JP1733769S - - Google Patents

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Publication number
JP1733769S
JP1733769S JP2022017170F JP2022017170F JP1733769S JP 1733769 S JP1733769 S JP 1733769S JP 2022017170 F JP2022017170 F JP 2022017170F JP 2022017170 F JP2022017170 F JP 2022017170F JP 1733769 S JP1733769 S JP 1733769S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022017170F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2022017170F priority Critical patent/JP1733769S/ja
Application granted granted Critical
Publication of JP1733769S publication Critical patent/JP1733769S/ja
Priority to TW110305062D01F priority patent/TWD236269S/zh
Priority to US29/883,098 priority patent/USD1053157S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022017170F 2022-08-10 2022-08-10 Active JP1733769S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022017170F JP1733769S (enrdf_load_stackoverflow) 2022-08-10 2022-08-10
TW110305062D01F TWD236269S (zh) 2022-08-10 2023-01-10 基板處理裝置用反射板
US29/883,098 USD1053157S1 (en) 2022-08-10 2023-01-24 Heat reflector for semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022017170F JP1733769S (enrdf_load_stackoverflow) 2022-08-10 2022-08-10

Publications (1)

Publication Number Publication Date
JP1733769S true JP1733769S (enrdf_load_stackoverflow) 2023-01-06

Family

ID=84601522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022017170F Active JP1733769S (enrdf_load_stackoverflow) 2022-08-10 2022-08-10

Country Status (3)

Country Link
US (1) USD1053157S1 (enrdf_load_stackoverflow)
JP (1) JP1733769S (enrdf_load_stackoverflow)
TW (1) TWD236269S (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1746404S (ja) * 2023-01-11 2023-06-15 サセプタカバーベース

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US6035100A (en) * 1997-05-16 2000-03-07 Applied Materials, Inc. Reflector cover for a semiconductor processing chamber
US6108491A (en) * 1998-10-30 2000-08-22 Applied Materials, Inc. Dual surface reflector
WO2002072343A1 (fr) * 2001-03-08 2002-09-19 Shin-Etsu Handotai Co., Ltd. Materiau reflechissant la chaleur et dispositif de rechauffement utilisant ce materiau
KR100621777B1 (ko) * 2005-05-04 2006-09-15 삼성전자주식회사 기판 열처리 장치
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
TWD174921S (zh) * 2014-12-17 2016-04-11 日本碍子股份有限公司 複合基板之部分
JP1565116S (enrdf_load_stackoverflow) * 2016-02-10 2016-12-12
US10283637B2 (en) * 2016-07-18 2019-05-07 Taiwan Semiconductor Manufacturing Co, Ltd. Individually-tunable heat reflectors in an EPI-growth system
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
JP1624353S (enrdf_load_stackoverflow) 2018-07-19 2019-02-12
JP1700781S (ja) * 2021-03-22 2021-11-29 基板処理装置用断熱板
JP1706320S (enrdf_load_stackoverflow) * 2021-06-28 2022-01-31

Also Published As

Publication number Publication date
TWD236269S (zh) 2025-02-11
USD1053157S1 (en) 2024-12-03

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