USD1003834S1 - Heat insulator cover of semiconductor manufacturing apparatus - Google Patents

Heat insulator cover of semiconductor manufacturing apparatus Download PDF

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Publication number
USD1003834S1
USD1003834S1 US29/820,708 US202129820708F USD1003834S US D1003834 S1 USD1003834 S1 US D1003834S1 US 202129820708 F US202129820708 F US 202129820708F US D1003834 S USD1003834 S US D1003834S
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United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
heat insulator
insulator cover
cover
Prior art date
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US29/820,708
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English (en)
Inventor
Yusaku OKAJIMA
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAJIMA, YUSAKU
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US29/820,708 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus Active USD1003834S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021014030F JP1706320S (enrdf_load_stackoverflow) 2021-06-28 2021-06-28
JP2021-014030D 2021-06-28

Publications (1)

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USD1003834S1 true USD1003834S1 (en) 2023-11-07

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US29/820,708 Active USD1003834S1 (en) 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus

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US (1) USD1003834S1 (enrdf_load_stackoverflow)
JP (1) JP1706320S (enrdf_load_stackoverflow)
TW (1) TWD225633S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053157S1 (en) * 2022-08-10 2024-12-03 Kokusai Electric Corporation Heat reflector for semiconductor manufacturing equipment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD407696S (en) * 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD413659S (en) * 1996-09-09 1999-09-07 Swartz Mitchell R Immersion apparatus to heat a solution
USD615936S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
US20120231407A1 (en) * 2011-03-07 2012-09-13 Tokyo Electron Limited Thermal treatment apparatus
USD694711S1 (en) * 2012-03-23 2013-12-03 Mitsubishi Electric Corporation Insulator for vacuum circuit breaker
USD818960S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit of semiconductor manufacturing apparatus
USD818961S1 (en) 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD210787S (zh) 2020-05-28 2021-04-01 曾仁安 插銷

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD413659S (en) * 1996-09-09 1999-09-07 Swartz Mitchell R Immersion apparatus to heat a solution
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD407696S (en) * 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD615936S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
US20120231407A1 (en) * 2011-03-07 2012-09-13 Tokyo Electron Limited Thermal treatment apparatus
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD694711S1 (en) * 2012-03-23 2013-12-03 Mitsubishi Electric Corporation Insulator for vacuum circuit breaker
USD818960S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit of semiconductor manufacturing apparatus
USD818961S1 (en) 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053157S1 (en) * 2022-08-10 2024-12-03 Kokusai Electric Corporation Heat reflector for semiconductor manufacturing equipment

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JP1706320S (enrdf_load_stackoverflow) 2022-01-31
TWD225633S (zh) 2023-06-01

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