TWD232416S - 基板處理裝置用熱處理容器 - Google Patents

基板處理裝置用熱處理容器 Download PDF

Info

Publication number
TWD232416S
TWD232416S TW112303654F TW112303654F TWD232416S TW D232416 S TWD232416 S TW D232416S TW 112303654 F TW112303654 F TW 112303654F TW 112303654 F TW112303654 F TW 112303654F TW D232416 S TWD232416 S TW D232416S
Authority
TW
Taiwan
Prior art keywords
heat treatment
treatment container
substrate processing
processing equipment
heat
Prior art date
Application number
TW112303654F
Other languages
English (en)
Chinese (zh)
Inventor
保井毅
油谷幸則
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD232416S publication Critical patent/TWD232416S/zh

Links

TW112303654F 2023-02-15 2023-07-21 基板處理裝置用熱處理容器 TWD232416S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023002895F JP1760956S (index.php) 2023-02-15 2023-02-15
JP2023-002895 2023-02-15

Publications (1)

Publication Number Publication Date
TWD232416S true TWD232416S (zh) 2024-07-21

Family

ID=89452045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112303654F TWD232416S (zh) 2023-02-15 2023-07-21 基板處理裝置用熱處理容器

Country Status (3)

Country Link
US (1) USD1112114S1 (index.php)
JP (1) JP1760956S (index.php)
TW (1) TWD232416S (index.php)

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1801187B1 (de) * 1968-10-04 1970-04-16 Siemens Ag Vorrichtung zur Waermebehandlung von Siliziumscheiben
US4849608A (en) * 1987-02-14 1989-07-18 Dainippon Screen Mfg. Co., Ltd. Apparatus for heat-treating wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
US5772770A (en) * 1995-01-27 1998-06-30 Kokusai Electric Co, Ltd. Substrate processing apparatus
US6002109A (en) * 1995-07-10 1999-12-14 Mattson Technology, Inc. System and method for thermal processing of a semiconductor substrate
US6276072B1 (en) * 1997-07-10 2001-08-21 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
JPH1154496A (ja) * 1997-08-07 1999-02-26 Tokyo Electron Ltd 熱処理装置及びガス処理装置
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6185370B1 (en) * 1998-09-09 2001-02-06 Tokyo Electron Limited Heating apparatus for heating an object to be processed
KR100634642B1 (ko) * 1998-11-20 2006-10-16 스티그 알티피 시스템즈, 인코포레이티드 반도체 웨이퍼의 급속 가열 및 냉각 장치
TW430866B (en) * 1998-11-26 2001-04-21 Tokyo Electron Ltd Thermal treatment apparatus
US6307184B1 (en) * 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
USD437333S1 (en) * 1999-11-30 2001-02-06 Applied Materials, Inc. Process chamber tray
AU2003257112A1 (en) * 2002-09-10 2004-04-30 Fsi International, Inc. Thermal process station with heated lid
US7554103B2 (en) * 2006-06-26 2009-06-30 Applied Materials, Inc. Increased tool utilization/reduction in MWBC for UV curing chamber
TWD122456S1 (zh) * 2006-10-10 2008-04-11 東京威力科創股份有限公司 半導體製造用腔室本體
USD735255S1 (en) * 2013-12-24 2015-07-28 The Yankee Candle Company, Inc. Heater dish and wax cup for electric wax melting system
KR101710944B1 (ko) * 2015-09-11 2017-02-28 주식회사 유진테크 기판처리장치
JP1611626S (index.php) 2017-01-20 2018-08-20
USD911402S1 (en) * 2019-07-18 2021-02-23 Illinois Tool Works Inc. Chamber
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
JP1768280S (ja) * 2023-06-20 2024-04-16 縦型熱処理装置の電極部材
USD1079931S1 (en) * 2023-06-20 2025-06-17 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1080853S1 (en) * 2023-06-20 2025-06-24 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1079908S1 (en) * 2023-06-20 2025-06-17 Nippon Electrode Co., Ltd. Heat-resistant tube for vertical heat treatment equipment
USD1089130S1 (en) * 2024-01-19 2025-08-19 Applied Materials, Inc. Process chamber manifold

Also Published As

Publication number Publication date
USD1112114S1 (en) 2026-02-10
JP1760956S (index.php) 2024-01-10

Similar Documents

Publication Publication Date Title
TWD215398S (zh) 基板處理腔室的製程護罩
TWD210894S (zh) 用於基材處理室的處理遮罩件
TWD214316S (zh) 基板處理腔室的內部護罩
TWD217686S (zh) 用於半導體處理腔室的沉積環
TWD215697S (zh) 用於基板處理腔室的限制襯墊
TWD216287S (zh) 電子裝置之蓋
TWD203444S (zh) 基板處理裝置用氣體導入管
TWD211363S (zh) 基板載具
TWD197466S (zh) 基板處理裝置用隔熱板
TWD234854S (zh) 鞋面
TWD202463S (zh) 基板處理裝置用晶舟之部分
TWD211239S (zh) 晶圓保持器之部分
TWD218093S (zh) 基板處理裝置用晶舟之部分
TWD209150S (zh) 基座軸
TWD210557S (zh) 熱製程用承載盤
TWD209927S (zh) 光罩傳送盒之上蓋
TWD232416S (zh) 基板處理裝置用熱處理容器
TWD209793S (zh) 半導體晶圓架
TWD225036S (zh) 基板處理裝置用隔熱板
TWD209426S (zh) 光罩傳送盒之底座
TWD203479S (zh) 基板處理裝置用入口蓋
TWD225634S (zh) 半導體製造裝置用隔熱組件外罩之部分
TWD211387S (zh) 用於基板處理腔室的下屏蔽件
TWD223179S (zh) 用品罩蓋
TWD208042S (zh) 等離子體處理裝置用容器