TWI232487B - Methods for making microwave circuits - Google Patents

Methods for making microwave circuits Download PDF

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Publication number
TWI232487B
TWI232487B TW093107127A TW93107127A TWI232487B TW I232487 B TWI232487 B TW I232487B TW 093107127 A TW093107127 A TW 093107127A TW 93107127 A TW93107127 A TW 93107127A TW I232487 B TWI232487 B TW I232487B
Authority
TW
Taiwan
Prior art keywords
dielectric
thick film
layer
deposited
conductor
Prior art date
Application number
TW093107127A
Other languages
English (en)
Chinese (zh)
Other versions
TW200501205A (en
Inventor
John F Casey
Lewis R Dove
Ling Liu
James R Drehle
R Frederick Rau Jr
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200501205A publication Critical patent/TW200501205A/zh
Application granted granted Critical
Publication of TWI232487B publication Critical patent/TWI232487B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW093107127A 2003-06-19 2004-03-17 Methods for making microwave circuits TWI232487B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/600,143 US6953698B2 (en) 2003-06-19 2003-06-19 Methods for making microwave circuits

Publications (2)

Publication Number Publication Date
TW200501205A TW200501205A (en) 2005-01-01
TWI232487B true TWI232487B (en) 2005-05-11

Family

ID=33517678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107127A TWI232487B (en) 2003-06-19 2004-03-17 Methods for making microwave circuits

Country Status (4)

Country Link
US (3) US6953698B2 (enExample)
JP (1) JP2005012811A (enExample)
CN (1) CN1574451A (enExample)
TW (1) TWI232487B (enExample)

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US7022251B2 (en) * 2003-06-19 2006-04-04 Agilent Technologies, Inc. Methods for forming a conductor on a dielectric
US6953698B2 (en) * 2003-06-19 2005-10-11 Agilent Technologies, Inc. Methods for making microwave circuits
US8710523B2 (en) * 2006-08-11 2014-04-29 E I Du Pont De Nemours And Company Device chip carriers, modules, and methods of forming thereof
US8129266B2 (en) * 2008-07-09 2012-03-06 Semiconductor Componenets Industries, LLC Method of forming a shielded semiconductor device and structure therefor
US8171617B2 (en) * 2008-08-01 2012-05-08 Cts Corporation Method of making a waveguide
DE102009023848B4 (de) 2009-06-04 2021-10-28 Giesecke+Devrient Mobile Security Gmbh Verfahren zur drucktechnischen Herstellung einer elektrischen Leiterbahn
US8823470B2 (en) 2010-05-17 2014-09-02 Cts Corporation Dielectric waveguide filter with structure and method for adjusting bandwidth
US9030279B2 (en) 2011-05-09 2015-05-12 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US9130256B2 (en) 2011-05-09 2015-09-08 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US9030278B2 (en) 2011-05-09 2015-05-12 Cts Corporation Tuned dielectric waveguide filter and method of tuning the same
US9130255B2 (en) 2011-05-09 2015-09-08 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US9130258B2 (en) 2013-09-23 2015-09-08 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US10116028B2 (en) 2011-12-03 2018-10-30 Cts Corporation RF dielectric waveguide duplexer filter module
US9583805B2 (en) 2011-12-03 2017-02-28 Cts Corporation RF filter assembly with mounting pins
US9666921B2 (en) 2011-12-03 2017-05-30 Cts Corporation Dielectric waveguide filter with cross-coupling RF signal transmission structure
US10050321B2 (en) 2011-12-03 2018-08-14 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
WO2015157510A1 (en) 2014-04-10 2015-10-15 Cts Corporation Rf duplexer filter module with waveguide filter assembly
US11081769B2 (en) 2015-04-09 2021-08-03 Cts Corporation RF dielectric waveguide duplexer filter module
US10483608B2 (en) 2015-04-09 2019-11-19 Cts Corporation RF dielectric waveguide duplexer filter module
TWI732753B (zh) * 2015-05-13 2021-07-11 日商新力股份有限公司 傳送線路
CN209104338U (zh) * 2016-07-29 2019-07-12 株式会社村田制作所 传输线路以及电子设备
CN106998627B (zh) * 2017-05-26 2020-06-05 盐城天锐先锋电子科技有限公司 一种pcb阻抗板的设计方法
US11437691B2 (en) 2019-06-26 2022-09-06 Cts Corporation Dielectric waveguide filter with trap resonator
CN114999752B (zh) * 2022-05-27 2024-07-19 广东新成科技实业有限公司 一种基于半导体材料的ntc贴片热敏电阻及其制备方法
CN117525786A (zh) * 2022-07-29 2024-02-06 华为技术有限公司 传输线组件、印制电路板组件、电子设备

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US3808042A (en) 1970-06-05 1974-04-30 Owens Illinois Inc Multilayer dielectric
US4303480A (en) 1977-08-01 1981-12-01 General Dynamics, Pomona Division Electroplating of thick film circuitry
DE3616723A1 (de) 1986-05-17 1987-11-19 Philips Patentverwaltung Mikrowellenbaustein
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US4857420A (en) * 1987-10-13 1989-08-15 International Fuel Cell Corporation Method of making monolithic solid oxide fuel cell stack
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
JP2569805B2 (ja) * 1989-06-02 1997-01-08 三菱電機株式会社 半導体製造装置
JPH04267586A (ja) * 1991-02-22 1992-09-24 Nec Corp 同軸配線パターンおよびその形成方法
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Also Published As

Publication number Publication date
US6953698B2 (en) 2005-10-11
US7265043B2 (en) 2007-09-04
US20050191412A1 (en) 2005-09-01
US20040257194A1 (en) 2004-12-23
CN1574451A (zh) 2005-02-02
TW200501205A (en) 2005-01-01
JP2005012811A (ja) 2005-01-13
US20060286722A1 (en) 2006-12-21
US7125752B2 (en) 2006-10-24

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MM4A Annulment or lapse of patent due to non-payment of fees