TWD225633S - 半導體製造裝置用隔熱組件外罩 - Google Patents

半導體製造裝置用隔熱組件外罩 Download PDF

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Publication number
TWD225633S
TWD225633S TW110306502F TW110306502F TWD225633S TW D225633 S TWD225633 S TW D225633S TW 110306502 F TW110306502 F TW 110306502F TW 110306502 F TW110306502 F TW 110306502F TW D225633 S TWD225633 S TW D225633S
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TW
Taiwan
Prior art keywords
heat
manufacturing equipment
semiconductor manufacturing
shielding component
component covers
Prior art date
Application number
TW110306502F
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English (en)
Chinese (zh)
Inventor
岡嶋優作
Original Assignee
日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD225633S publication Critical patent/TWD225633S/zh

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TW110306502F 2021-06-28 2021-11-30 半導體製造裝置用隔熱組件外罩 TWD225633S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021014030F JP1706320S (enrdf_load_stackoverflow) 2021-06-28 2021-06-28
JP2021-014030 2021-06-28

Publications (1)

Publication Number Publication Date
TWD225633S true TWD225633S (zh) 2023-06-01

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Family Applications (1)

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TW110306502F TWD225633S (zh) 2021-06-28 2021-11-30 半導體製造裝置用隔熱組件外罩

Country Status (3)

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US (1) USD1003834S1 (enrdf_load_stackoverflow)
JP (1) JP1706320S (enrdf_load_stackoverflow)
TW (1) TWD225633S (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1733769S (enrdf_load_stackoverflow) * 2022-08-10 2023-01-06

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD210787S (zh) 2020-05-28 2021-04-01 曾仁安 插銷

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD413659S (en) * 1996-09-09 1999-09-07 Swartz Mitchell R Immersion apparatus to heat a solution
USD407696S (en) * 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD615936S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
JP5645718B2 (ja) * 2011-03-07 2014-12-24 東京エレクトロン株式会社 熱処理装置
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD694711S1 (en) * 2012-03-23 2013-12-03 Mitsubishi Electric Corporation Insulator for vacuum circuit breaker
JP1565116S (enrdf_load_stackoverflow) 2016-02-10 2016-12-12
JP1564810S (enrdf_load_stackoverflow) * 2016-02-10 2016-12-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD210787S (zh) 2020-05-28 2021-04-01 曾仁安 插銷

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Publication number Publication date
USD1003834S1 (en) 2023-11-07
JP1706320S (enrdf_load_stackoverflow) 2022-01-31

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