CN1574451A - 制造微波电路的方法 - Google Patents

制造微波电路的方法 Download PDF

Info

Publication number
CN1574451A
CN1574451A CNA200410037202XA CN200410037202A CN1574451A CN 1574451 A CN1574451 A CN 1574451A CN A200410037202X A CNA200410037202X A CN A200410037202XA CN 200410037202 A CN200410037202 A CN 200410037202A CN 1574451 A CN1574451 A CN 1574451A
Authority
CN
China
Prior art keywords
dielectric
thick film
dielectrics
conductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200410037202XA
Other languages
English (en)
Chinese (zh)
Inventor
约翰·F·凯西
刘易斯·R·达夫
玲·刘
詹姆斯·R·德雷赫莱
小弗雷德里克·R·劳
罗斯玛丽·O·约翰逊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of CN1574451A publication Critical patent/CN1574451A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CNA200410037202XA 2003-06-19 2004-04-22 制造微波电路的方法 Pending CN1574451A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/600,143 US6953698B2 (en) 2003-06-19 2003-06-19 Methods for making microwave circuits
US10/600,143 2003-06-19

Publications (1)

Publication Number Publication Date
CN1574451A true CN1574451A (zh) 2005-02-02

Family

ID=33517678

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200410037202XA Pending CN1574451A (zh) 2003-06-19 2004-04-22 制造微波电路的方法

Country Status (4)

Country Link
US (3) US6953698B2 (enExample)
JP (1) JP2005012811A (enExample)
CN (1) CN1574451A (enExample)
TW (1) TWI232487B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022251B2 (en) * 2003-06-19 2006-04-04 Agilent Technologies, Inc. Methods for forming a conductor on a dielectric
US6953698B2 (en) * 2003-06-19 2005-10-11 Agilent Technologies, Inc. Methods for making microwave circuits
US8710523B2 (en) * 2006-08-11 2014-04-29 E I Du Pont De Nemours And Company Device chip carriers, modules, and methods of forming thereof
US8129266B2 (en) * 2008-07-09 2012-03-06 Semiconductor Componenets Industries, LLC Method of forming a shielded semiconductor device and structure therefor
US8171617B2 (en) * 2008-08-01 2012-05-08 Cts Corporation Method of making a waveguide
DE102009023848B4 (de) 2009-06-04 2021-10-28 Giesecke+Devrient Mobile Security Gmbh Verfahren zur drucktechnischen Herstellung einer elektrischen Leiterbahn
US8823470B2 (en) 2010-05-17 2014-09-02 Cts Corporation Dielectric waveguide filter with structure and method for adjusting bandwidth
US9030279B2 (en) 2011-05-09 2015-05-12 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US9130256B2 (en) 2011-05-09 2015-09-08 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US9030278B2 (en) 2011-05-09 2015-05-12 Cts Corporation Tuned dielectric waveguide filter and method of tuning the same
US9130255B2 (en) 2011-05-09 2015-09-08 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US9130258B2 (en) 2013-09-23 2015-09-08 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
US10116028B2 (en) 2011-12-03 2018-10-30 Cts Corporation RF dielectric waveguide duplexer filter module
US9583805B2 (en) 2011-12-03 2017-02-28 Cts Corporation RF filter assembly with mounting pins
US9666921B2 (en) 2011-12-03 2017-05-30 Cts Corporation Dielectric waveguide filter with cross-coupling RF signal transmission structure
US10050321B2 (en) 2011-12-03 2018-08-14 Cts Corporation Dielectric waveguide filter with direct coupling and alternative cross-coupling
WO2015157510A1 (en) 2014-04-10 2015-10-15 Cts Corporation Rf duplexer filter module with waveguide filter assembly
US11081769B2 (en) 2015-04-09 2021-08-03 Cts Corporation RF dielectric waveguide duplexer filter module
US10483608B2 (en) 2015-04-09 2019-11-19 Cts Corporation RF dielectric waveguide duplexer filter module
TWI732753B (zh) * 2015-05-13 2021-07-11 日商新力股份有限公司 傳送線路
CN209104338U (zh) * 2016-07-29 2019-07-12 株式会社村田制作所 传输线路以及电子设备
CN106998627B (zh) * 2017-05-26 2020-06-05 盐城天锐先锋电子科技有限公司 一种pcb阻抗板的设计方法
US11437691B2 (en) 2019-06-26 2022-09-06 Cts Corporation Dielectric waveguide filter with trap resonator
CN114999752B (zh) * 2022-05-27 2024-07-19 广东新成科技实业有限公司 一种基于半导体材料的ntc贴片热敏电阻及其制备方法
CN117525786A (zh) * 2022-07-29 2024-02-06 华为技术有限公司 传输线组件、印制电路板组件、电子设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3536793A (en) * 1968-02-07 1970-10-27 Atomic Energy Commission Method of making porous metal carbide agglomerates
US3808042A (en) 1970-06-05 1974-04-30 Owens Illinois Inc Multilayer dielectric
US4303480A (en) 1977-08-01 1981-12-01 General Dynamics, Pomona Division Electroplating of thick film circuitry
DE3616723A1 (de) 1986-05-17 1987-11-19 Philips Patentverwaltung Mikrowellenbaustein
US4808274A (en) 1986-09-10 1989-02-28 Engelhard Corporation Metallized substrates and process for producing
US4857420A (en) * 1987-10-13 1989-08-15 International Fuel Cell Corporation Method of making monolithic solid oxide fuel cell stack
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
JP2569805B2 (ja) * 1989-06-02 1997-01-08 三菱電機株式会社 半導体製造装置
JPH04267586A (ja) * 1991-02-22 1992-09-24 Nec Corp 同軸配線パターンおよびその形成方法
SE468573B (sv) * 1991-06-14 1993-02-08 Ericsson Telefon Ab L M Anordningar med boejliga, ytorienterade striplineledningar samt foerfarande foer framstaellning av en saadan anordning
JP3241139B2 (ja) * 1993-02-04 2001-12-25 三菱電機株式会社 フィルムキャリア信号伝送線路
KR100371877B1 (ko) * 1997-04-16 2003-02-11 가부시끼가이샤 도시바 배선기판과 배선기판의 제조방법 및 반도체 패키지
US5910334A (en) 1997-12-16 1999-06-08 Delco Electronics Corporation Method of manufacture for a thick film multi-layer circuit
US6000120A (en) * 1998-04-16 1999-12-14 Motorola, Inc. Method of making coaxial transmission lines on a printed circuit board
US20010012692A1 (en) 1998-10-30 2001-08-09 Robin L. Miller Thick-film etch-back process for use in manufacturing fine-line hybrid circuits
US6255730B1 (en) 1999-04-30 2001-07-03 Agilent Technologies, Inc. Integrated low cost thick film RF module
FR2806529B1 (fr) * 2000-03-14 2005-03-04 St Microelectronics Sa Procede d'ajustage d'un parametre electrique sur un composant electronique integre
US7052824B2 (en) * 2000-06-30 2006-05-30 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
US6420778B1 (en) * 2001-06-01 2002-07-16 Aralight, Inc. Differential electrical transmission line structures employing crosstalk compensation and related methods
US6457979B1 (en) 2001-10-29 2002-10-01 Agilent Technologies, Inc. Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate
US7456488B2 (en) * 2002-11-21 2008-11-25 Advanced Technology Materials, Inc. Porogen material
US7423166B2 (en) * 2001-12-13 2008-09-09 Advanced Technology Materials, Inc. Stabilized cyclosiloxanes for use as CVD precursors for low-dielectric constant thin films
US6953698B2 (en) 2003-06-19 2005-10-11 Agilent Technologies, Inc. Methods for making microwave circuits
US20040258841A1 (en) * 2003-06-19 2004-12-23 Casey John F. Methods for depositing a thickfilm dielectric on a substrate
US7022251B2 (en) * 2003-06-19 2006-04-04 Agilent Technologies, Inc. Methods for forming a conductor on a dielectric

Also Published As

Publication number Publication date
US6953698B2 (en) 2005-10-11
US7265043B2 (en) 2007-09-04
US20050191412A1 (en) 2005-09-01
US20040257194A1 (en) 2004-12-23
TWI232487B (en) 2005-05-11
TW200501205A (en) 2005-01-01
JP2005012811A (ja) 2005-01-13
US20060286722A1 (en) 2006-12-21
US7125752B2 (en) 2006-10-24

Similar Documents

Publication Publication Date Title
CN1574451A (zh) 制造微波电路的方法
JP2002261189A (ja) 高周波用回路チップ及びその製造方法
CN1446377A (zh) 电子元件及其制造方法
CN1685507A (zh) 带有适合射频应用的导体结构的元件的制造方法
CN1508868A (zh) 半导体器件及其制造方法
JP2007335871A (ja) 無収縮セラミック基板の製造方法
JPH1056060A (ja) 半導体装置の製造方法
CN103534802A (zh) 用于高频应用的低温共烧陶瓷结构及其制造方法
CN1574411A (zh) 在衬底上沉积厚膜电介质的方法
JP4423025B2 (ja) 多層基板及びその製造方法
US7022251B2 (en) Methods for forming a conductor on a dielectric
JPH0794848A (ja) 導体層パターンの形成方法
JP2004055728A (ja) 積層型セラミック電子部品およびその製造方法
CN115938803B (zh) 一种射频薄膜电容器的制备方法
JP4416346B2 (ja) 回路基板の製造方法
CN1144289C (zh) 一种晶片排阻端面电极的制作方法
JPH06268376A (ja) 多層回路基板の製造方法
JP2002231860A (ja) 電子部品装置
JP2001057471A (ja) 薄膜配線基板の製造方法
JP2565351B2 (ja) 電子回路部品
JP2000031278A (ja) 半導体装置の製造方法
JPH08307061A (ja) マルチチップモジュール用多層配線板及びその製造方法
JP3483240B2 (ja) セラミック電子部品の製造方法
JP2004056148A (ja) 銅ペースト及びそれを用いた配線基板
JP2003051647A (ja) セラミック回路基板及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication