TWD207699S - 基板處理裝置用吸頂式加熱器的保持板 - Google Patents
基板處理裝置用吸頂式加熱器的保持板 Download PDFInfo
- Publication number
- TWD207699S TWD207699S TW108306967F TW108306967F TWD207699S TW D207699 S TWD207699 S TW D207699S TW 108306967 F TW108306967 F TW 108306967F TW 108306967 F TW108306967 F TW 108306967F TW D207699 S TWD207699 S TW D207699S
- Authority
- TW
- Taiwan
- Prior art keywords
- processing device
- substrate processing
- holding plate
- ceiling heater
- ceiling
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
Images
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-015586 | 2019-01-31 | ||
JPD2019-15586F JP1651618S (ko) | 2019-07-11 | 2019-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD207699S true TWD207699S (zh) | 2020-10-11 |
Family
ID=69183110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108306967F TWD207699S (zh) | 2019-07-11 | 2019-11-13 | 基板處理裝置用吸頂式加熱器的保持板 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD962183S1 (ko) |
JP (1) | JP1651618S (ko) |
TW (1) | TWD207699S (ko) |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD601521S1 (en) * | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
JP2008177248A (ja) * | 2007-01-16 | 2008-07-31 | Tokyo Seimitsu Co Ltd | 研磨ヘッド用リテーナリング |
USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD732094S1 (en) * | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
US20140199840A1 (en) * | 2013-01-11 | 2014-07-17 | Applied Materials, Inc. | Chemical mechanical polishing apparatus and methods |
US9227297B2 (en) * | 2013-03-20 | 2016-01-05 | Applied Materials, Inc. | Retaining ring with attachable segments |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
JP1541874S (ko) * | 2015-03-16 | 2016-01-18 | ||
US10174437B2 (en) * | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
JP1556433S (ko) * | 2015-10-06 | 2016-08-15 | ||
JP1560719S (ko) * | 2015-12-01 | 2016-10-11 | ||
JP1581406S (ko) * | 2016-10-14 | 2017-07-18 | ||
WO2018100850A1 (ja) * | 2016-12-01 | 2018-06-07 | 株式会社日立国際電気 | 基板処理装置、天井ヒータおよび半導体装置の製造方法 |
USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
KR20190008101A (ko) * | 2017-07-14 | 2019-01-23 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법 |
JP1651623S (ko) * | 2019-07-18 | 2020-01-27 | ||
USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
-
2019
- 2019-07-11 JP JPD2019-15586F patent/JP1651618S/ja active Active
- 2019-11-13 TW TW108306967F patent/TWD207699S/zh unknown
- 2019-12-27 US US29/718,671 patent/USD962183S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD962183S1 (en) | 2022-08-30 |
JP1651618S (ko) | 2020-01-27 |
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