
- 230000001276 controlling effect Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000011109 contamination Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 239000012768 molten material Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 101150082661 MFM1 gene Proteins 0.000 description 2
- 101100401327 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mfm2 gene Proteins 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 101500020766 Sus scrofa FS-303 Proteins 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Chemical group 0.000 description 1
- 239000002002 slurry Chemical group 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/404,472 US7392815B2 (en) | 2003-03-31 | 2003-03-31 | Chamber for wafer cleaning and method for making the same |
| US10/404,402 US7357115B2 (en) | 2003-03-31 | 2003-03-31 | Wafer clamping apparatus and method for operating the same |
| US10/404,502 US7153388B2 (en) | 2003-03-31 | 2003-03-31 | Chamber for high-pressure wafer processing and method for making the same |
| PCT/US2004/008994 WO2004093166A2 (en) | 2003-03-31 | 2004-03-23 | Chamber and associated methods for wafer processing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007524990A JP2007524990A (ja) | 2007-08-30 |
| JP2007524990A5 true JP2007524990A5 (enExample) | 2009-11-26 |
| JP4560040B2 JP4560040B2 (ja) | 2010-10-13 |
Family
ID=33303846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006507529A Expired - Fee Related JP4560040B2 (ja) | 2003-03-31 | 2004-03-23 | ウエハ処理のためのチャンバおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1609174B1 (enExample) |
| JP (1) | JP4560040B2 (enExample) |
| KR (3) | KR101121938B1 (enExample) |
| AT (1) | ATE535935T1 (enExample) |
| MY (2) | MY141406A (enExample) |
| TW (1) | TWI233147B (enExample) |
| WO (1) | WO2004093166A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8323420B2 (en) * | 2005-06-30 | 2012-12-04 | Lam Research Corporation | Method for removing material from semiconductor wafer and apparatus for performing the same |
| KR101255048B1 (ko) | 2005-04-01 | 2013-04-16 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치 |
| JP4861016B2 (ja) * | 2006-01-23 | 2012-01-25 | 株式会社東芝 | 処理装置 |
| JP2009543338A (ja) | 2006-07-07 | 2009-12-03 | エフエスアイ インターナショナル インコーポレーテッド | １つ以上の処理流体によりマイクロエレクトロニクス半製品を処理するために用いられる道具において使われる隔壁構造およびノズル装置 |
| JP5543336B2 (ja) | 2007-05-18 | 2014-07-09 | ブルックス オートメーション インコーポレイテッド | 高速スワップロボット付コンパクト基板搬送システム |
| US8235062B2 (en) | 2008-05-09 | 2012-08-07 | Fsi International, Inc. | Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation |
| JP5655735B2 (ja) * | 2011-07-26 | 2015-01-21 | 東京エレクトロン株式会社 | 処理装置、処理方法及び記憶媒体 |
| KR102062873B1 (ko) | 2015-10-04 | 2020-01-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 작은 열 질량의 가압 챔버 |
| CN116206947A (zh) | 2015-10-04 | 2023-06-02 | 应用材料公司 | 缩减空间的处理腔室 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2731950B2 (ja) * | 1989-07-13 | 1998-03-25 | キヤノン株式会社 | 露光方法 |
| EP0463853B1 (en) * | 1990-06-29 | 1998-11-04 | Canon Kabushiki Kaisha | Vacuum chuck |
| US5960555A (en) * | 1996-07-24 | 1999-10-05 | Applied Materials, Inc. | Method and apparatus for purging the back side of a substrate during chemical vapor processing |
| US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
| US6032997A (en) * | 1998-04-16 | 2000-03-07 | Excimer Laser Systems | Vacuum chuck |
| WO2000005750A1 (en) * | 1998-07-23 | 2000-02-03 | Applied Materials, Inc. | Improved substrate support member |
| US6279976B1 (en) * | 1999-05-13 | 2001-08-28 | Micron Technology, Inc. | Wafer handling device having conforming perimeter seal |
| JP4724353B2 (ja) * | 2000-07-26 | 2011-07-13 | 東京エレクトロン株式会社 | 半導体基板のための高圧処理チャンバー |
| US6716084B2 (en) * | 2001-01-11 | 2004-04-06 | Nutool, Inc. | Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
| US6684523B2 (en) * | 2001-08-27 | 2004-02-03 | Applied Materials, Inc. | Particle removal apparatus |
| US20030047551A1 (en) * | 2001-09-13 | 2003-03-13 | Worm Steven Lee | Guard heater and pressure chamber assembly including the same |
| JP3960462B2 (ja) * | 2001-09-17 | 2007-08-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2004
- 2004-03-23 KR KR1020117002991A patent/KR101121938B1/ko not_active Expired - Fee Related
- 2004-03-23 AT AT04758931T patent/ATE535935T1/de active
- 2004-03-23 KR KR1020117002990A patent/KR101121937B1/ko not_active Expired - Fee Related
- 2004-03-23 WO PCT/US2004/008994 patent/WO2004093166A2/en not_active Ceased
- 2004-03-23 TW TW093107840A patent/TWI233147B/zh not_active IP Right Cessation
- 2004-03-23 JP JP2006507529A patent/JP4560040B2/ja not_active Expired - Fee Related
- 2004-03-23 EP EP04758931A patent/EP1609174B1/en not_active Expired - Lifetime
- 2004-03-31 MY MYPI20071693A patent/MY141406A/en unknown
- 2004-03-31 MY MYPI20041174A patent/MY142891A/en unknown
-
2005
- 2005-09-30 KR KR1020057018809A patent/KR101071603B1/ko not_active Expired - Fee Related
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