JP1581406S - - Google Patents

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Publication number
JP1581406S
JP1581406S JPD2016-22413F JP2016022413F JP1581406S JP 1581406 S JP1581406 S JP 1581406S JP 2016022413 F JP2016022413 F JP 2016022413F JP 1581406 S JP1581406 S JP 1581406S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-22413F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-22413F priority Critical patent/JP1581406S/ja
Priority to US29/596,974 priority patent/USD826185S1/en
Priority to TW106301242F priority patent/TWD187001S/zh
Application granted granted Critical
Publication of JP1581406S publication Critical patent/JP1581406S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-22413F 2016-10-14 2016-10-14 Active JP1581406S (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2016-22413F JP1581406S (ko) 2016-10-14 2016-10-14
US29/596,974 USD826185S1 (en) 2016-10-14 2017-03-13 Ceiling heater for substrate processing apparatus
TW106301242F TWD187001S (zh) 2016-10-14 2017-03-13 基板處理裝置用頂置式加熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-22413F JP1581406S (ko) 2016-10-14 2016-10-14

Publications (1)

Publication Number Publication Date
JP1581406S true JP1581406S (ko) 2017-07-18

Family

ID=59309850

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-22413F Active JP1581406S (ko) 2016-10-14 2016-10-14

Country Status (3)

Country Link
US (1) USD826185S1 (ko)
JP (1) JP1581406S (ko)
TW (1) TWD187001S (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD918848S1 (en) 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD959393S1 (en) 2020-09-24 2022-08-02 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD980177S1 (en) 2020-09-24 2023-03-07 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1590181S (ko) * 2017-02-14 2017-11-06
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
USD921431S1 (en) 2019-04-01 2021-06-08 Veeco Instruments, Inc. Multi-filament heater assembly
JP1651618S (ko) * 2019-07-11 2020-01-27
JP1651619S (ko) * 2019-07-11 2020-01-27
USD926716S1 (en) * 2019-07-31 2021-08-03 Eryn Smith Antenna pattern for a semiconductive substrate carrier
USD913256S1 (en) * 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier
USD895587S1 (en) * 2019-10-22 2020-09-08 Avery Dennison Retail Information Services, Llc Antenna
USD954691S1 (en) 2019-10-22 2022-06-14 Avery Dennison Retail Information Services, Llc Antenna
USD922339S1 (en) * 2019-11-11 2021-06-15 Asia Vital Components Co., Ltd. Radiating fin
USD922340S1 (en) * 2019-11-11 2021-06-15 Asia Vita Components Co., Ltd. Radiating fin
USD922341S1 (en) * 2019-11-11 2021-06-15 Asia Vital Components Co., Ltd. Radiating fin
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD980199S1 (en) * 2020-12-17 2023-03-07 Megabyte Limited Antenna for radio frequency tag reader
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4328009B2 (ja) * 2000-11-30 2009-09-09 日本碍子株式会社 加熱装置
CN100435269C (zh) * 2001-07-15 2008-11-19 应用材料有限公司 处理系统
JP4276813B2 (ja) * 2002-03-26 2009-06-10 株式会社日立国際電気 熱処理装置および半導体製造方法
JP2004200619A (ja) * 2002-12-20 2004-07-15 Kyocera Corp ウエハ支持部材
JP4380236B2 (ja) * 2003-06-23 2009-12-09 東京エレクトロン株式会社 載置台及び熱処理装置
US7645342B2 (en) * 2004-11-15 2010-01-12 Cree, Inc. Restricted radiated heating assembly for high temperature processing
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
JP5814005B2 (ja) * 2011-06-21 2015-11-17 芝浦メカトロニクス株式会社 ヒータユニット、ファンフィルタユニット及び基板処理装置
US9267739B2 (en) * 2012-07-18 2016-02-23 Applied Materials, Inc. Pedestal with multi-zone temperature control and multiple purge capabilities
US9719629B2 (en) * 2014-04-08 2017-08-01 Plansee Se Supporting system for a heating element and heating system
JP1541874S (ko) * 2015-03-16 2016-01-18
JP1560719S (ko) * 2015-12-01 2016-10-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD918848S1 (en) 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD959393S1 (en) 2020-09-24 2022-08-02 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD980177S1 (en) 2020-09-24 2023-03-07 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus

Also Published As

Publication number Publication date
USD826185S1 (en) 2018-08-21
TWD187001S (zh) 2017-12-01

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