TWD240926S - 基板處理裝置用隔熱板 - Google Patents

基板處理裝置用隔熱板

Info

Publication number
TWD240926S
TWD240926S TW112306478F TW112306478F TWD240926S TW D240926 S TWD240926 S TW D240926S TW 112306478 F TW112306478 F TW 112306478F TW 112306478 F TW112306478 F TW 112306478F TW D240926 S TWD240926 S TW D240926S
Authority
TW
Taiwan
Prior art keywords
substrate processing
thermal insulation
processing equipment
insulation board
item
Prior art date
Application number
TW112306478F
Other languages
English (en)
Chinese (zh)
Inventor
岡嶋優作
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD240926S publication Critical patent/TWD240926S/zh

Links

TW112306478F 2023-06-12 2023-12-11 基板處理裝置用隔熱板 TWD240926S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-012019 2023-01-30
JP2023012019F JP1760960S (index.php) 2023-06-12 2023-06-12

Publications (1)

Publication Number Publication Date
TWD240926S true TWD240926S (zh) 2025-10-11

Family

ID=89452058

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112306478F TWD240926S (zh) 2023-06-12 2023-12-11 基板處理裝置用隔熱板

Country Status (3)

Country Link
US (1) USD1112115S1 (index.php)
JP (1) JP1760960S (index.php)
TW (1) TWD240926S (index.php)

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785919B2 (ja) * 1990-11-30 1995-09-20 ソマール株式会社 断熱板
JP3494554B2 (ja) * 1997-06-26 2004-02-09 東芝セラミックス株式会社 半導体用治具およびその製造方法
US7325692B2 (en) * 2002-11-26 2008-02-05 Disco Corporation Cassette having separation plates for storing a plurality of semiconductor wafers
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
JP4748193B2 (ja) * 2008-09-01 2011-08-17 ソニー株式会社 非水電解質二次電池の絶縁板、非水電解質二次電池および非水電解質二次電池の絶縁板の製造方法
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
JP6318301B2 (ja) * 2015-02-25 2018-04-25 株式会社日立国際電気 基板処理装置、ヒータおよび半導体装置の製造方法
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
JP1624353S (index.php) 2018-07-19 2019-02-12
USD979506S1 (en) * 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
JP1700781S (ja) * 2021-03-22 2021-11-29 基板処理装置用断熱板
JP1706320S (index.php) * 2021-06-28 2022-01-31
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
JP1733769S (index.php) * 2022-08-10 2023-01-06

Also Published As

Publication number Publication date
USD1112115S1 (en) 2026-02-10
JP1760960S (index.php) 2024-01-10

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