JP1541874S - - Google Patents

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Publication number
JP1541874S
JP1541874S JPD2015-5626F JP2015005626F JP1541874S JP 1541874 S JP1541874 S JP 1541874S JP 2015005626 F JP2015005626 F JP 2015005626F JP 1541874 S JP1541874 S JP 1541874S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-5626F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-5626F priority Critical patent/JP1541874S/ja
Priority to US29/539,509 priority patent/USD797690S1/en
Application granted granted Critical
Publication of JP1541874S publication Critical patent/JP1541874S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-5626F 2015-03-16 2015-03-16 Active JP1541874S (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2015-5626F JP1541874S (ko) 2015-03-16 2015-03-16
US29/539,509 USD797690S1 (en) 2015-03-16 2015-09-15 Heater for semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-5626F JP1541874S (ko) 2015-03-16 2015-03-16

Publications (1)

Publication Number Publication Date
JP1541874S true JP1541874S (ko) 2016-01-18

Family

ID=55133697

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-5626F Active JP1541874S (ko) 2015-03-16 2015-03-16

Country Status (2)

Country Link
US (1) USD797690S1 (ko)
JP (1) JP1541874S (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
JP1581406S (ko) * 2016-10-14 2017-07-18
USD832229S1 (en) * 2017-05-26 2018-10-30 TinyPCB, Inc. Modular circuit board
USD841606S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD841605S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD839223S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839222S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD842260S1 (en) * 2017-05-30 2019-03-05 TinyPCB, Inc. Modular circuit board
USD839221S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
JP1646292S (ko) * 2019-04-24 2019-11-25
JP1651167S (ko) * 2019-04-24 2020-01-27
JP1651618S (ko) * 2019-07-11 2020-01-27
JP1651619S (ko) * 2019-07-11 2020-01-27
JP1651623S (ko) * 2019-07-18 2020-01-27
USD936187S1 (en) * 2020-02-12 2021-11-16 Applied Materials, Inc. Gas distribution assembly lid
JP1684469S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
USD1037778S1 (en) 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US1258760A (en) * 1915-07-19 1918-03-12 Thomas Bates Stove-lid.
USD313072S (en) * 1988-02-10 1990-12-18 Redring Electric Limited Electric heater element for use in a radiant heater for a glass ceramic hob
GB8924936D0 (en) * 1989-11-04 1989-12-28 Ceramaspeed Ltd Radiant electric heaters
DE19638640C2 (de) * 1996-09-21 2000-11-30 Diehl Ako Stiftung Gmbh & Co Strahlungsheizkörper mit einem Metallfolien-Heizleiter
US6037574A (en) * 1997-11-06 2000-03-14 Watlow Electric Manufacturing Quartz substrate heater
JP3477062B2 (ja) * 1997-12-26 2003-12-10 京セラ株式会社 ウエハ加熱装置
US6433317B1 (en) * 2000-04-07 2002-08-13 Watlow Polymer Technologies Molded assembly with heating element captured therein
KR100798179B1 (ko) * 2001-04-27 2008-01-24 교세라 가부시키가이샤 웨이퍼 가열장치
US6506994B2 (en) * 2001-06-15 2003-01-14 Applied Materials, Inc. Low profile thick film heaters in multi-slot bake chamber
US20030121898A1 (en) * 2001-11-26 2003-07-03 Tom Kane Heated vacuum support apparatus
JP2003317906A (ja) * 2002-04-24 2003-11-07 Sumitomo Electric Ind Ltd セラミックスヒータ
US7645342B2 (en) * 2004-11-15 2010-01-12 Cree, Inc. Restricted radiated heating assembly for high temperature processing
KR100811389B1 (ko) * 2006-03-24 2008-03-07 가부시키가이샤 뉴플레어 테크놀로지 반도체 제조 장치와 히터
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
US7777160B2 (en) * 2007-12-17 2010-08-17 Momentive Performance Materials Inc. Electrode tuning method and apparatus for a layered heater structure
JP2010080909A (ja) * 2008-08-26 2010-04-08 Nuflare Technology Inc ヒータ、半導体製造装置および半導体製造方法
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
JP5443096B2 (ja) * 2009-08-12 2014-03-19 株式会社ニューフレアテクノロジー 半導体製造装置および半導体製造方法
JP2013065792A (ja) * 2011-09-20 2013-04-11 Nuflare Technology Inc ヒータおよび成膜装置
USD716774S1 (en) * 2014-04-04 2014-11-04 Avery Dennison Corporation RFID inlay
US10237917B2 (en) * 2015-03-09 2019-03-19 Nuflare Technology, Inc. Heater and apparatus for manufacturing semiconductor device using heater

Also Published As

Publication number Publication date
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